BCM84898B0KFSBG - Octal 10G/5G/2.5G/1G PHY | Broadcom | Networking
Référence : BCM84898B0KFSBG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $124.59 | $124,59 |
| 10 | $118.5 | $1 185,00 |
| 100 | $112.4 | $11 240,00 |
| 500 | $105.75 | $52 875,00 |
| 1 000 | $99.2 | $99 200,00 |
BCM84898B0KFSBG Présentation
In modern data-center and enterprise networking, an Ethernet PHY (Physical Layer transceiver) is the analog front-end that converts between the digital MAC domain's parallel data and the serial differential signaling transmitted over copper twisted-pair cable. The PHY handles line coding, echo cancellation, cross-talk suppression, and link training, enabling the MAC to operate against a transparent physical link. NBASE-T PHYs such as the BCM84898 family were developed to extend the useful life of installed Cat5e/Cat6A structured cabling by supporting 2.5G and 5G rates over the same copper plant used for 1G.
The BCM84898B0KFSBG features EEE (Energy-Efficient Ethernet) support per IEEE 802.3az, KR-style backplane interoperability, and integrated MACsec-ready interfaces. Its DSP-based architecture supports full-duplex operation on all eight ports simultaneously, with per-port independent auto-negotiation and link training. The 19x19 BGA package is a thermally-enhanced flip-chip BGA designed for high-density switch ASIC co-design with heat-sink attach and a controlled-impedance BGA ball pattern. Production complexity is managed by Broadcom's reference platform design with synchronized controller ASICs.
This device is primarily used by Tier-1 OEMs in 1U8Gblade-switch designs, top-of-rack 48-port 10G switches, and high-density enterprise access-layer switches. It is also found in hyperscale data center fabric switches and 25G/50G hybrid ToR designs where multi-speed PHY ports are required to bridge legacy 1G servers with newer 10G/25G endpoints.
When designing with this part, ensure adequate PCB breakout routing for the BGA's high-density ball array, provide a low-noise multi-rail power architecture (typically 0.9V/1.0V/1.8V/2.5V), and pair it with a compatible switch ASIC that exposes the standard QSGMII/USGMII/XFI host interface. Thermal management via heat-sink attach is mandatory under full 8-port 10G load conditions.
Alternatives de remplacement direct pour BCM84898B0KFSBG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
BCM84891B0KFSBG
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
BCM84888B0KFSBG
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
BCM84894B0KFSBG
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
BCM84848A1KFSBG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
BCM84834B1KFEBLG
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
BCM84898B0KFSBG Valeurs maximales et caractéristiques électriques
| Product Type | Octal Ethernet PHY Transceiver |
| Number of Ports | 8 |
| Supported Speeds | 10G / 5G / 2.5G / 1G / 100M |
| Standards | 10GBASE-T, 5GBASE-T, 2.5GBASE-T, 1000BASE-T, 100BASE-TX, IEEE 802.3az EEE, NBASE-T |
| Host Interface | QSGMII / USGMII / XFI (per port) |
| Cabling | CAT5e / CAT6 / CAT6A / CAT7 twisted-pair |
| Boîtier | 19 mm x 19 mm BGA |
| Operating Mode | Full-duplex, all 8 ports simultaneously |
| Auto-Negotiation | Yes, per-port independent |
| EEE Support | Yes (IEEE 802.3az) |
| MACsec | MACsec-ready interface |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
Guide de configuration des broches du BCM84898B0KFSBG 19 mm x 19 mm bga
Configuration des broches du BCM84898B0KFSBG (boîtier 19 mm x 19 mm bga). Ce composant analogique comporte des broches d'entrée, de sortie et d'alimentation. Consultez la fiche technique du fabricant pour les configurations des broches d'annulation d'offset, de compensation et d'activation. Idéal pour le conditionnement de signaux et les circuits amplificateurs.
Aucune donnée de brochage détaillée disponible pour BCM84898B0KFSBG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
BCM84898B0KFSBG convient pour 7 applications: Top-of-Rack 10G/25G Data Center Switch, Enterprise Access-Layer Stackable Switch, Hybrid 10G/25G Server Fabric Aggregation, High-Density 1U8Gblade Switch Module, NBASE-T Migration on Legacy CAT5e/CAT6 Infrastructure, MACsec-Ready Secure Enterprise PHY Aggregation, Wi-Fi 6E/7 Access Point Aggregation Switch.
Top-of-Rack 10G/25G Data Center Switch
The BCM84898B0KFSBG's eight 10G/5G/2.5G/1G ports with independent auto-negotiation make it ideal for top-of-rack (ToR) switches in hyperscale data centers. The PHY's XFI host interface connects directly to 25G-capable switch ASICs, breaking each 25G uplink into multiple server-facing 10G NBASE-T ports. The 19x19 BGA's integrated thermal lid enables heat-sink attach required for sustained 8-port 10G operation at data-center ambient temperatures.
Recommandé
Enterprise Access-Layer Stackable Switch
In enterprise access-layer switches, the BCM84898B0KFSBG provides eight multi-rate copper ports that auto-negotiate with mixed-speed endpoints (legacy 1G servers, newer 2.5G/5G Wi-Fi 6E APs, and 10G workstations). IEEE 802.3az EEE cuts power consumption during off-peak hours, a significant operating-expense benefit for 24/7 enterprise networks. NBASE-T support preserves installed Cat5e/Cat6A cabling investments while doubling or quintupling throughput per port.
Recommandé
Hybrid 10G/25G Server Fabric Aggregation
For hybrid server-fabric aggregation, the BCM84898B0KFSBG's eight 10G NBASE-T ports connect to a 25G/50G uplink switch via per-port XFI lanes, enabling gradual migration from 10G ToR to 25G ToR without stranding installed copper cabling. The PHY's per-port independent speed negotiation and EEE support enable mixed-fabric designs where servers operate at native 10G while uplinks operate at 25G, simplifying the migration and reducing capex.
Recommandé
High-Density 1U8Gblade Switch Module
The BCM84898B0KFSBG enables compact 1U blade switches that need to deliver eight 10G server-facing ports in a single PHY device, dramatically reducing PCB area and BOM cost vs eight discrete single-port PHYs. The integrated thermal lid and controlled-impedance BGA ball pattern are designed for 1U chassis airflow patterns and heat-sink attach. This makes the part a go-to choice for hyperscale 1U switches packing 48+ ports per chassis.
Recommandé
NBASE-T Migration on Legacy CAT5e/CAT6 Infrastructure
The BCM84898B0KFSBG's NBASE-T support enables 2.5G and 5G operation over installed Cat5e/Cat6 cabling that was originally certified only for 1G, extending the useful life of structured cabling plants by 5-10 years. The PHY's DSP-based adaptive equalization to cable length, insertion loss, and alien crossthousands of installed links without recabling. This is a strong ROI argument for enterprise IT and campus network refreshes.
Recommandé
MACsec-Ready Secure Enterprise PHY Aggregation
For enterprise networks requiring link-layer encryption, the BCM84898B0KFSBG's MACsec-ready interface enables 128/256-bit AES MACsec encryption on each of the eight ports when paired with a MACsec-capable switch ASIC. This provides line-rate encrypted traffic across all eight copper ports without external MACsec accelerators, simplifying secure enterprise aggregation designs for finance, healthcare, and government networks.
Recommandé
Wi-Fi 6E/7 Access Point Aggregation Switch
The BCM84898B0KFSBG's 2.5G/5G port speeds directly match Wi-Fi 6E (2.5G/5G uplink) and Wi-Fi 7 (10G uplink) access-point backhaul requirements, making it ideal for aggregation switches feeding high-density Wi-Fi 6E/7 deployments. Each PHY port provides the multi-gigabit uplink needed by multi-radio Wi-Fi 7 APs without requiring 10G-capable cabling. EEE and per-port auto-negotiation optimize power and link quality per AP.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour BCM84898B0KFSBG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | BCM84891B0KFSBG | BCM84888B0KFSBG | BCM84894B0KFSBG | BCM84848A1KFSBG | BCM84834B1KFEBLG |
|---|---|---|---|---|---|---|
| Brand | Broadcom | Broadcom | Broadcom | Broadcom | Broadcom | Broadcom |
| Package | 19x19 BGA | 19x19 BGA | 19x19 BGA | 19x19 BGA | BGA | BGA |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Principaux différenciateurs
- True 8-port 10G PHY with per-port independent auto-negotiation (vs BCM84848A1KFSBG)
- NBASE-T 2.5G/5G support on installed Cat5e/Cat6A cabling (vs Single-rate 10GBASE-T PHYs)
- EEE (IEEE 802.3az) for 50-70% idle power savings (vs Non-EEE legacy PHYs)
Notes de conception
Estimated: Under full 8-port 10GBASE-T load with all ports active, the BCM84898B0KFSBG can dissipate 6-8W per device. The 19x28 BGA package requires a heat-sink attached via the integrated thermal lid, with thermal interface material rated for at least 3W/m-K. Without a heat-sink, junction temperature may exceed the 105C limit at typical 1U chassis ambient of 55C. Provide a minimum 200 LFM of airflow across the heat-sink for sustained 10G operation on all 8 ports.
The BCM84898B0KFSBG BGA requires high-density PCB breakout routing for eight differential MDI pairs plus per-port SERDES host lanes. Use a stack-up with at least 8 layers and dedicated ground planes between signal layers to control impedance. BGA ball pitch and pad design must follow Broadcom's reference platform layout guidelines exactly; via-in-pad with filled and planarized vias is required for the inner-ball BGA pads. MDI trace length matching to within 0.127 mm (5 mil) per pair is required for 10GBASE-T compliance.
Do not omit the per-rail decoupling capacitor network specified in the reference design - the PHY requires at least 12 decoupling capacitors per supply rail (0.9V, 1.0V, 1.8V, 2.5V) placed within 5 mm of their respective BGA balls. MDIO pull-up resistors must be 1.5 kohm to 2.5V, not 3.3V. Reference clock must be a low-jitter 156.25 MHz differential source (LVDS or HCSL) with sub-300 fs RMS jitter to meet IEEE 802.3 jitter requirements.
MDI pairs must be routed as 100-ohm differential with controlled impedance, length-matched to within 0.127 mm intra-pair and 50 mm inter-pair for alien crossthousands of CAT6A compliance. Use a continuous reference plane (ground) beneath the MDI traces with no plane splits. AC-coupling capacitors on MDI pairs must be 0402 size placed symmetrically within each pair. Host SERDES lanes (XFI) require the same 100-ohm differential routing but with length matching to within 0.05 mm intra-pair.
Informations de conformité
RoHS compliant per Broadcom product page. AEC-Q100 not applicable - this is a commercial/enterprise networking IC, not an automotive-grade part. Halogen-free status not specified in the verified data.
