ATSAMD21E17L-MNT - ARM Cortex-M0+ MCU, 48MHz, 128KB Flash | Microchip
Артикул: ATSAMD21E17L-MNT ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $3.92 | $3,92 |
| 10 | $3.65 | $36,50 |
| 100 | $3.21 | $321,00 |
| 500 | $2.78 | $1.390,00 |
| 1.000 | $2.45 | $2.450,00 |
ATSAMD21E17L-MNT Обзор
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), working memory (SRAM), and a configurable mix of digital and analog peripherals. ARM Cortex-M0+ cores target energy-efficient deterministic control; the SAM D21 line in particular belongs to the broader hierarchy: ARM Cortex-M0+ -> Cortex-M family -> 32-bit RISC core -> embedded MCU -> semiconductor. The 'SAM D' sub-family emphasizes low-power sleep modes, event-driven peripherals, and a unified peripheral bus, making the part a frequent choice for battery-aware and always-listening designs.
Key features include six SERCOM instances (each configurable as USART, I2C, or SPI), a 12-bit 350 ksps ADC with up to 10 channels, a 10-bit 350 ksps DAC, two analog comparators, a 24-channel event system, and a Real-Time Clock with calendar mode. The integrated Full-Speed USB 2.0 transceiver with on-chip pull-up and 8 endpoint FIFOs eliminates the need for an external PHY in HID, CDC, or vendor-class designs. Cryptographic and touch sensing IP (Cortex-M0+ plus PTC) is supplemented by the SAM D21E Functional Safety (FuSa) feature set, with built-in self-test hooks on analog and clock subsystems.
Typical applications include IoT sensor nodes, BLE/LoRa host controllers, home-automation HMI panels, industrial sensor hubs, low-power wearable health devices, lighting-control modules (per the Mouser descriptive text), and USB peripherals such as HID keypads and CDC bridges. The wide 1.62-3.63 V operating range allows direct Li-coin or 2xAA cell operation, while the QFN-32 footprint (5x5 mm) keeps board area small for space-constrained designs.
When designing with the ATSAMD21E17L-MNT, place the decoupling capacitor network (typically a 100 nF X7R plus a 4.7 µF bulk) within 2 mm of the VDD pins and route the 32 kHz crystal traces symmetrically and short to minimize load-capacitance drift. Use Microchip's Atmel START or MPLAB X with the DFP (Device Family Pack) to generate the peripheral configuration, and rely on the built-in event system instead of ISR-driven I/O to keep wake-from-sleep latency below 1.5 µs.
Аналоги без доработки для ATSAMD21E17L-MNT — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с ATSAMD21E17L-MNT (тот же форм-фактор и посадочное место) — отличается по Package, ADC, USB, Operating Temperature Range, DAC.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
ATSAMD21E17L-MN
✅ Прямая замена✓ В наличии
$1.85 / шт.
Открыть даташит →ATSAMD21E17L-MFT
✅ Прямая замена✓ В наличии
$2.05 / шт.
Открыть даташит →ATSAMD21E17L-AFT
✅ Прямая замена✓ В наличии
$2.7 / шт.
Открыть даташит →ATSAMD21E17A-MU
✅ Прямая замена✓ В наличии
$2.18 / шт.
Открыть даташит →ATSAMD21E17A-MFT
✅ Прямая замена✓ В наличии
$2.55 / шт.
Открыть даташит →ATSAMD21E17A-AU
✅ Прямая замена✓ В наличии
$2.3 / шт.
Открыть даташит →ATSAMD21E17L-MNT Максимальные параметры и электрические характеристики
| Core Architecture | ARM Cortex-M0+ (32-bit) |
| CPU Clock Speed | 48 MHz |
| Program Flash Memory | 128 KB |
| SRAM | 16 KB |
| RWW Section (EEPROM emulation) | 4 KB |
| Operating Voltage Range | 1.62 V to 3.63 V |
| Диапазон рабочих температур | -40 °C to +105 °C |
| Корпус | 32-pin QFN (5x5 mm) |
| Тип монтажа | Surface Mount (Tape & Reel) |
| ADC | 12-bit, up to 10 channels, 350 ksps |
| DAC | 10-bit, 350 ksps |
| Analog Comparators | 2 |
| SERCOM Modules | 6 (each configurable as USART/I2C/SPI) |
| USB | Full-Speed USB 2.0 Device & Host, on-chip transceiver |
| RTC | 32-bit Real-Time Counter with calendar mode |
| Timers/Counters | TC x6, TCC x3 |
| Event System Channels | 24 |
| Статус RoHS | Compliant |
Конфигурация выводов ATSAMD21E17L-MNT
| Контакт 1 | PA00 — I/O (SERCOM1 PAD0 / TCC2 WO0) |
| Контакт 2 | PA01 — I/O (SERCOM1 PAD1 / ADC AIN1) |
| Контакт 3 | PA02 — I/O (SERCOM0 PAD0 / ADC AIN0 / DAC VOUT) |
| Контакт 4 | PA03 — I/O (SERCOM0 PAD1 / ADC AIN1 / VREFA) |
| Контакт 5 | GND — Ground |
| Контакт 6 | VDD — Digital supply 1.62-3.63 V |
| Контакт 7 | VDDIO — I/O supply (tie to VDD) |
| Контакт 8 | PA05 — I/O (SERCOM0 PAD1 / ADC AIN5) |
| Контакт 9 | PA06 — I/O (SERCOM0 PAD2 / ADC AIN6) |
| Контакт 10 | PA07 — I/O (SERCOM0 PAD3 / ADC AIN7) |
| Контакт 11 | PA08 — I/O (SERCOM2 PAD0 / USB VBUS sense) |
| Контакт 12 | PA09 — I/O (SERCOM2 PAD1 / USB DM) |
| Контакт 13 | PA10 — I/O (SERCOM2 PAD2 / USB DP) |
| Контакт 14 | PA11 — I/O (SERCOM2 PAD3) |
| Контакт 15 | GND — Ground |
| Контакт 16 | VDD — Digital supply |
| Контакт 17 | PA14 — I/O (SERCOM4 PAD2 / XIN32) |
| Контакт 18 | PA15 — I/O (SERCOM4 PAD3 / XOUT32) |
| Контакт 19 | PA16 — I/O (SERCOM1 PAD0 / I2S SDO) |
| Контакт 20 | PA17 — I/O (SERCOM1 PAD1 / I2S SDI) |
| Контакт 21 | PA18 — I/O (SERCOM3 PAD0) |
| Контакт 22 | PA19 — I/O (SERCOM3 PAD1) |
| Контакт 23 | PA20 — I/O (SERCOM3 PAD2) |
| Контакт 24 | PA21 — I/O (SERCOM3 PAD3) |
| Контакт 25 | PA22 — I/O (SERCOM5 PAD0 / I2S FS) |
| Контакт 26 | PA23 — I/O (SERCOM5 PAD1 / I2S SCK) |
| Контакт 27 | PA24 — I/O (USB SOF / TC5) |
| Контакт 28 | PA25 — I/O (SERCOM5 PAD3) |
| Контакт 29 | GND — Ground (also exposed pad) |
| Контакт 30 | VDD — Digital supply |
| Контакт 31 | PA27 — I/O (SERCOM1 PAD3 / SWDIO) |
| Контакт 32 | RESET — Active-low reset (also SWCLK) |
Типичное применение
ATSAMD21E17L-MNT подходит для 6 применениеs: IoT Wireless Sensor Node, USB HID / CDC Peripheral Device, Home Automation Lighting Controller, Industrial Sensor Hub / PLC Module, Low-Power Wearable Health Device, HMI Touch Keypad with LCD.
IoT Wireless Sensor Node
The ATSAMD21E17L-MNT fits wireless sensor nodes because its 48 MHz Cortex-M0+ core executes BLE/LoRaWAN host stacks in under 32 KB of Flash while leaving 96 KB for application code. The 6-channel, 12-bit 350 ksps ADC samples temperature, humidity, and gas sensors directly, while six SERCOM ports drive I2C sensors and an external SPI radio. Operating from 1.62-3.63 V lets the MCU run directly from a Li-coin or 2xAA cell stack, and SleepWalking peripherals plus the 24-channel event system keep average current below 4 µA in duty-cycled deployments.
Рекомендуется
USB HID / CDC Peripheral Device
The on-chip Full-Speed USB 2.0 transceiver with 8 endpoints and integrated pull-up resistor makes the ATSAMD21E17L-MNT ideal for USB keyboards, CDC serial bridges, vendor-class instruments, and HID game controllers. The 48 MHz Cortex-M0+ executes USB stacks such as the ASF USB framework with sub-µs interrupt latency, while the 128 KB Flash fits CDC + HID + bootloader in a single image. The 32-pin QFN (5x5 mm) footprint preserves board area for compact dongles, and the 1.62-3.63 V range permits bus-powered 5 V→3.3 V LDO designs without a separate core regulator.
Рекомендуется
Home Automation Lighting Controller
The 6 SERCOM instances and three TC/TCC timer/counter blocks let the ATSAMD21E17L-MNT drive multiple PWM LED channels, DMX512 links, and 0-10 V dimming interfaces simultaneously. The 12-bit DAC outputs 0-10 V analog dim, while the analog comparators implement zero-cross detection for TRIAC phase control. Operating temperature of -40 °C to +105 °C suits sealed luminaires and outdoor fixtures. The 128 KB Flash fits Zigbee 3.0 or Matter-over-Thread host logic alongside lighting control firmware in single-chip designs.
Рекомендуется
Industrial Sensor Hub / PLC Module
Industrial sensor hubs benefit from the ATSAMD21E17L-MNT's 24-channel event system, which routes ADC-completed and timer-overflow events to DMA without CPU wake-up, reducing deterministic latency to under 1.5 µs. The 12-bit 350 ksps ADC handles 4-20 mA loop sensing via external shunt, while RS-485 and CAN-FD links ride on SERCOM instances. The -40 °C to +105 °C temperature grade and 32-QFN (5x5 mm) footprint suit DIN-rail PLC expansion modules, and the 128 KB Flash fits Modbus RTU/TCP firmware stacks.
Рекомендуется
Low-Power Wearable Health Device
Wearable health monitors leverage the ATSAMD21E17L-MNT's Sleep modes (Idle, Standby, Backup) that drop quiescent current below 1.5 µA in Backup, with RTC wake-up bringing the core back in 1.2 ms. The 12-bit ADC samples PPG, ECG, or galvanic-skin-response signals at 350 ksps, while the built-in 10-bit DAC drives haptics or bio-impedance stimulus. The 1.62-3.63 V VDD range accepts a single Li-coin cell directly, and the 32-QFN (5x5 mm) outline fits wristbands and patch-form-factor designs.
Рекомендуется
HMI Touch Keypad with LCD
Touch-enabled HMIs use the SAM D21's built-in Peripheral Touch Controller (PTC) for self- and mutual-capacitance buttons, sliders, and wheels without an external touch IC. The 6 SERCOM peripherals drive an SPI TFT or I2C OLED display while one TCC generates the backlight PWM. The 128 KB Flash fits LVGL or emWin graphics stacks, and the 16 KB SRAM buffers full-frame redraws. The 48 MHz Cortex-M0+ plus DMA delivers fluid 30 fps UI updates with sub-5 mA active current on the 32-QFN (5x5 mm) package.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для ATSAMD21E17L-MNT — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | ATSAMD21E17L-MN | ATSAMD21E17L-MFT | ATSAMD21E17A-MU | ATSAMD21E16B-MU |
|---|---|---|---|---|---|
| Package | 32-QFN (5x5 mm) | 32-QFN (5x5 mm) - same | 32-QFN (5x5 mm) - same | 32-QFN (5x5 mm) - same | 32-QFN (5x5 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M0+ 48 MHz | ARM Cortex-M0+ 48 MHz | ARM Cortex-M0+ 48 MHz | ARM Cortex-M0+ 48 MHz | ARM Cortex-M0+ 48 MHz |
| Flash Memory | 128 KB | 128 KB | 128 KB | 128 KB | 64 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 8 KB |
| Operating Voltage | 1.62-3.63 V | 1.62-3.63 V | 1.62-3.63 V | 1.62-3.63 V | 1.62-3.63 V |
| Operating Temperature | -40 °C to +105 °C | -40 °C to +85 °C | -40 °C to +105 °C | -40 °C to +85 °C | -40 °C to +85 °C |
| USB | USB 2.0 FS Device/Host | USB 2.0 FS Device/Host | USB 2.0 FS Device/Host | USB 2.0 FS Device/Host | USB 2.0 FS Device/Host |
| Packaging | Tape & Reel (T&R) | Tray | Tape & Reel | Tray | Tray |
Ключевые отличия
- Highest Flash capacity in ATSAMD21E QFN-32 family (против ATSAMD21E16B-MU)
- Industrial -40 to +105 °C temperature grade (против ATSAMD21E17L-MN)
- On-chip Full-Speed USB 2.0 transceiver (против PIC16F721-I/SO)
Заметки по проектированию
Place a 100 nF X7R decoupling capacitor within 2 mm of each VDD pin (pins 6, 16, 30) and a single 4.7 µF X5R bulk capacitor near the package exposed pad. The SAM D21 internal LDO draws a fast transient when the 48 MHz PLL starts; insufficient bulk causes VDDIO droop and brown-out resets. For USB bus-powered designs, add a 4.7 µF capacitor on VBUS as required by the USB 2.0 specification.
Estimated: at 48 MHz active load the part draws ~7 mA at 3.3 V (≈23 mW). With the 32-QFN (5x5) theta_JA of approximately 39 °C/W (per typical Microchip QFN outlines), the junction temperature rise above ambient is below 1 °C in typical 25 °C environments, so no heatsink or copper-pour spreader is required. At +105 °C ambient the device operates within its industrial rating; verify the application note for derating guidelines at high CPU utilization.
The QFN-32 exposed pad must be soldered to a continuous ground pour on the top layer with at least 8 thermal vias to the inner ground plane for mechanical strength and thermal dissipation. Route the 32.768 kHz crystal traces (PA14/PA15) symmetrically and short to minimize load-capacitance mismatch - target trace length below 5 mm, with a ground guard on either side, and use crystal load capacitors specified in the SAM D21 datasheet (typically 12.5 pF).
Do not enable both SERCOM and USB on conflicting pins - PA24/PA25 are the USB SOF and SERCOM5 PAD3 shared function, so plan the pin map before PCB layout. The boot ROM uses PA27/SWDIO and PA30/SWCLK (PA30 multiplexed with the exposed pad on this 32-QFN variant, used here as RESET/SWCLK); ensure the SWD debugger is connected or the boot ROM will enter DFU mode if the Flash is blank.
Информация о соответствии
RoHS and lead-free per Microchip product page. Not AEC-Q100 qualified - automotive variants (ATSAMD21E17L-MFT-Q1) carry the Q1 suffix.
