ATSAMS70N19A-AN - SAM S70 Cortex-M7 MCU 300MHz 512KB Flash | Microchip
Teilenummer: ATSAMS70N19A-AN ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $10.96 | $10,96 |
| 10 | $9.85 | $98,50 |
| 100 | $8.2 | $820,00 |
| 500 | $6.95 | $3.475,00 |
| 1.000 | $5.8 | $5.800,00 |
ATSAMS70N19A-AN Übersicht
What is a Cortex-M7 microcontroller? A Cortex-M7 is a 32-bit ARM processor core designed for high-performance microcontroller applications, including a hardware single-precision and double-precision FPU, tightly coupled memories (TCM), and an instruction cache. It sits above Cortex-M4 in the ARM hierarchy (Cortex-M0/M0+ -> Cortex-M3 -> Cortex-M4 -> Cortex-M7 -> Cortex-M33/M55/M85), offering superscalar DSP and SIMD capabilities for signal-processing and motor-control workloads. The Cortex-M7 belongs to the broader family of microcontrollers -> microcontrollers ICs -> embedded processors -> semiconductors.
Key features include 300 MHz core clock, 512 KB Flash program store, 256 KB SRAM, a 12-bit 1 Msps ADC, two CAN-FD controllers, 10/100 Mbps Ethernet MAC, high-speed USB host/device with PHY, an image sensor interface, an external bus interface (EBI) for SRAM/NOR/NAND, and a high-speed SD/MMC host. The 100-LQFP package exposes most peripherals for low-cost PCB designs while supporting industrial temperature operation from -40C to +105C.
Technically, the SAM S70 architecture couples an MPU-aware Cortex-M7 core to a multi-layer AHB bus matrix with separate peripherals and tightly-coupled memories, enabling deterministic DMA and zero-wait-state Flash access via a 2 KB cache. 256 KB SRAM is split between system SRAM and backup SRAM retained in certain low-power modes; the 12-bit ADC and analog comparators are routed to dedicated peripheral channels. Hardware crypto is not part of the SAM S70 itself - that feature lives on the related SAME70 family.
Typical applications include industrial motor control (BLDC/PMSM), industrial automation and PLC interfaces, building automation and HVAC, smart energy metering, automotive body/infotainment peripherals, audio processing front ends, machine vision at the edge, and connected gateways with Ethernet and CAN-FD. The SAMS70N19 is also used in medical instrumentation where the FPU and DSP extension accelerate filter computations.
When designing with this device, allocate sufficient decoupling (100 nF near each VDD/VDDIO pin plus bulk) and follow Microchip's SAMS70 errata for HS USB PHY, EBI timing, and CAN-FD revision items. Use MPLAB X IDE with MPLAB Harmony 3 (csp, core, and a supported middleware layer) for code generation, peripheral drivers, and FreeRTOS integration.
This page synthesizes distributor pricing, parametric positioning, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone - including a cross-vendor comparison row and a curated set of Microchip SAME70/SAMS70 family pin-compatible options for reuse of existing PCB layouts.
Drop-in-Alternativen für ATSAMS70N19A-AN – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit ATSAMS70N19A-AN (gleiche Bauform und Footprint) – abweichend in ADC, Core, Ethernet, Package, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
ATSAME70N20A-AN
✅ Drop-In✓ Auf Lager
$11.2 / Stück
Datenblatt ansehen →ATSAME70Q21B-AN
✅ Drop-In✓ Auf Lager
$17.4 / Stück
Datenblatt ansehen →ATSAMS70N19A-CFN
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ATSAMS70N19A-CBT
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
ATSAMS70N19A-AN Grenzwerte & elektrische Eigenschaften
| Core | ARM Cortex-M7 with FPU |
| Maximum Clock Speed | 300 MHz |
| Program Memory (Flash) | 512 KB |
| SRAM | 256 KB |
| Operating Voltage | 1.8 V / 2.5 V / 3.3 V |
| Gehäuse | 100-LQFP (14x14 mm) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +105C (Industrial) |
| ADC | 12-bit, up to 24 channels, 1 Msps |
| CAN | 2x CAN-FD controllers |
| Ethernet | 10/100 Mbps MAC |
| USB | HS USB 2.0 Host/Device with on-chip PHY |
| External Bus Interface (EBI) | Yes (SRAM/NOR/NAND) |
| MSL-Level | MSL3 (per JEDEC J-STD-020) |
| RoHS-Status | Compliant |
| Series | SAM S70 |
| Lead-Free | Yes |
ATSAMS70N19A-AN 100-lqfp (14x14 mm) Pinbelegungsleitfaden
Pinbelegung für ATSAMS70N19A-AN (100-lqfp (14x14 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für ATSAMS70N19A-AN.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
ATSAMS70N19A-AN ist geeignet für 6 Anwendungs: Industrial Motor Control (BLDC / PMSM / Servo), Industrial Ethernet Gateway / PLC Interface, Building Automation and HVAC Controllers, Smart Energy Metering / Power Quality, Automotive Body and Infotainment Peripherals, Audio Processing and DSP Front-End.
Industrial Motor Control (BLDC / PMSM / Servo)
The ATSAMS70N19A-AN's 300 MHz Cortex-M7 with FPU executes field-oriented control (FOC) loops for BLDC and PMSF motors in well under 10 us, comfortably meeting 20 kHz PWM update rates. Its four 16-bit timer/counter channels, hardware dead-time generators, and quadrature decoder interface support three-phase inverter bridges directly, while the 12-bit 1 Msps ADC samples phase currents with sub-microsecond latency. The Ethernet MAC and CAN-FD enable real-time motion networks such as EtherCAT and CANopen. Designers pair this MCU with gate drivers like the AMT49100 and BLDC motor pre-drivers to build compact, deterministic servo drives for robotics, CNC, and industrial automation.
Empfohlen
Industrial Ethernet Gateway / PLC Interface
With on-chip 10/100 Ethernet MAC, dual CAN-FD, and HS USB, the ATSAMS70N19A-AN is well-suited as a protocol-conversion gateway between fieldbus (CANopen, Modbus, DeviceNet) and Ethernet (PROFINET, EtherNet/IP, MQTT). Its 300 MHz Cortex-M7 core with DSP extensions runs TLS and OPC UA PubSub stacks with predictable latency, while 256 KB SRAM holds multiple protocol buffers. The SD/MMC interface enables local data logging on removable cards, and the EBI allows direct connection of external SRAM/NOR for firmware-image expansion. Drop-in upgrade paths to the SAME70 family preserve the PCB while adding crypto for secure boot and signed firmware.
Empfohlen
Building Automation and HVAC Controllers
The ATSAMS70N19A-AN integrates the peripherals needed for HVAC and building-automation controllers: dual CAN-FD for BACnet MS/TP-style networks, Ethernet for BACnet/IP, HS USB for service ports, and an EBI for connecting graphic LCDs or NOR memory holding localizations. Industrial temperature range (-40C to +105C) and 1.8-3.3V operation simplify integration into 24V-powered cabinetry with on-board regulation. The Cortex-M7's DSP extensions accelerate FFTs used in vibration and acoustic analysis for HVAC fan diagnostics, while 512 KB Flash accommodates BACnet stack, scheduler logic, and a small embedded Web server.
Empfohlen
Smart Energy Metering / Power Quality
Class 0.2S smart-energy meters and power-quality analyzers require precise ADC sampling, fast DSP processing, and secure communications - exactly the niche the ATSAMS70N19A-AN addresses. The 12-bit 1 Msps ADC combined with Cortex-M7 DSP instructions computes RMS, harmonic distortion, and FFTs to IEC 61000-4-7 in real time. CAN-FD and Ethernet provide AMI backhaul connectivity to concentrators, while the EBI allows external SRAM expansion for 1-second observation data buffers. For metering with hardware crypto, upgrade to the ATSAME70N20A-AN in the same footprint to add secure boot and signed firmware update capability.
Empfohlen
Automotive Body and Infotainment Peripherals
Although the ATSAMS70N19A-AN is not AEC-Q100 qualified, its industrial-grade (-40C to +105C) operation, dual CAN-FD controllers, and high-speed peripheral bandwidth suit non-safety automotive subsystems such as body controllers, HVAC panels, infotainment peripherals, and telematics control units (TCUs). Cortex-M7 DSP accelerates audio decoding and echo-cancellation in hands-free or in-cabin microphone arrays, while Ethernet and HS USB serve as in-vehicle networking and service-port interfaces. For safety-critical or AEC-Q100 applications, designers must select AEC-Q100 qualified Microchip parts instead.
Empfohlen
Audio Processing and DSP Front-End
The Cortex-M7 FPU and SIMD DSP extensions on the ATSAMS70N19A-AN accelerate real-time audio processing such as active noise cancellation (ANC), beamforming, and acoustic echo cancellation (AEC). The HS USB supports USB Audio Class 2.0 device mode at 24-bit/192 kHz, while the EBI connects external SDRAM for delay-line buffers. Industrial temperature operation allows deployment in PA systems, conferencing hardware, and automotive headrest audio. For designs needing hardware AES for content protection, migrating to the ATSAME70N20A-AN in the same 100-LQFP preserves the PCB and adds cryptography for DRM and signed firmware.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für ATSAMS70N19A-AN – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | ATSAME70N20A-AN | ATSAME70Q21B-AN | ATSAMS70N19A-CFN | ATSAMS70N19A-CBT |
|---|---|---|---|---|---|
| Package | 100-LQFP (14x14 mm) | 100-LQFP (14x14 mm) - same footprint | 100-LQFP (14x14 mm) - same footprint | 100-VFBGA (7x7) - land-pattern change | 100-TFBGA - land-pattern change |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz |
| Flash | 512 KB | 2 MB | 2 MB | 512 KB | 512 KB |
| SRAM | 256 KB | 384 KB | 384 KB | 256 KB | 256 KB |
| Hardware Crypto / RNG | No | Yes (AES, TRNG) | Yes (AES, TRNG) | No | No |
| Ethernet MAC | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps |
| CAN-FD Controllers | 2 | 2 | 2 | 2 | 2 |
| Operating Temperature | -40C to +105C (Industrial) | -40C to +105C (Industrial) | -40C to +105C (Industrial) | -40C to +85C (Commercial) | -40C to +105C (Industrial) |
Wichtigste Unterscheidungsmerkmale
- Largest SRAM in 100-LQFP SAMS70 family with dual CAN-FD and on-chip Ethernet MAC (vs. ATSAME70N20A-AN)
- VFBGA-100 variant with 7x7 mm footprint for space-constrained boards (vs. ATSAMS70N19A-CFN)
- Drop-in migration path to SAME70 with same Cortex-M7 core and pinout (vs. ATSAME70Q21B-AN)
Designhinweise
Estimated: at 300 MHz full CPU load on all peripherals with 3.3 V supply, typical VDD current is in the 100-150 mA range; derate to 60-80 mA at 150 MHz. Provide a 100 nF X7R decoupling capacitor near every VDD/VDDIO pin and a 4.7-10 uF bulk capacitor at the regulator output. The PLL supply pin (VDDPLL) requires a dedicated LC filter (10 uH + 1 uF) per the Microchip SAM S70 datasheet to meet jitter specifications.
Route the high-speed USB differential pair (D+/D-) with 90 ohm differential impedance, length-matched to within 150 mil. The Ethernet MAC TX/RX pairs to the external PHY should be 50 ohm single-ended and 100 ohm differential with matched lengths. Place the 12 MHz main crystal and its load capacitors within 5 mm of the XIN/XOUT pins to minimize stray capacitance; the 32.768 kHz RTC crystal follows the same proximity rule. Keep the analog VDD/VREF traces short and isolated from digital switching returns.
Do not operate the ATSAMS70N19A-AN from a 5 V supply directly - the absolute maximum VDDIO is 3.6 V and 5 V will damage the MCU. Always check the latest Microchip SAM S70 errata before bringing up HS USB, EBI timing, or CAN-FD revisions; several silicon revisions carry known revisions. When migrating firmware from SAMS70 to SAME70, account for the additional crypto subsystem register space and the larger Flash erase granularity on the SAME70 2 MB bank.
Estimated: at 3.3 V supply and 300 MHz full-load CPU utilization, internal dissipation is roughly 0.5 W, which is well within the thermal envelope of the 100-LQFP (14x14 mm) at -40C to +105C ambient. The exposed thermal pad (EP) should be soldered to a 4 x 4 via-array thermal copper pour on the top and inner layers to keep the junction below the 125C maximum. Forced-air cooling is not required for typical industrial applications; however, in enclosed IP65 housings verify the case temperature at +105C ambient does not exceed the datasheet limit.
Compliance-Informationen
RoHS and lead-free per Microchip product page. Not AEC-Q100 qualified; for safety-critical automotive use, select an AEC-Q100 variant. Halogen-free status not specified in available data.
