ATSAMS70N19A-AN - SAM S70 Cortex-M7 MCU 300MHz 512KB Flash | Microchip
MPN: ATSAMS70N19A-AN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $10.96 | $10.96 |
| 10 | $9.85 | $98.50 |
| 100 | $8.2 | $820.00 |
| 500 | $6.95 | $3,475.00 |
| 1,000 | $5.8 | $5,800.00 |
ATSAMS70N19A-AN Overview
What is a Cortex-M7 microcontroller? A Cortex-M7 is a 32-bit ARM processor core designed for high-performance microcontroller applications, including a hardware single-precision and double-precision FPU, tightly coupled memories (TCM), and an instruction cache. It sits above Cortex-M4 in the ARM hierarchy (Cortex-M0/M0+ -> Cortex-M3 -> Cortex-M4 -> Cortex-M7 -> Cortex-M33/M55/M85), offering superscalar DSP and SIMD capabilities for signal-processing and motor-control workloads. The Cortex-M7 belongs to the broader family of microcontrollers -> microcontrollers ICs -> embedded processors -> semiconductors.
Key features include 300 MHz core clock, 512 KB Flash program store, 256 KB SRAM, a 12-bit 1 Msps ADC, two CAN-FD controllers, 10/100 Mbps Ethernet MAC, high-speed USB host/device with PHY, an image sensor interface, an external bus interface (EBI) for SRAM/NOR/NAND, and a high-speed SD/MMC host. The 100-LQFP package exposes most peripherals for low-cost PCB designs while supporting industrial temperature operation from -40C to +105C.
Technically, the SAM S70 architecture couples an MPU-aware Cortex-M7 core to a multi-layer AHB bus matrix with separate peripherals and tightly-coupled memories, enabling deterministic DMA and zero-wait-state Flash access via a 2 KB cache. 256 KB SRAM is split between system SRAM and backup SRAM retained in certain low-power modes; the 12-bit ADC and analog comparators are routed to dedicated peripheral channels. Hardware crypto is not part of the SAM S70 itself - that feature lives on the related SAME70 family.
Typical applications include industrial motor control (BLDC/PMSM), industrial automation and PLC interfaces, building automation and HVAC, smart energy metering, automotive body/infotainment peripherals, audio processing front ends, machine vision at the edge, and connected gateways with Ethernet and CAN-FD. The SAMS70N19 is also used in medical instrumentation where the FPU and DSP extension accelerate filter computations.
When designing with this device, allocate sufficient decoupling (100 nF near each VDD/VDDIO pin plus bulk) and follow Microchip's SAMS70 errata for HS USB PHY, EBI timing, and CAN-FD revision items. Use MPLAB X IDE with MPLAB Harmony 3 (csp, core, and a supported middleware layer) for code generation, peripheral drivers, and FreeRTOS integration.
This page synthesizes distributor pricing, parametric positioning, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone - including a cross-vendor comparison row and a curated set of Microchip SAME70/SAMS70 family pin-compatible options for reuse of existing PCB layouts.
Drop-in alternatives for ATSAMS70N19A-AN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAMS70N19A-AN (same form factor and footprint) — differing in ADC, Core, Ethernet, Package, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAME70N20A-AN
✅ Drop-In✓ In Stock
$11.2 / Unit
View Datasheet →ATSAME70Q21B-AN
✅ Drop-In✓ In Stock
$17.4 / Unit
View Datasheet →ATSAMS70N19A-CFN
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAMS70N19A-CBT
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAMS70N19A-AN Maximum Ratings & Electrical Characteristics
| Core | ARM Cortex-M7 with FPU |
| Maximum Clock Speed | 300 MHz |
| Program Memory (Flash) | 512 KB |
| SRAM | 256 KB |
| Operating Voltage | 1.8 V / 2.5 V / 3.3 V |
| Package | 100-LQFP (14x14 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +105C (Industrial) |
| ADC | 12-bit, up to 24 channels, 1 Msps |
| CAN | 2x CAN-FD controllers |
| Ethernet | 10/100 Mbps MAC |
| USB | HS USB 2.0 Host/Device with on-chip PHY |
| External Bus Interface (EBI) | Yes (SRAM/NOR/NAND) |
| MSL Level | MSL3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
| Series | SAM S70 |
| Lead-Free | Yes |
ATSAMS70N19A-AN 100-lqfp (14x14 mm) Pin Configuration Guide
Pin configuration for ATSAMS70N19A-AN (100-lqfp (14x14 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAMS70N19A-AN.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAMS70N19A-AN is suitable for 6 applications: Industrial Motor Control (BLDC / PMSM / Servo), Industrial Ethernet Gateway / PLC Interface, Building Automation and HVAC Controllers, Smart Energy Metering / Power Quality, Automotive Body and Infotainment Peripherals, Audio Processing and DSP Front-End.
Industrial Motor Control (BLDC / PMSM / Servo)
The ATSAMS70N19A-AN's 300 MHz Cortex-M7 with FPU executes field-oriented control (FOC) loops for BLDC and PMSF motors in well under 10 us, comfortably meeting 20 kHz PWM update rates. Its four 16-bit timer/counter channels, hardware dead-time generators, and quadrature decoder interface support three-phase inverter bridges directly, while the 12-bit 1 Msps ADC samples phase currents with sub-microsecond latency. The Ethernet MAC and CAN-FD enable real-time motion networks such as EtherCAT and CANopen. Designers pair this MCU with gate drivers like the AMT49100 and BLDC motor pre-drivers to build compact, deterministic servo drives for robotics, CNC, and industrial automation.
Recommended
Industrial Ethernet Gateway / PLC Interface
With on-chip 10/100 Ethernet MAC, dual CAN-FD, and HS USB, the ATSAMS70N19A-AN is well-suited as a protocol-conversion gateway between fieldbus (CANopen, Modbus, DeviceNet) and Ethernet (PROFINET, EtherNet/IP, MQTT). Its 300 MHz Cortex-M7 core with DSP extensions runs TLS and OPC UA PubSub stacks with predictable latency, while 256 KB SRAM holds multiple protocol buffers. The SD/MMC interface enables local data logging on removable cards, and the EBI allows direct connection of external SRAM/NOR for firmware-image expansion. Drop-in upgrade paths to the SAME70 family preserve the PCB while adding crypto for secure boot and signed firmware.
Recommended
Building Automation and HVAC Controllers
The ATSAMS70N19A-AN integrates the peripherals needed for HVAC and building-automation controllers: dual CAN-FD for BACnet MS/TP-style networks, Ethernet for BACnet/IP, HS USB for service ports, and an EBI for connecting graphic LCDs or NOR memory holding localizations. Industrial temperature range (-40C to +105C) and 1.8-3.3V operation simplify integration into 24V-powered cabinetry with on-board regulation. The Cortex-M7's DSP extensions accelerate FFTs used in vibration and acoustic analysis for HVAC fan diagnostics, while 512 KB Flash accommodates BACnet stack, scheduler logic, and a small embedded Web server.
Recommended
Smart Energy Metering / Power Quality
Class 0.2S smart-energy meters and power-quality analyzers require precise ADC sampling, fast DSP processing, and secure communications - exactly the niche the ATSAMS70N19A-AN addresses. The 12-bit 1 Msps ADC combined with Cortex-M7 DSP instructions computes RMS, harmonic distortion, and FFTs to IEC 61000-4-7 in real time. CAN-FD and Ethernet provide AMI backhaul connectivity to concentrators, while the EBI allows external SRAM expansion for 1-second observation data buffers. For metering with hardware crypto, upgrade to the ATSAME70N20A-AN in the same footprint to add secure boot and signed firmware update capability.
Recommended
Automotive Body and Infotainment Peripherals
Although the ATSAMS70N19A-AN is not AEC-Q100 qualified, its industrial-grade (-40C to +105C) operation, dual CAN-FD controllers, and high-speed peripheral bandwidth suit non-safety automotive subsystems such as body controllers, HVAC panels, infotainment peripherals, and telematics control units (TCUs). Cortex-M7 DSP accelerates audio decoding and echo-cancellation in hands-free or in-cabin microphone arrays, while Ethernet and HS USB serve as in-vehicle networking and service-port interfaces. For safety-critical or AEC-Q100 applications, designers must select AEC-Q100 qualified Microchip parts instead.
Recommended
Audio Processing and DSP Front-End
The Cortex-M7 FPU and SIMD DSP extensions on the ATSAMS70N19A-AN accelerate real-time audio processing such as active noise cancellation (ANC), beamforming, and acoustic echo cancellation (AEC). The HS USB supports USB Audio Class 2.0 device mode at 24-bit/192 kHz, while the EBI connects external SDRAM for delay-line buffers. Industrial temperature operation allows deployment in PA systems, conferencing hardware, and automotive headrest audio. For designs needing hardware AES for content protection, migrating to the ATSAME70N20A-AN in the same 100-LQFP preserves the PCB and adds cryptography for DRM and signed firmware.
Recommended
Recommended Products Summary
Engineering reference data for ATSAMS70N19A-AN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAME70N20A-AN | ATSAME70Q21B-AN | ATSAMS70N19A-CFN | ATSAMS70N19A-CBT |
|---|---|---|---|---|---|
| Package | 100-LQFP (14x14 mm) | 100-LQFP (14x14 mm) - same footprint | 100-LQFP (14x14 mm) - same footprint | 100-VFBGA (7x7) - land-pattern change | 100-TFBGA - land-pattern change |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz | ARM Cortex-M7 @ 300 MHz |
| Flash | 512 KB | 2 MB | 2 MB | 512 KB | 512 KB |
| SRAM | 256 KB | 384 KB | 384 KB | 256 KB | 256 KB |
| Hardware Crypto / RNG | No | Yes (AES, TRNG) | Yes (AES, TRNG) | No | No |
| Ethernet MAC | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps | 10/100 Mbps |
| CAN-FD Controllers | 2 | 2 | 2 | 2 | 2 |
| Operating Temperature | -40C to +105C (Industrial) | -40C to +105C (Industrial) | -40C to +105C (Industrial) | -40C to +85C (Commercial) | -40C to +105C (Industrial) |
Key Differentiators
- Largest SRAM in 100-LQFP SAMS70 family with dual CAN-FD and on-chip Ethernet MAC (vs ATSAME70N20A-AN)
- VFBGA-100 variant with 7x7 mm footprint for space-constrained boards (vs ATSAMS70N19A-CFN)
- Drop-in migration path to SAME70 with same Cortex-M7 core and pinout (vs ATSAME70Q21B-AN)
Design Notes
Estimated: at 300 MHz full CPU load on all peripherals with 3.3 V supply, typical VDD current is in the 100-150 mA range; derate to 60-80 mA at 150 MHz. Provide a 100 nF X7R decoupling capacitor near every VDD/VDDIO pin and a 4.7-10 uF bulk capacitor at the regulator output. The PLL supply pin (VDDPLL) requires a dedicated LC filter (10 uH + 1 uF) per the Microchip SAM S70 datasheet to meet jitter specifications.
Route the high-speed USB differential pair (D+/D-) with 90 ohm differential impedance, length-matched to within 150 mil. The Ethernet MAC TX/RX pairs to the external PHY should be 50 ohm single-ended and 100 ohm differential with matched lengths. Place the 12 MHz main crystal and its load capacitors within 5 mm of the XIN/XOUT pins to minimize stray capacitance; the 32.768 kHz RTC crystal follows the same proximity rule. Keep the analog VDD/VREF traces short and isolated from digital switching returns.
Do not operate the ATSAMS70N19A-AN from a 5 V supply directly - the absolute maximum VDDIO is 3.6 V and 5 V will damage the MCU. Always check the latest Microchip SAM S70 errata before bringing up HS USB, EBI timing, or CAN-FD revisions; several silicon revisions carry known revisions. When migrating firmware from SAMS70 to SAME70, account for the additional crypto subsystem register space and the larger Flash erase granularity on the SAME70 2 MB bank.
Estimated: at 3.3 V supply and 300 MHz full-load CPU utilization, internal dissipation is roughly 0.5 W, which is well within the thermal envelope of the 100-LQFP (14x14 mm) at -40C to +105C ambient. The exposed thermal pad (EP) should be soldered to a 4 x 4 via-array thermal copper pour on the top and inner layers to keep the junction below the 125C maximum. Forced-air cooling is not required for typical industrial applications; however, in enclosed IP65 housings verify the case temperature at +105C ambient does not exceed the datasheet limit.
Compliance Information
RoHS and lead-free per Microchip product page. Not AEC-Q100 qualified; for safety-critical automotive use, select an AEC-Q100 variant. Halogen-free status not specified in available data.
