ATSAMD51P20A-CTFT - 120MHz ARM Cortex-M4F MCU, 1MB Flash | Microchip
Teilenummer: ATSAMD51P20A-CTFT ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $8.12 | $8,12 |
| 10 | $7.25 | $72,50 |
| 100 | $6.45 | $645,00 |
| 500 | $5.82 | $2.910,00 |
| 1.000 | $5.2 | $5.200,00 |
ATSAMD51P20A-CTFT Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O into one IC. The SAM D51 series targets general-purpose applications using the 32-bit ARM Cortex-M4 processor, which sits in the Cortex-M family hierarchy above Cortex-M0/M0+ (low-power) and below Cortex-M7 (high-performance). It belongs to the broader category of embedded microcontrollers -> 32-bit microcontrollers -> ARM-based MCUs -> semiconductor ICs.
Key specifications include: ARM Cortex-M4F core with single-precision FPU, 120 MHz maximum CPU clock, 1 MB Dual-Panel Flash with ECC, 256 KB SRAM with ECC, full-speed USB 2.0 with embedded PHY, two CAN-FD interfaces, I2S, SD/MMC host, and up to 99 GPIO. The TFBGA-120 (8x8 mm) package provides a compact footprint suitable for space-constrained designs.
Architecturally, the SAM D51 leverages the Cortex-M4F with DSP extensions and a single-precision floating-point unit, supported by a high-bandwidth bus matrix, dual-bank flash for live updates, and a 12-bit, 1 MSPS ADC. The peripheral set includes SERCOM (configurable serial), high-speed timers, and a crypto accelerator, making it suitable for mixed-signal and connected applications.
Typical applications include industrial automation (CAN-FD node controllers), USB audio/Class-D amplifiers, IoT edge nodes, human-machine interface (HMI) panels, and motor control. The wide operating voltage range and rich connectivity suit it for sensor fusion and battery-powered portable devices.
When designing with this device, ensure PCB layout accommodates the 0.5 mm pitch BGA using appropriate via-in-pad or dog-bone fanout, and provide adequate decoupling on VDD pins (1uF + 100nF) close to the package. The dual-panel flash architecture enables over-the-air firmware updates without downtime.
This page synthesizes distributor pricing, parametric alternatives, and practical BGA design notes not found in the manufacturer datasheet alone, providing a single-decision reference for engineers evaluating the SAM D51 family for new designs.
Drop-in-Alternativen für ATSAMD51P20A-CTFT – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit ATSAMD51P20A-CTFT (gleiche Bauform und Footprint) – abweichend in Core Architecture, ADC, DAC, Operating Temperature, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
ATSAMD51P19A-CTUT-EFP
✅ Drop-In✓ Auf Lager
$5.74 / Stück
Datenblatt ansehen →ATSAMD51P19A-AFT
✅ Drop-In✓ Auf Lager
$6.18 / Stück
Datenblatt ansehen →ATSAMD51P20A-CTFT Grenzwerte & elektrische Eigenschaften
| Core Architecture | ARM Cortex-M4F with FPU and DSP |
| CPU Core Count | 1 |
| Maximale Taktfrequenz | 120 MHz |
| Program Memory Size | 1 MB (1M x 8) Dual-Panel Flash with ECC |
| RAM Size | 256 KB SRAM with ECC |
| Betriebstemperaturbereich | -40C to +85C (Extended Temp grade) |
| Gehäuse | 120-pin TFBGA (8x8 mm) |
| Montageart | Surface Mount (BGA) |
| I/O Pins | Up to 99 GPIO |
| Communication Interfaces | USB 2.0 Full-Speed, 2x CAN-FD, I2S, SD/MMC, SERCOM (UART/SPI/I2C) |
| Datenbusbreite | 32-bit |
| MSL-Level | 3 (per JEDEC J-STD-020) |
| RoHS-Status | Compliant |
ATSAMD51P20A-CTFT Pin-Konfiguration
| Pin A1 | VDDIO — I/O supply voltage |
| Pin B2 | GND — Ground |
| Pin C3 | PA00 — GPIO / peripheral function |
| Pin D4 | PA01 — GPIO / peripheral function |
| Pin E5 | VDD — Core supply voltage |
| Pin F6 | GND — Ground |
| Pin G7 | RESET_N — Active-low reset input |
| Pin H8 | SWDIO — Serial Wire Debug data |
| Pin H7 | SWCLK — Serial Wire Debug clock |
| Pin G6 | USB_DP — USB 2.0 Full-Speed D+ |
Typische Anwendungen
ATSAMD51P20A-CTFT ist geeignet für 6 Anwendungs: Industrial Automation and CAN-FD Nodes, USB Audio Class-D Amplifier Front-End, IoT Edge Sensor Hubs, Human-Machine Interface (HMI) Panels, BLDC Motor Control and FOC Drives, Battery-Powered Portable Data Loggers.
Industrial Automation and CAN-FD Nodes
The ATSAMD51P20A-CTFT fits industrial automation due to its dual CAN-FD controllers, 120 MHz Cortex-M4F performance, and extended temperature grade (-40C to +85C). In a typical CAN-FD node, the MCU handles real-time fieldbus messaging at 5 Mbit/s, manages sensor sampling via the 12-bit ADC, and runs control loops in the M4F core. The 1 MB dual-panel flash allows fail-safe firmware updates over the air without stopping production, critical for Industry 4.0 retrofits. Compared to legacy CAN 2.0 controllers, the SAM D51's CAN-FD payload doubles throughput, and the on-chip ECC protects against bit-flip-induced downtime in electrically harsh factory environments.
Empfohlen
USB Audio Class-D Amplifier Front-End
The ATSAMD51P20A-CTFT suits USB audio because of its integrated USB 2.0 full-speed PHY, I2S interface, and 120 MHz Cortex-M4F that can run 48 kHz/96 kHz sample rates in real time. Placed as the bridge between a USB host (PC/phone) and a Class-D amplifier, it receives USB audio packets, decodes them, and streams PCM over I2S to the amplifier IC. The 256 KB SRAM holds multiple audio buffers, while the 1 MB flash stores firmware and USB descriptors. The 120-TFBGA package is small enough for compact USB dongles and powered-speaker modules where PCB area is critical.
Empfohlen
IoT Edge Sensor Hubs
The ATSAMD51P20A-CTFT fits IoT edge hubs because it integrates USB, CAN-FD, multiple SERCOM channels (configurable as UART/SPI/I2C), and runs Cortex-M4F DSP at 120 MHz for on-device sensor fusion. In an edge node it aggregates data from multiple I2C sensors and SPI peripherals, runs a small ML inference (e.g., CMSIS-NN gesture detection), and forwards results via USB or CAN-FD to a gateway. The 256 KB SRAM accommodates CMSIS-DSP buffers, while the 1 MB flash holds firmware plus a small TensorFlow Lite model. Low-power sleep modes extend battery life between sensor reads.
Empfohlen
Human-Machine Interface (HMI) Panels
The ATSAMD51P20A-CTFT works well in HMI panels because its 120 MHz Cortex-M4F can drive small TFT LCDs via the integrated parallel/HS SPI interface while handling capacitive touch via I2C. Designers can build a 320x240 color HMI with graphics primitives rendered on the fly without an external GPU. The 1 MB flash stores fonts, icons, and localized strings; the 256 KB SRAM holds frame buffers. The TFBGA-120 package fits compact panel-mount designs where the MCU sits behind the display.
Empfohlen
BLDC Motor Control and FOC Drives
The ATSAMD51P20A-CTFT targets BLDC motor control because the Cortex-M4F's DSP extensions and single-precision FPU execute Field-Oriented Control (FOC) loops within microsecond latencies at 120 MHz. Its high-speed timers and PWM outputs drive a 3-phase inverter, while the 12-bit ADC samples phase currents synchronously. The 1 MB flash stores vector control libraries and tuning parameters, and the 256 KB SRAM holds state estimator arrays. CAN-FD provides real-time communication with a motion controller upstream.
Empfohlen
Battery-Powered Portable Data Loggers
The ATSAMD51P20A-CTFT suits battery-powered data loggers due to its low-power sleep modes, 1 MB flash for offline storage, and 256 KB SRAM for buffering before write cycles. The MCU sleeps between sensor reads, waking on RTC alarm to sample temperature, humidity, and motion data into flash, then returning to sleep. The 120-TFBGA's small footprint fits wearable form factors, and the extended temperature range supports outdoor environmental monitoring. USB charging and data offload is provided through the integrated USB 2.0 PHY.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für ATSAMD51P20A-CTFT – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | ATSAMD51P19A-CTUT-EFP | ATSAMD51P19A-AFT | ATSAMD51N20A-AU | ATSAMD51J20A-MFT |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 120-TFBGA (8x8) | 120-TFBGA (8x8) - same | 120-TFBGA (8x8) - same | 100-TFBGA - different | 64-QFN - different |
| Core | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz |
| Flash Memory | 1 MB Dual-Panel | 512 KB (-50%) | 512 KB (-50%) | 1 MB (same) | 1 MB (same) |
| SRAM | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| GPIO Count | Up to 99 | Up to 99 | Up to 99 | Up to 79 (-20%) | Up to 51 (-48%) |
| CAN-FD | Yes (2x) | Yes (2x) | Yes (2x) | Yes (2x) | Yes (1x) |
| USB 2.0 FS | Yes (embedded PHY) | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Dual-Panel Flash for live firmware updates (vs. ATSAMD51P19A-CTUT-EFP)
- Higher GPIO count in same package (vs. ATSAMD51N20A-AU)
- Compact TFBGA-120 vs larger QFN packages (vs. ATSAMD51J20A-MFT)
Designhinweise
The 120-TFBGA package uses 0.5 mm ball pitch, requiring either via-in-pad or microvia dog-bone fanout for reliable soldering. Use ENIG or immersion-silver surface finish to prevent oxidation of the BGA pads. Place at least one 1uF + 100nF ceramic decoupling pair on every VDD pin group, with vias placed close to the BGA pads. Verify paste volume with a 3D solder paste inspection step on prototypes because BGA voids are invisible after reflow. Estimated: a 4-layer PCB with 0.8 mm core thickness works well for SAM D51 designs.
Keep the 32.768 kHz crystal traces short (less than 5 mm) and symmetric with matching trace lengths to minimize load capacitance mismatch. Route the USB DP/DM pair as a 90 ohm differential with no stubs, and avoid routing near switching regulator switching nodes. The SWDIO and SWCLK signals should have a 100 kohm pull-up on SWDIO per the SAM D51 datasheet. Maintain at least 4x trace-width clearance between analog and digital signal regions to reduce crosstalk.
Do not leave unused GPIO pins floating - configure them as outputs driving low or enable the internal pull-down to avoid leakage. The dual-panel flash requires the application to manage bank swap via the BOOTPROT and DSU registers; omitting the bank-swap sequence can lock the device after a failed firmware update. The I2C SERCOM instances require explicit pin-mux configuration in the PORT group before use, otherwise they will not respond on the bus. Estimated: leaving the SERCOM clocks disabled saves roughly 2-3 mA in active mode.
Compliance-Informationen
RoHS compliant per Microchip product page. Not AEC-Q100 qualified - choose ATSAMD51P20A-AUT-EFP for automotive. Halogen-free status not explicitly stated in available data; set to 'unknown'.
