AzureWave

AW-CU570 - Tri-Radio Wi-Fi 6 + BLE 5.3 + 802.15.4 Wireless MCU LGA

Teilenummer: AW-CU570 ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
3.3 V (single rail) Vdss Surface-mount LGA module Package
Ab $12.75 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-16
Mengenpreise
Menge Stückpreis Gesamt
1 $18.5 $18,50
10 $17.1 $171,00
100 $15.25 $1.525,00
500 $13.9 $6.950,00
1.000 $12.75 $12.750,00
ℹ️ Alle Preise sind in USD

AW-CU570 Übersicht

The AzureWave AW-CU570 is a highly integrated, low-power tri-radio Wireless MCU module based on the NXP RW612 SoC, combining Wi-Fi 6 (IEEE 802.11 a/b/g/n/ac/ax), Bluetooth Low Energy 5.2, and 802.15.4 (Thread/Zigbee) radios in a single surface-mount LGA package. It operates from a single 3.3 V power supply, integrates an Arm Cortex-M33 application MCU subsystem, and supports Matter over Wi-Fi and Matter over Thread for interoperable smart-home and industrial deployments.

A wireless MCU (also called a Wi-Fi MCU module or tri-radio module) is a System-on-Module that combines an embedded microcontroller with one or more radio transceivers, providing a turnkey wireless connectivity solution for connected products. The product hierarchy places the AW-CU570 as: tri-radio module -> wireless MCU module -> IoT module -> embedded wireless subsystem. This integration eliminates the need to separately source and certify a discrete MCU plus a Wi-Fi/BLE combo chipset, simplifying FCC/ETSI/CE RF compliance and reducing BOM and time-to-market.

Key features include dual-band 2.4/5/6 GHz Wi-Fi 6 (802.11ax) with WPA3 security, Bluetooth LE 5.2 with LE Audio, 802.15.4 for Thread/Zigbee/Matter, an on-board PCB antenna option plus RF pin for external antenna, and Matter-ready application-layer interoperability. The module exposes SDIO/UART/USB/SPI/I2C host interfaces, multiple GPIO, and integrated flash + RAM sufficient for typical IoT firmware stacks. Designed for tight integration and security, the AW-CU570 includes hardware crypto acceleration and secure boot.

Architecturally, the AW-CU570 leverages the NXP RW612 silicon, which uses a Cortex-M33 core for application processing and dedicated radio subsystems. By integrating the matching RF front-end, balun, and crystal into a pre-certified LGA module, AzureWave eliminates the most common sources of Wi-Fi/BLE RF failures (mismatch, harmonics, EMI re-radiation) and allows the host PCB to be designed with minimal RF expertise.

Typical applications include connected smart-home appliances (Matter-over-Wi-Fi lighting, locks, thermostats), enterprise and industrial IoT gateways, smart energy metering, asset tracking and smart accessories, and Matter-over-Thread border routers. The single-rail 3.3 V supply and small footprint also suit battery-powered wearables.

When designing in this module, follow AzureWave's reference design for the host PCB keep-out area around the antenna, honor the module's thermal and supply-rail decoupling guidelines, and ensure the chosen regulatory domain (FCC/IC/CE/TELEC/MIC) is supported on the part variant ordered. The module is pre-certified only as a component - the final product still requires an unintentional-radiator / SAR / host-integrator review.

This page synthesizes distributor pricing, drop-in module alternative sourcing, and practical host-PCB design notes that go beyond the AzureWave datasheet summary, helping hardware engineers evaluate the AW-CU570 against alternative tri-radio modules.

Drop-in-Alternativen für AW-CU570 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

AW-CU570-EVB

✅ Drop-In
📦 LGA module (evaluation board reference)
evaluation-board reference for the same AW-CU570 silicon; same module footprint, no BOM change

📋 Referenzalternative (nicht im Katalog)

AW-CU300

✅ Drop-In
📦 LGA module
single-radio Wi-Fi 6 only (no BLE, no 802.15.4) - cost-reduced variant with same module footprint family

📋 Referenzalternative (nicht im Katalog)

AW-CU580

✅ Drop-In
📦 LGA module
higher-power tri-radio variant (AW-CU570 is the lower-power sibling); same RW612 silicon but with different RF front-end tuning

📋 Referenzalternative (nicht im Katalog)

LBES5PL2x

✅ Drop-In
📦 LGA module
Wi-Fi 6 + BLE 5.x module; lacks 802.15.4 Thread - functional fit for Wi-Fi + BLE portion only; same LGA footprint class

📋 Referenzalternative (nicht im Katalog)

AW-CU570 Spezifikationen (herstellerveröffentlicht)

Module Type Tri-radio Wireless MCU Module
Host SoC NXP RW612 (Arm Cortex-M33 + Wi-Fi 6 + BLE + 802.15.4)
Wi-Fi Standard IEEE 802.11 a/b/g/n/ac/ax (Wi-Fi 6)
Wi-Fi Bands 2.4 GHz / 5 GHz / 6 GHz (tri-band)
Bluetooth Bluetooth Low Energy 5.2 (LE Audio)
802.15.4 Protocol Thread / Zigbee / Matter over Thread
Versorgungsspannung 3.3 V (single rail)
Matter Support Matter over Wi-Fi and Matter over Thread
Host Interfaces SDIO / UART / USB / SPI / I2C / GPIO
Security WPA3, hardware crypto, secure boot
Gehäuse Surface-mount LGA module
Montageart Surface Mount
RoHS-Status Compliant
Antenna Integrated PCB antenna + RF pin option

AW-CU570 Schnittstellen & Anschlüsse

AW-CU570 bietet die folgenden, vom Hersteller veröffentlichten Schnittstellen und Anschlüsse: Funk, Bluetooth, Leistungsaufnahme. Pinbelegung der Erweiterungsheader, Nummerierung der Anschlüsse und elektrische Grenzwerte sind in der Herstellerdokumentation definiert.

Funk IEEE 802.11 a/b/g/n/ac/ax (Wi-Fi 6)
Bluetooth Bluetooth Low Energy 5.2 (LE Audio)
Leistungsaufnahme 3.3 V (single rail)

Siehe die Herstellerdokumentation für die vollständige Pinbelegung der Erweiterungsleiste und die Nummerierung der Steckverbinder-Pins.

Leistungs- und thermische Eigenschaften

Leistungsaufnahme 3.3 V (single rail)

Vom Hersteller veröffentlichte Leistungs- und thermische Parameter für AW-CU570.

Typische Anwendungen

AW-CU570 ist geeignet für 6 Anwendungs: Matter-over-Wi-Fi Smart Lighting, Smart Home Thermostats and HVAC, Industrial IoT Gateways and Sensors, Smart Energy Meters and Sub-meters, Wearable and Personal Health Devices, Enterprise Asset Tracking.

💡

Matter-over-Wi-Fi Smart Lighting

The AW-CU570's tri-radio architecture (Wi-Fi 6 plus BLE plus 802.15.4) and Matter application-layer support make it a single-PCB solution for connected luminaires that need to join Matter-over-Wi-Fi or Matter-over-Thread networks without a separate hub. The module's 3.3 V single-supply rail simplifies integration into constant-current LED-driver products that already provide 3.3 V to the microcontroller. WPA3 security and hardware crypto acceleration protect OTA firmware updates, while BLE 5.2 enables commissioning via smartphone without a hub. Designers should follow AzureWave's antenna keep-out around the metal heatsink of the luminaire to preserve radiated performance.

🌐

Smart Home Thermostats and HVAC

For connected thermostats, the AW-CU570's Matter interoperability allows the same SKU to join Apple Home, Google Home, Amazon Alexa, and SmartThings networks. The BLE 5.2 radio supports proximity-based presence detection (auto-away/auto-home), and the 802.15.4 radio can act as a Thread border router for end-node devices such as temperature sensors. The single 3.3 V rail matches typical thermostat power trees supplied from 24 VAC through a small isolated DC-DC. Designers should validate Thermostat-CE and energy-consumption compliance for the full product, since the module is pre-certified but the host still needs unintentional-radiator testing.

🏭

Industrial IoT Gateways and Sensors

Industrial sensor nodes benefit from the AW-CU570's tri-band Wi-Fi 6 (2.4/5/6 GHz) for high-throughput or long-range uplink to plant gateways, plus BLE 5.2 for local configuration by technicians using a phone, and 802.15.4 for sub-GHz mesh-style sensor networks. The Arm Cortex-M33 in the host SoC handles edge-compute workloads and can run Thread/Bluetooth/Modbus/OPC-UA bridges concurrently. Single 3.3 V supply simplifies powering the module from industrial 24 V via a buck regulator, reducing the host BOM. The high immunity of Wi-Fi 6 to co-channel interference is valuable in dense factory RF environments.

⚡

Smart Energy Meters and Sub-meters

Smart meters require wireless connectivity that survives long product lifecycles and connects to multiple ecosystems. The AW-CU570's Matter-over-Thread support and hardware crypto acceleration allow utilities and OEMs to standardize on a single wireless MCU module across both consumer and enterprise deployments. Tri-band Wi-Fi 6 covers utility-deployed customer-premises Wi-Fi while 802.15.4 supports neighborhood-area metering networks. Regulatory pre-certification reduces the certification burden for metering products where each radio retest can add weeks to the launch schedule.

📱

Wearable and Personal Health Devices

Wearables benefit from the AW-CU570's small LGA footprint, single 3.3 V supply, and Matter/BLE 5.2/LE Audio support. LE Audio enables broadcast audio plus Auracast hearing-aid companion features, while BLE 5.2 enables high-precision positioning via Bluetooth Channel Sounding for indoor wayfinding. The module's low-power sleep modes help wearables meet multi-day battery targets, and the integrated Cortex-M33 can run on-device health algorithms without an additional application processor. Designers must carefully validate the antenna performance inside a small-form-factor wearable housing.

🧩

Enterprise Asset Tracking

For enterprise and warehouse asset-tracking tags, the AW-CU570's tri-band Wi-Fi 6 capability provides robust connectivity to corporate wireless infrastructure across buildings, BLE 5.2 enables proximity-based location services, and 802.15.4 (Thread) supports mesh tracking networks in warehouses with poor Wi-Fi coverage. The Cortex-M33 application core can run on-tag sensor fusion for movement detection, while the radios handle uplink. The 3.3 V supply matches common battery-backed tags using a coin-cell or rechargeable Li-ion configuration with a load switch.

Zusammenfassung der empfohlenen Produkte

NXP-RW612 Host SoC reference Verwendet in: Matter-over-Wi-Fi Smart Lighting AW-CU570-EVB Evaluation board Verwendet in: Matter-over-Wi-Fi Smart Lighting, Smart Home Thermostats and HVAC, Industrial IoT Gateways and Sensors, Smart Energy Meters and Sub-meters, Wearable and Personal Health Devices, Enterprise Asset Tracking
What radio protocols does the AW-CU570 support?
The AW-CU570 is a tri-radio wireless MCU module integrating Wi-Fi 6 (IEEE 802.11 a/b/g/n/ac/ax) on 2.4/5/6 GHz, Bluetooth Low Energy 5.2, and IEEE 802.15.4 (Thread/Zigbee). The simultaneous operation of these three radios on one SoC lets the same hardware serve as a Matter-over-Wi-Fi or Matter-over-Thread node, eliminating the need for a separate 802.15.4 chipset. According to the AzureWave datasheet summary, this combination targets smart home, industrial, and consumer IoT products.
What supply voltage does the AW-CU570 require?
The AW-CU570 operates from a single 3.3 V power rail, simplifying host-PCB power-tree design and avoiding the dual 3.3 V/1.8 V rails common to discrete Wi-Fi chipsets. Designers must still provide bulk decoupling and noise-clean 3.3 V because the internal RF chain is sensitive to supply ripple. In battery-powered designs, the module's low-power sleep modes typically allow the host to duty-cycle the 3.3 V rail with a load switch between transactions.
How does the AW-CU570 compare to a discrete Wi-Fi + BLE combo chip?
Versus a discrete Wi-Fi plus BLE combo solution, the AW-CU570 integrates the RF matching network, crystal, balun, and regulatory-tested antenna or RF pin in a single LGA module. This reduces RF tuning effort on the host PCB and accelerates FCC/ETSI/CE certification because the radio portion is pre-certified as a module. Trade-offs include higher unit cost than a bare chipset and slightly larger footprint than a chip-down design.
Is the AW-CU570 Matter-certified for smart-home use?
The AW-CU570 includes Matter support at the silicon and firmware level, enabling Matter over Wi-Fi and Matter over Thread on the same module. However, final Matter certification is product-level (the certified product, not just the module), so integrators must complete Matter submission through the Connectivity Standards Alliance with their end-product SKU. The module dramatically reduces the engineering work needed to reach that submission.
Where can I download the AW-CU570 datasheet PDF?
The AW-CU570 datasheet PDF is hosted on DigiKey's document server at the link provided on this page's datasheet_url field, and on the AzureWave official partner portal. The document includes the reference design guide, host-PCB layout recommendations, antenna keep-out dimensions, regulatory notes, and pin-out. Always check the revision number - Rev. 01 is the standard reference per the published PDF.
What is the price of the AW-CU570 in 100-piece quantities?
Pricing as of 2026-10-16 lists the AW-CU570 at approximately $15.25 per unit at qty 100, scaling to roughly $12.75 per unit at qty 1000 (Tape & Reel). Volume pricing depends on build configuration and packaging. Use Octopart or DigiKey Marketplace for live cross-distributor pricing.
Is the AW-CU570 in stock at major distributors?
As of 2026-10-16 the AW-CU570 is listed on DigiKey Marketplace in Tape & Reel packaging (distributor part number 5904-AW-CU570TR-ND). Stock and lead time vary; contact the distributor for current availability and pre-order windows for higher-volume builds. Backorder is common for new module launches during the first 90 days.
What is the AW-CU570's lead time for prototyping?
For prototype volumes (under 100 units), lead time is typically 2-4 weeks via DigiKey Marketplace, provided the part is in stock. For production builds, the lead time depends on AzureWave's allocation schedule and may extend to 8-12 weeks during supply-constrained periods. Place prototyping orders early in the design cycle to avoid certification-stage delays.
Can the AW-CU570 replace an NXP RW612 bare-chip design?
The AW-CU570 is built around the NXP RW612 silicon, so it is functionally a drop-in replacement at the module level for an RW612 chip-down implementation: same application MCU, same radio capabilities, same SDK and toolchain. The advantage is that RF matching, crystal, and regulatory pre-certification are absorbed into the module; the trade-off is higher unit cost than a chip-down design. Use the same NXP SDK and MCUXpresso toolchain for firmware development.
When should I choose the AW-CU570 over a single-protocol Wi-Fi module?
Choose the AW-CU570 when the end product must support Wi-Fi plus either Bluetooth LE or 802.15.4 (Thread/Zigbee/Matter) on the same hardware, or when Matter interoperability is a requirement. For products that only need Wi-Fi (no BLE, no Thread), a single-radio Wi-Fi 6 module such as the AW-CU300 or TI CC3301-based module is more cost-effective and avoids unused silicon area.
What cross-brand drop-in alternative is closest to the AW-CU570?
The Texas Instruments CC3301MOD and Murata LBES5PL2x series are the closest Wi-Fi 6 + BLE module alternatives; functionally equivalent LGA modules with comparable footprint. Note that they do not include 802.15.4 Thread support, so they are not true drop-in replacements for Thread/Matter designs - they substitute only the Wi-Fi + BLE portion and require a separate 802.15.4 chip.
Where do I find the AW-CU570 pinout and host-PCB layout?
The full pinout, host-PCB keep-out dimensions, and recommended land pattern are in the AzureWave AW-CU570 Reference Design Guide (Rev. 01), which is the primary datasheet PDF linked on this page. The pinout lists LGA pin assignments for power, ground, RF, SDIO/UART/SPI/I2C/USB host interfaces, and GPIO. Always follow the host keep-out around the antenna pad to meet regulatory radiated performance.
What host interfaces does the AW-CU570 expose?
The AW-CU570 exposes SDIO, UART, USB, SPI, I2C, and multiple GPIO through its LGA pinout, giving it flexibility to attach to a wide variety of host MCUs and application processors. SDIO is typically used to connect to a host application processor for high-throughput Wi-Fi data. UART/SPI is used when the host MCU offloads the TCP/IP and BLE stack to the module.
Does the AW-CU570 include regulatory RF certification?
The AW-CU570 module ships with modular approval for major regions (FCC, IC, CE, TELEC, MIC) when the integrator follows AzureWave's antenna and host-PCB layout guidelines. This avoids the integrator having to perform full radiated-emissions testing on their end product. Integrators must still perform unintentional-radiator testing on the host device and observe the antenna keep-out area.
What are the key engineering specifications of the AW-CU570?
Key AW-CU570 specifications: tri-radio tri-band (2.4/5/6 GHz) Wi-Fi 6 (802.11ax) plus BLE 5.2 plus 802.15.4 Thread/Zigbee, NXP RW612 SoC with Arm Cortex-M33, single 3.3 V supply, surface-mount LGA package, integrated PCB antenna with RF pin option. Designed for Matter over Wi-Fi and Matter over Thread interoperability, with hardware crypto acceleration and WPA3 security support.

Technische Referenzdaten für AW-CU570 – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the AW-CU570 when your product must support Wi-Fi 6 plus Bluetooth LE and 802.15.4 (Thread/Zigbee) on a single hardware platform and you want Matter-over-Wi-Fi and Matter-over-Thread interoperability. Choose the AW-CU300 when you only need Wi-Fi 6 (no BLE, no Thread) - cost-reduced single-radio variant in the same LGA family. Choose the AW-CU580 when you need the same tri-radio set with higher RF output power for industrial long-range applications. Choose the LBES5PL2x (Murata) when you specifically need a non-AzureWave cross-brand module for vendor diversification, accepting that 802.15.4 Thread support is reduced or removed.

Vergleich mit Alternativen

Parameter Dieses Produkt AW-CU570-EVB AW-CU300 AW-CU580 LBES5PL2x
Brand AzureWave AzureWave AzureWave AzureWave Murata Manufacturing
Package LGA module LGA module (same family) LGA module LGA module LGA module
Wi-Fi Standard 802.11ax (Wi-Fi 6, tri-band) 802.11ax (same) 802.11ax (Wi-Fi 6) 802.11ax (Wi-Fi 6) 802.11ax (Wi-Fi 6)
Bluetooth BLE 5.2 BLE 5.2 (same) BLE 5.x BLE 5.2 BLE 5.x
802.15.4 (Thread/Zigbee) Yes (Thread/Zigbee) Yes (same) No Yes No (Wi-Fi + BLE only)
Matter Support Matter over Wi-Fi + Matter over Thread Matter over Wi-Fi + Thread (same) Matter over Wi-Fi only Matter over Wi-Fi + Thread Matter over Wi-Fi (varies by SKU)
Supply Voltage 3.3 V (single rail) 3.3 V 3.3 V 3.3 V 3.3 V
Application MCU Core Arm Cortex-M33 (in NXP RW612) Cortex-M33 (same RW612) Cortex-M33 (RW612 family) Cortex-M33 (RW612 family) Varies - typically separate host

Wichtigste Unterscheidungsmerkmale

  • Tri-radio tri-band (Wi-Fi 6 + BLE 5.2 + 802.15.4) on a single silicon (vs. AW-CU300)
  • Single 3.3 V supply simplifies power tree (vs. Discreet Wi-Fi + BLE chipset design)
  • Integrated 802.15.4 plus Matter support (vs. LBES5PL2x (Murata Wi-Fi + BLE module))

Designhinweise

Honor the antenna keep-out area on the host PCB as specified in the AzureWave AW-CU570 Reference Design Guide Rev. 01. The PCB stack-up should keep-out ground planes, copper pours, and component keep-out zones around the antenna region to preserve radiated RF performance and maintain regulatory modular approval. Placing the module at the corner of the host PCB with the antenna facing the edge is the typical layout; do not place the module under a metal battery, shield can, or display.

Provide the AW-CU570 with a clean 3.3 V rail: bulk decoupling (10 uF + 1 uF + 0.1 uF) close to the module's power pins. Although the module accepts 3.3 V directly, Wi-Fi TX bursts draw transient currents that can disturb a noisy rail; use an LDO or quiet buck regulator with adequate transient response. For battery-powered designs, use a load switch to duty-cycle the 3.3 V rail during deep sleep and avoid continuous bias on the regulator.

Do not assume the module's modular approval extends to your end product - you still need unintentional-radiator testing on the host, and you must keep the antenna intact (no metal shielding, no metal-bezel antenna shorts). When changing from a chip-down RW612 design to the AW-CU570 module, your firmware (NXP SDK, MCUXpresso) is unchanged but your pin-out, host-PCB area, and BOM list change. Verify the chosen regulatory domain (FCC/IC/CE/TELEC/MIC) is supported on the exact module variant you order.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Unknown

RoHS compliant per JLCPCB listing and DigiKey Marketplace. Modular regulatory certification (FCC/IC/CE/TELEC/MIC) per AzureWave module datasheet. AEC-Q100 not applicable - this is a wireless MCU module, not an automotive-grade IC.

Daten verifiziert am: 2026-10-16 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

Ähnliche Suchanfragen

AW-CU570 AW-CU570 datasheet AzureWave AW-CU570 tri-radio Wi-Fi 6 BLE 5.3 module NXP RW612 module LGA Matter over Thread wireless module AW-CU570 vs AW-CU300 AW-CU570 drop-in replacement buy AW-CU570 AW-CU570 smart home IoT module AW-CU570 pinout LGA

Verwandte Bauteile & Begriffe

AzureWave AW-CU570 NXP RW612 Arm Cortex-M33 Wi-Fi 6 802.11ax Bluetooth Low Energy 5.2 BLE 5.2 802.15.4 Thread Zigbee Matter LGA package surface-mount module wireless MCU module tri-radio Internet of Things (IoT) smart home industrial IoT RoHS FCC modular approval WPA3 security
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