DSPIC33CH64MP206-E/MR - 100MHz Dual-Core 16-Bit DSC | Microchip
Teilenummer: DSPIC33CH64MP206-E/MR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $5.96 | $5,96 |
| 10 | $5.36 | $53,60 |
| 100 | $4.78 | $478,00 |
| 500 | $4.18 | $2.090,00 |
| 1.000 | $3.59 | $3.590,00 |
DSPIC33CH64MP206-E/MR Übersicht
A Digital Signal Controller (DSC) is a hybrid class of microcontroller that fuses a deterministic MCU pipeline with a single-cycle DSP engine. The dsPIC33CH family builds on this with dual-core heterogeneous partitioning: one core supervises the system, runs communications and housekeeping, while the second core deterministically executes time-critical DSP loops. Architecturally the chip sits in the power-management / motor-control tier of the embedded hierarchy - DSC -> microcontroller -> embedded processor -> semiconductor.
Key features include dedicated high-resolution 16-bit PWM channels optimized for digital power conversion, integrated CAN Flexible Data (CAN FD) peripherals, up to 12-bit ADC at 3.5 Msps, configurable logic cells, and an integrated op-amp. Functional Safety (FuSa) support libraries and Class B/Safety diagnostics are bundled. The 64-pin QFN package provides compact board footprint while preserving analog pinout density.
Typical applications include wireless charging transmitters, server and telecom SMPS, BLDC/PMSM motor control, drone ESCs, automotive sensor fusion, and digital LED lighting. The dual-core architecture lets firmware split time-critical control loops from user-interface code without task-switching jitter. When designing with this part, populate the exposed thermal pad with a continuous copper plane and stitch vias to inner ground layers; at 200 MIPS the slave core can pull substantial current during heavy DSP bursts.
Drop-in-Alternativen für DSPIC33CH64MP206-E/MR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33CH64MP206-E/MR (gleiche Bauform und Footprint) – abweichend in Core Architecture, Package, Operating Temperature, ADC, PWM Resolution.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33CH64MP206-I/MR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33CH128MP206-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$5.45 / Stück
Datenblatt ansehen →DSPIC33CH128MP506-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$5.62 / Stück
Datenblatt ansehen →DSPIC33CH512MP206-I/MR
✅ Drop-In✓ Auf Lager
$3.96 / Stück
Datenblatt ansehen →DSPIC33CK64MP206-I/MR
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33CH64MP202-I/2N
✅ Drop-In✓ Auf Lager
$3.31 / Stück
Datenblatt ansehen →DSPIC33CH64MP206-E/MR Grenzwerte & elektrische Eigenschaften
| Product Family | dsPIC33CH dual-core DSC |
| Core Architecture | Dual dsPIC33C DSC cores (master + slave) |
| Master Core Speed | 180 MHz (200 MIPS) |
| Slave Core Speed | 200 MHz |
| Program Memory (Flash) | 64 KB |
| Data RAM (SRAM) | 8 KB |
| PRAM | 16 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| Betriebstemperatur | -40C to +125C (E grade) |
| Gehäuse | 64-VFQFN exposed pad, 9x9 mm (MR) |
| Montageart | Surface Mount |
| ADC | 12-bit, 3.5 Msps |
| PWM Resolution | 16-bit high-resolution PWM |
| CAN Interface | CAN FD |
| MSL-Level | 3 (168 hours) |
| RoHS-Status | Compliant |
| Functional Safety | FuSa libraries included |
DSPIC33CH64MP206-E/MR Pin-Konfiguration
| Pin 1 | RP60/RB0 — Remappable I/O / AN0 (ADC input) |
| Pin 2 | RP61/RB1 — Remappable I/O / AN1 (ADC input) |
| Pin 3 | RP62/RB2 — Remappable I/O / AN2 (ADC input) |
| Pin 4 | RP63/RB3 — Remappable I/O / AN3 (ADC input) |
| Pin 5 | RP64/RB4 — Remappable I/O / AN4 (ADC input) |
| Pin 6 | RP65/RB5 — Remappable I/O / AN5 (ADC input) |
| Pin 7 | RP66/RB6 — Remappable I/O / AN6 (ADC input) |
| Pin 8 | RP67/RB7 — Remappable I/O / AN7 (ADC input) |
| Pin 9 | VSS — Ground |
| Pin 10 | VDD |
| Pin 11 | RP68/RB8 — Remappable I/O / AN8 (ADC input) |
| Pin 12 | RP69/RB9 — Remappable I/O / AN9 (ADC input) |
| Pin 13 | RP70/RB10 — Remappable I/O / AN10 (ADC input) |
| Pin 14 | RP71/RB11 — Remappable I/O / AN11 (ADC input) |
| Pin 15 | RP72/RB12 — Remappable I/O / AN12 (ADC input) |
| Pin 16 | RP73/RB13 — Remappable I/O / AN13 (ADC input) |
| Pin 17 | RP74/RB14 — Remappable I/O / AN14 (ADC input) |
| Pin 18 | RP75/RB15 — Remappable I/O / AN15 (ADC input) |
| Pin 19 | VSS — Ground |
| Pin 20 | VDD — 3.3 V core supply |
| Pin 21 | PWM1H/RP48 — PWM output 1 high-side |
| Pin 22 | PWM1L/RP49 — PWM output 1 low-side |
| Pin 23 | PWM2H/RP50 — PWM output 2 high-side |
| Pin 24 | PWM2L/RP51 — PWM output 2 low-side |
| Pin 25 | PWM3H/RP52 — PWM output 3 high-side |
| Pin 26 | PWM3L/RP53 — PWM output 3 low-side |
| Pin 27 | PWM4H/RP54 — PWM output 4 high-side |
| Pin 28 | PWM4L/RP55 — PWM output 4 low-side |
| Pin 29 | CAN1TX/RP40 — CAN-FD transmit / remappable I/O |
| Pin 30 | CAN1RX/RP41 — CAN-FD receive / remappable I/O |
| Pin 31 | U1TX/RP32 — UART1 transmit / remappable I/O |
| Pin 32 | U1RX/RP33 — UART1 receive / remappable I/O |
| Pin 33 | RP76/RC0 — Remappable I/O / OSC1 (crystal in) |
| Pin 34 | RP77/RC1 — Remappable I/O / OSC2 (crystal out) |
| Pin 35 | RP78/RC2 — Remappable I/O |
| Pin 36 | RP79/RC3 — Remappable I/O |
| Pin 37 | RP80/RC4 — Remappable I/O |
| Pin 38 | RP81/RC5 — Remappable I/O |
| Pin 39 | RP82/RC6 — Remappable I/O |
| Pin 40 | RP83/RC7 — Remappable I/O |
| Pin 41 | RP84/RC8 — Remappable I/O |
| Pin 42 | RP85/RC9 — Remappable I/O |
| Pin 43 | VSS — Ground |
| Pin 44 | VDD — 3.3 V core supply |
| Pin 45 | RP86/RC10 — Remappable I/O |
| Pin 46 | RP87/RC11 — Remappable I/O |
| Pin 47 | RP88/RC12 — Remappable I/O |
| Pin 48 | RP89/RC13 — Remappable I/O |
| Pin 49 | RP90/RC14 — Remappable I/O |
| Pin 50 | RP91/RC15 — Remappable I/O |
| Pin 51 | RP92/RD0 — Remappable I/O |
| Pin 52 | RP93/RD1 — Remappable I/O |
| Pin 53 | RP94/RD2 — Remappable I/O |
| Pin 54 | RP95/RD3 — Remappable I/O |
| Pin 55 | RP96/RD4 — Remappable I/O |
| Pin 56 | RP97/RD5 — Remappable I/O |
| Pin 57 | RP98/RD6 — Remappable I/O |
| Pin 58 | RP99/RD7 — Remappable I/O |
| Pin 59 | RP100/RD8 — Remappable I/O |
| Pin 60 | RP101/RD9 — Remappable I/O |
| Pin 61 | RP102/RD10 — Remappable I/O |
| Pin 62 | RP103/RD11 — Remappable I/O |
| Pin 63 | MCLR — Master clear / reset (active low) |
| Pin 64 | RP56/RD7 — Remappable I/O / TMS (debug) |
| Pin EP | EP — Exposed thermal pad - must be soldered to ground pour |
Typische Anwendungen
DSPIC33CH64MP206-E/MR ist geeignet für 6 Anwendungs: Wireless Charging Transmitter, BLDC / PMSM Motor Control (FOC), Server / Telecom SMPS, Drone Electronic Speed Controller (ESC), Digital LED Lighting Driver, Automotive Sensor Fusion ECU.
Wireless Charging Transmitter
The DSPIC33CH64MP206-E/MR is well suited to wireless charging transmitter controllers because the dual-core architecture lets the slave core execute the precise resonant-tank control loop at deterministic 200 MHz while the master runs the Qi protocol stack, foreign object detection and CAN-FD reporting to the vehicle bus. The 16-bit high-resolution PWM with 250 ps edge placement produces clean inverter switching at 100-200 kHz with sub-1% duty control, meeting the WPC1.3 EPP efficiency envelope. The integrated 12-bit 3.5 Msps ADC digitises both primary current and resonant capacitor voltage in the same cycle, enabling cycle-by-cycle phase-shift adjustment for zero-voltage switching (ZVS).
Empfohlen
BLDC / PMSM Motor Control (FOC)
Field-Oriented Control (FOC) of a PMSM or BLDC motor requires an outer speed loop, inner current loops and space-vector PWM all running deterministically at the same control period. On the DSPIC33CH64MP206-E/MR the slave core is dedicated to the FOC inner loop while the master handles CAN-FD command reception, position-sensor feedback parsing (encoder/Hall/Resolver) and user I/O. At 200 MIPS the slave can complete a 32 kHz FOC update including Park/Clarke transforms and SVM with comfortable margin, and the 16-bit PWM provides 1 ns resolution at 1 nS tick for silent commutation. The part supports sensorless operation via the integrated ADC and on-chip op-amps for current sensing.
Empfohlen
Server / Telecom SMPS
High-efficiency 48 V-input server and telecom power supplies (PFC + LLC or PFC + phase-shifted full-bridge) demand tight control of multiple switching phases with sub-100 ns regulation loop latency. The DSPIC33CH64MP206-E/MR's slave core executes the average-current-mode PFC and primary-side LLC control loops while the master manages PMBus, telemetry, fan curves and secondary-side synchronous rectification timing via the high-resolution PWM. CAN FD support enables status reporting to redundant controllers. Functional Safety libraries support SIL-2 design flows for AC/DC and DC/DC converters.
Empfohlen
Drone Electronic Speed Controller (ESC)
Multi-rotor drone ESCs require fast throttle update rates, high-resolution commutation and reliable sensorless motor startup under wide operating-temperature swings. The DSPIC33CH64MP206-E/MR delivers 200 MIPS on its slave core for 48 kHz FOC update rate with negligible jitter, while the master handles DShot/OneShot protocol parsing and battery telemetry. The -40C to +125C temperature grade covers cold-soak and high-power hover conditions. The 64-QFN 9x9 mm footprint enables ESC PCBs under 15x15 mm including FET stage.
Empfohlen
Digital LED Lighting Driver
High-end architectural and stage lighting fixtures use digital constant-current buck or boost drivers with per-channel DMX-512 or DALI control. The DSPIC33CH64MP206-E/MR's slave core generates up to 16 channels of 16-bit high-resolution PWM at frequencies suitable for dimming with no audible beating and no visible strobing on camera. The master handles DALI/DMX protocol, current-share control and temperature-compensation loops. Integrated CAN FD also allows stage fixture networks. The exposed pad on the QFN simplifies thermal management for high-channel-count designs.
Empfohlen
Automotive Sensor Fusion ECU
ADAS sensor-fusion ECUs process IMU, radar and vehicle-bus data with bounded latency. The DSPIC33CH64MP206-E/MR supports the slave-core architectural split required by Microchip's Functional Safety libraries, isolating time-critical sensor-fusion DSP from the host processor's communications. CAN FD channels enable 2 Mbps data exchange with the chassis CAN bus. Designers targeting automotive qualification should select the AEC-Q100-qualified ordering code in the same 64-QFN package.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33CH64MP206-E/MR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33CH64MP206-I/MR | DSPIC33CH128MP206-I/PT | DSPIC33CH128MP506-I/PT | DSPIC33CH512MP206-I/MR | DSPIC33CK64MP206-I/MR | DSPIC33CH64MP202-I/2N |
|---|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm, MR) | 64-QFN (9x9 mm, MR) - same | 64-TQFP (PT) | 64-TQFP (PT) | 64-QFN (9x9 mm, MR) - same | 64-QFN (9x9 mm, MR) - same | 28-uQFN (2N) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Count | 2 (master + slave) | 2 (master + slave) | 2 (master + slave) | 2 (master + slave) | 2 (master + slave) | 1 (single-core) | 2 (master + slave) |
| Master Core Max Frequency | 180 MHz (200 MIPS) | 180 MHz (200 MIPS) | 180 MHz (200 MIPS) | 180 MHz (200 MIPS) | 180 MHz (200 MIPS) | 100 MHz | 180 MHz (200 MIPS) |
| Flash Memory | 64 KB | 64 KB | 128 KB | 128 KB | 512 KB | 64 KB | 64 KB |
| SRAM | 8 KB | 8 KB | 16 KB | 16 KB | 64 KB | 8 KB | 8 KB |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
| CAN Interface | CAN FD | CAN FD | CAN FD | CAN FD | CAN FD | CAN FD | CAN FD |
Wichtigste Unterscheidungsmerkmale
- Dual-core heterogeneous architecture with deterministic slave core (vs. DSPIC33CK64MP206-I/MR)
- Extended temperature grade -40C to +125C included (vs. DSPIC33CH64MP206-I/MR)
- Integrated functional safety (FuSa) libraries (vs. DSPIC33CK64MP206-I/MR)
Designhinweise
The exposed thermal pad (EP) of the 64-QFN (9x9 mm) package must be soldered to a continuous ground copper pour and stitched with thermal vias (typically 9-16 vias on a 1.0 mm grid) to inner-ground layers. At 200 MIPS the slave core can briefly consume 150 mA during heavy DSP bursts; without the thermal pad soldered junction temperature can exceed the 150C absolute maximum within seconds of sustained DSP load, triggering thermal shutdown.
Place a 10 uF bulk capacitor plus a 100 nF decoupling capacitor on every VDD pin pair (pins 10, 20, 44 of the 64-QFN), and put a 1 uF + 100 nF combination adjacent to the analog AVDD pin. Keep analog and digital ground returns separate and join at a single point near the EP pad to prevent digital switching noise from coupling into the ADC reference. The crystal traces (OSC1/OSC2) must be guarded by ground and routed as short as possible.
Estimated: at 3.3 V VDD and 180 MHz master + 200 MHz slave, the part can draw 120-180 mA peak from VDD, so do not assume a 100 mA regulator is enough. Use a low-noise LDO such as the MCP1755 or a buck regulator with at least 300 mA rating and 33 uF output capacitance. The MCLR pin requires a 10 kohm pull-up to VDD; a floating MCLR will hold the part in reset. Programming pins PGECx/PGEDx must not be left floating during normal operation.
The PWM outputs slew at 1 ns edges; route the PWM outputs away from the analog ADC inputs and keep a ground-guard trace between them. For high-frequency PWM (>100 kHz), reduce the area of the PWM output loop by routing the high-side and low-side traces on adjacent layers with a 6 mil separation. Source-terminate PWM signals longer than 25 mm if you observe ringing above 50 MHz on the gate of the driven FET.
Compliance-Informationen
RoHS compliant per Microchip product page. E grade = industrial extended temperature, NOT AEC-Q100; for automotive select the AEC-Q100-qualified ordering code in the same 64-QFN package. FuSa libraries are bundled but require design process documentation.
