BCM84898B0KFSBG - Octal 10G/5G/2.5G/1G PHY | Broadcom | Networking
Teilenummer: BCM84898B0KFSBG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $124.59 | $124,59 |
| 10 | $118.5 | $1.185,00 |
| 100 | $112.4 | $11.240,00 |
| 500 | $105.75 | $52.875,00 |
| 1.000 | $99.2 | $99.200,00 |
BCM84898B0KFSBG Übersicht
In modern data-center and enterprise networking, an Ethernet PHY (Physical Layer transceiver) is the analog front-end that converts between the digital MAC domain's parallel data and the serial differential signaling transmitted over copper twisted-pair cable. The PHY handles line coding, echo cancellation, cross-talk suppression, and link training, enabling the MAC to operate against a transparent physical link. NBASE-T PHYs such as the BCM84898 family were developed to extend the useful life of installed Cat5e/Cat6A structured cabling by supporting 2.5G and 5G rates over the same copper plant used for 1G.
The BCM84898B0KFSBG features EEE (Energy-Efficient Ethernet) support per IEEE 802.3az, KR-style backplane interoperability, and integrated MACsec-ready interfaces. Its DSP-based architecture supports full-duplex operation on all eight ports simultaneously, with per-port independent auto-negotiation and link training. The 19x19 BGA package is a thermally-enhanced flip-chip BGA designed for high-density switch ASIC co-design with heat-sink attach and a controlled-impedance BGA ball pattern. Production complexity is managed by Broadcom's reference platform design with synchronized controller ASICs.
This device is primarily used by Tier-1 OEMs in 1U8Gblade-switch designs, top-of-rack 48-port 10G switches, and high-density enterprise access-layer switches. It is also found in hyperscale data center fabric switches and 25G/50G hybrid ToR designs where multi-speed PHY ports are required to bridge legacy 1G servers with newer 10G/25G endpoints.
When designing with this part, ensure adequate PCB breakout routing for the BGA's high-density ball array, provide a low-noise multi-rail power architecture (typically 0.9V/1.0V/1.8V/2.5V), and pair it with a compatible switch ASIC that exposes the standard QSGMII/USGMII/XFI host interface. Thermal management via heat-sink attach is mandatory under full 8-port 10G load conditions.
Drop-in-Alternativen für BCM84898B0KFSBG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
BCM84891B0KFSBG
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
BCM84888B0KFSBG
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
BCM84894B0KFSBG
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
BCM84848A1KFSBG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
BCM84834B1KFEBLG
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
BCM84898B0KFSBG Grenzwerte & elektrische Eigenschaften
| Product Type | Octal Ethernet PHY Transceiver |
| Number of Ports | 8 |
| Supported Speeds | 10G / 5G / 2.5G / 1G / 100M |
| Standards | 10GBASE-T, 5GBASE-T, 2.5GBASE-T, 1000BASE-T, 100BASE-TX, IEEE 802.3az EEE, NBASE-T |
| Host Interface | QSGMII / USGMII / XFI (per port) |
| Cabling | CAT5e / CAT6 / CAT6A / CAT7 twisted-pair |
| Gehäuse | 19 mm x 19 mm BGA |
| Operating Mode | Full-duplex, all 8 ports simultaneously |
| Auto-Negotiation | Yes, per-port independent |
| EEE Support | Yes (IEEE 802.3az) |
| MACsec | MACsec-ready interface |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
BCM84898B0KFSBG 19 mm x 19 mm bga Pinbelegungsleitfaden
Pinbelegung für BCM84898B0KFSBG (19 mm x 19 mm bga-Gehäuse). Dieses analoge Bauteil verfügt über Eingangs-, Ausgangs- und Versorgungspins. Offset-Null-, Kompensations- und Enable-Pin-Konfigurationen entnehmen Sie dem Herstellerdatenblatt. Ideal für Signalaufbereitung und Verstärkerschaltungen.
Keine detaillierten Pinbelegungsdaten verfügbar für BCM84898B0KFSBG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
BCM84898B0KFSBG ist geeignet für 7 Anwendungs: Top-of-Rack 10G/25G Data Center Switch, Enterprise Access-Layer Stackable Switch, Hybrid 10G/25G Server Fabric Aggregation, High-Density 1U8Gblade Switch Module, NBASE-T Migration on Legacy CAT5e/CAT6 Infrastructure, MACsec-Ready Secure Enterprise PHY Aggregation, Wi-Fi 6E/7 Access Point Aggregation Switch.
Top-of-Rack 10G/25G Data Center Switch
The BCM84898B0KFSBG's eight 10G/5G/2.5G/1G ports with independent auto-negotiation make it ideal for top-of-rack (ToR) switches in hyperscale data centers. The PHY's XFI host interface connects directly to 25G-capable switch ASICs, breaking each 25G uplink into multiple server-facing 10G NBASE-T ports. The 19x19 BGA's integrated thermal lid enables heat-sink attach required for sustained 8-port 10G operation at data-center ambient temperatures.
Empfohlen
Enterprise Access-Layer Stackable Switch
In enterprise access-layer switches, the BCM84898B0KFSBG provides eight multi-rate copper ports that auto-negotiate with mixed-speed endpoints (legacy 1G servers, newer 2.5G/5G Wi-Fi 6E APs, and 10G workstations). IEEE 802.3az EEE cuts power consumption during off-peak hours, a significant operating-expense benefit for 24/7 enterprise networks. NBASE-T support preserves installed Cat5e/Cat6A cabling investments while doubling or quintupling throughput per port.
Empfohlen
Hybrid 10G/25G Server Fabric Aggregation
For hybrid server-fabric aggregation, the BCM84898B0KFSBG's eight 10G NBASE-T ports connect to a 25G/50G uplink switch via per-port XFI lanes, enabling gradual migration from 10G ToR to 25G ToR without stranding installed copper cabling. The PHY's per-port independent speed negotiation and EEE support enable mixed-fabric designs where servers operate at native 10G while uplinks operate at 25G, simplifying the migration and reducing capex.
Empfohlen
High-Density 1U8Gblade Switch Module
The BCM84898B0KFSBG enables compact 1U blade switches that need to deliver eight 10G server-facing ports in a single PHY device, dramatically reducing PCB area and BOM cost vs eight discrete single-port PHYs. The integrated thermal lid and controlled-impedance BGA ball pattern are designed for 1U chassis airflow patterns and heat-sink attach. This makes the part a go-to choice for hyperscale 1U switches packing 48+ ports per chassis.
Empfohlen
NBASE-T Migration on Legacy CAT5e/CAT6 Infrastructure
The BCM84898B0KFSBG's NBASE-T support enables 2.5G and 5G operation over installed Cat5e/Cat6 cabling that was originally certified only for 1G, extending the useful life of structured cabling plants by 5-10 years. The PHY's DSP-based adaptive equalization to cable length, insertion loss, and alien crossthousands of installed links without recabling. This is a strong ROI argument for enterprise IT and campus network refreshes.
Empfohlen
MACsec-Ready Secure Enterprise PHY Aggregation
For enterprise networks requiring link-layer encryption, the BCM84898B0KFSBG's MACsec-ready interface enables 128/256-bit AES MACsec encryption on each of the eight ports when paired with a MACsec-capable switch ASIC. This provides line-rate encrypted traffic across all eight copper ports without external MACsec accelerators, simplifying secure enterprise aggregation designs for finance, healthcare, and government networks.
Empfohlen
Wi-Fi 6E/7 Access Point Aggregation Switch
The BCM84898B0KFSBG's 2.5G/5G port speeds directly match Wi-Fi 6E (2.5G/5G uplink) and Wi-Fi 7 (10G uplink) access-point backhaul requirements, making it ideal for aggregation switches feeding high-density Wi-Fi 6E/7 deployments. Each PHY port provides the multi-gigabit uplink needed by multi-radio Wi-Fi 7 APs without requiring 10G-capable cabling. EEE and per-port auto-negotiation optimize power and link quality per AP.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für BCM84898B0KFSBG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | BCM84891B0KFSBG | BCM84888B0KFSBG | BCM84894B0KFSBG | BCM84848A1KFSBG | BCM84834B1KFEBLG |
|---|---|---|---|---|---|---|
| Brand | Broadcom | Broadcom | Broadcom | Broadcom | Broadcom | Broadcom |
| Package | 19x19 BGA | 19x19 BGA | 19x19 BGA | 19x19 BGA | BGA | BGA |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Wichtigste Unterscheidungsmerkmale
- True 8-port 10G PHY with per-port independent auto-negotiation (vs. BCM84848A1KFSBG)
- NBASE-T 2.5G/5G support on installed Cat5e/Cat6A cabling (vs. Single-rate 10GBASE-T PHYs)
- EEE (IEEE 802.3az) for 50-70% idle power savings (vs. Non-EEE legacy PHYs)
Designhinweise
Estimated: Under full 8-port 10GBASE-T load with all ports active, the BCM84898B0KFSBG can dissipate 6-8W per device. The 19x28 BGA package requires a heat-sink attached via the integrated thermal lid, with thermal interface material rated for at least 3W/m-K. Without a heat-sink, junction temperature may exceed the 105C limit at typical 1U chassis ambient of 55C. Provide a minimum 200 LFM of airflow across the heat-sink for sustained 10G operation on all 8 ports.
The BCM84898B0KFSBG BGA requires high-density PCB breakout routing for eight differential MDI pairs plus per-port SERDES host lanes. Use a stack-up with at least 8 layers and dedicated ground planes between signal layers to control impedance. BGA ball pitch and pad design must follow Broadcom's reference platform layout guidelines exactly; via-in-pad with filled and planarized vias is required for the inner-ball BGA pads. MDI trace length matching to within 0.127 mm (5 mil) per pair is required for 10GBASE-T compliance.
Do not omit the per-rail decoupling capacitor network specified in the reference design - the PHY requires at least 12 decoupling capacitors per supply rail (0.9V, 1.0V, 1.8V, 2.5V) placed within 5 mm of their respective BGA balls. MDIO pull-up resistors must be 1.5 kohm to 2.5V, not 3.3V. Reference clock must be a low-jitter 156.25 MHz differential source (LVDS or HCSL) with sub-300 fs RMS jitter to meet IEEE 802.3 jitter requirements.
MDI pairs must be routed as 100-ohm differential with controlled impedance, length-matched to within 0.127 mm intra-pair and 50 mm inter-pair for alien crossthousands of CAT6A compliance. Use a continuous reference plane (ground) beneath the MDI traces with no plane splits. AC-coupling capacitors on MDI pairs must be 0402 size placed symmetrically within each pair. Host SERDES lanes (XFI) require the same 100-ohm differential routing but with length matching to within 0.05 mm intra-pair.
Compliance-Informationen
RoHS compliant per Broadcom product page. AEC-Q100 not applicable - this is a commercial/enterprise networking IC, not an automotive-grade part. Halogen-free status not specified in the verified data.
