DSPIC33CK64MP506-I/MR - 100MHz DSC, 64KB Flash, CAN-FD | Microchip
Teilenummer: DSPIC33CK64MP506-I/MR ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2.19 | $2,19 |
| 10 | $2.06 | $20,60 |
| 100 | $1.88 | $188,00 |
| 500 | $1.72 | $860,00 |
| 1.000 | $1.58 | $1.580,00 |
DSPIC33CK64MP506-I/MR Übersicht
A digital signal controller combines the compute throughput of a DSP with the peripheral integration and interrupt responsiveness of a microcontroller. Within the power-management hierarchy, the dsPIC33CK sits between general-purpose MCUs and dedicated DSPs, targeting digital power conversion, motor control, and advanced sensing where control loops must execute in microseconds.
Key features include a 100 MHz pipelined core with DSP instructions (single-cycle multiply, fast 6-cycle divide), a high-speed 12-bit ADC capable of 3.5 Msps, three on-chip operational amplifiers, three analog comparators, high-resolution PWM for precision power stages, and CAN Flexible Data (CAN-FD) for automotive and industrial networking. A Peripheral Trigger Generator (PTG) enables autonomous peripheral sequencing that offloads the CPU.
Architecturally, the dsPIC33CK core integrates a DSP engine with dual 40-bit accumulators and hardware looping, while the high-resolution PWM modules provide nanosecond-edge resolution for LLC, totem-pole PFC, and synchronous buck topologies. The 3.5 Msps 12-bit ADC supports simultaneous multi-channel sampling of current and voltage sense signals without external front-ends in many designs.
Typical applications include digital switch-mode power supplies, BLDC and PMSM motor drives with field-oriented control, automotive and industrial CAN-FD nodes, power-factor-correction stages, and high-density battery chargers. The three integrated op-amps reduce BOM cost by eliminating external current-sense amplifiers.
Design consideration: all VDD/VSS pairs must be connected and any PGECx/PGEDx pair must be used consistently as a pair for ICSP programming, per Microchip programming guidance; mixing PGEC2 with PGED3 will cause programming failure.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für DSPIC33CK64MP506-I/MR – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33CK64MP506-I/MR (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, Program Flash, PWM, Core.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33CK32MP506-I/MR
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.1 / Stück
Datenblatt ansehen →DSPIC33CK32MP506-E/MR
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.55 / Stück
Datenblatt ansehen →DSPIC33CK128MP506-I/MR
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$4.35 / Stück
Datenblatt ansehen →DSPIC33CK128MP506-E/MR
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$4.42 / Stück
Datenblatt ansehen →DSPIC33CK64MP505-I/MR
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33CK64MP506-I/MR Grenzwerte & elektrische Eigenschaften
| Core | dsPIC33CK 16-bit DSC core |
| CPU Speed | 100 MHz |
| Program Memory (Flash) | 64 KB (64K x 8) |
| RAM | 8 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| ADC Resolution | 12-bit |
| ADC Conversion Rate | 3.5 Msps |
| On-chip Op-Amps | 3 |
| Analog Comparators | 3 |
| Communication Interfaces | CAN-FD, UART, SPI, I2C |
| High-Resolution PWM | Yes |
| Peripheral Trigger Generator (PTG) | Yes |
| Betriebstemperatur | -40C to +125C |
| Gehäuse | 64-QFN (9x9 mm), exposed pad |
| Montageart | Surface Mount |
| Functional Safety Support | FuSa family designation (per Microchip) |
| DAC (on-chip) | Yes, for comparator references |
| RoHS-Status | Compliant |
DSPIC33CK64MP506-I/MR 64-qfn (9x9 mm), exposed pad Pinbelegungsleitfaden
Pinbelegung für DSPIC33CK64MP506-I/MR (64-qfn (9x9 mm), exposed pad-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33CK64MP506-I/MR.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33CK64MP506-I/MR ist geeignet für 6 Anwendungs: Digital Switch-Mode Power Supplies, BLDC/PMSM Motor Drives (Field-Oriented Control), Automotive CAN-FD Network Nodes, Power Factor Correction (PFC) Stages, High-Density Battery Chargers, Advanced Sensing and Industrial IoT Nodes.
Digital Switch-Mode Power Supplies
The DSPIC33CK64MP506-I/MR fits digital power conversion because its 100 MHz DSP core closes voltage- and current-mode loops in microseconds while the high-resolution PWM provides nanosecond-level edge adjustment for LLC, totem-pole PFC, and synchronous buck stages. The 3.5 Msps 12-bit ADC samples output voltage and inductor current with enough bandwidth to implement predictive and multi-loop control without external sample-and-hold circuitry. In a typical topology, the DSC sits between the feedback divider and the gate drivers, replacing analog compensation networks with firmware - enabling adaptive mode switching, telemetry over UART or CAN-FD, and firmware-based protection such as cycle-by-cycle current limiting using the three on-chip comparators. The integrated op-amps condition shunt-current signals directly, reducing BOM cost.
Empfohlen
BLDC/PMSM Motor Drives (Field-Oriented Control)
Field-oriented control demands fast current-loop math and precise PWM timing, both native strengths of the DSPIC33CK64MP506-I/MR. Its 100 MHz core with single-cycle multiply and fast 6-cycle divide executes Clarke/Park transforms and PI current loops at switching frequencies beyond 100 kHz, while the 3.5 Msps ADC captures two or three phase shunt currents simultaneously. The three integrated op-amps amplify low-side shunt signals internally, eliminating external current-sense amplifiers and their offset errors. High-resolution PWM updates duty cycle every cycle for smooth torque, and the comparators provide hardware overcurrent trip without CPU latency. CAN-FD connects the drive to vehicle or factory networks, making the part equally suitable for industrial servo drives, e-bike controllers, and HVAC blower drives where efficiency and acoustic noise matter.
Empfohlen
Automotive CAN-FD Network Nodes
The CAN Flexible Data (CAN-FD) module on the DSPIC33CK64MP506-I/MR supports the higher payload and bitrate of modern in-vehicle networks, making the DSC a strong candidate for body-control, gateways, and smart-sensor nodes. The 100 MHz core leaves ample headroom for protocol stacks alongside application firmware within 64KB of Flash, and the -40C to +125C industrial-grade temperature rating suits harsh under-hood and chassis environments (verify AEC-Q100 grade variant requirements per Microchip qualification data). The PTG (Peripheral Trigger Generator) autonomously sequences ADC sampling and PWM updates, freeing CPU bandwidth for communication stack processing. On-chip comparators and DACs enable local threshold monitoring, and the QFN-64 package integrates readily into space-constrained modules such as lighting controllers and pump drivers.
Empfohlen
Power Factor Correction (PFC) Stages
Average-current-mode PFC requires precise control of the input current envelope synchronized to the rectified AC line - a workload matched to the DSPIC33CK64MP506-I/MR's architecture. The 3.5 Msps ADC samples input voltage and inductor current every switching cycle, while the high-resolution PWM shapes the boost-switch duty with the fine edge resolution needed to minimize harmonics at light load. The on-chip comparators implement hardware cycle-by-cycle current limiting as a fast secondary protection layer, and the DSP engine computes RMS line voltage and power metrics for digital telemetry. Because the control law lives in firmware, a single DSC firmware image can support multiple input-voltage ranges and standards, simplifying product variants for server power supplies, telecom rectifiers, and EV onboard chargers where efficiency regulations are strict.
Empfohlen
High-Density Battery Chargers
Multi-chemistry battery charging combines precision analog measurement with state-machine control, and the DSPIC33CK64MP506-I/MR covers both in one chip. The 12-bit 3.5 Msps ADC monitors pack voltage, charge current, and cell temperatures with sufficient accuracy for CC/CV profiles and Li-ion balancing decisions, while the three integrated op-amps condition current-shunt signals without external amplification. The high-resolution PWM drives the buck or buck-boost power stage with fine duty resolution for tight constant-current regulation, and firmware implements charge termination, pre-charge, fault recovery, and CAN-FD or UART reporting to host systems. The 100 MHz core executes coulomb-counting and safety algorithms in the background, and the -40C to +125C rating supports outdoor and industrial charging equipment from e-mobility packs to UPS systems.
Empfohlen
Advanced Sensing and Industrial IoT Nodes
As a sensing and control node, the DSPIC33CK64MP506-I/MR combines a 3.5 Msps 12-bit ADC, three op-amps, and three DACs-referenced comparators to perform signal conditioning and thresholding entirely on-chip - ideal for vibration, acoustic, and power-quality monitoring where high-rate capture matters. The DSP engine runs FFT and filtering kernels efficiently on the 100 MHz core, extracting frequency-domain features from raw sensor data before transmission. UART, SPI, and I2C interfaces connect external sensors and radio modules, while CAN-FD links the node to factory networks. The PTG autonomously triggers sample-and-PWM sequences, allowing periodic burst acquisition at minimal CPU cost and duty-cycled power consumption. This makes the part a compact fit for condition-monitoring sensors, smart breakers, and industrial gateways requiring local analytics.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33CK64MP506-I/MR – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33CK32MP506-I/MR | DSPIC33CK32MP506-E/MR | DSPIC33CK128MP506-I/MR | DSPIC33CK64MP505-I/MR |
|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB | 32 KB | 32 KB | 128 KB | 64 KB |
| CPU Speed | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Operating Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| ADC | 12-bit, 3.5 Msps | 12-bit, 3.5 Msps | 12-bit, 3.5 Msps | 12-bit, 3.5 Msps | 12-bit, 3.5 Msps |
| Temperature Range | -40C to +125C | -40C to +125C | -40C to +150C (extended) | -40C to +125C | -40C to +125C |
| CAN-FD | Yes | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Integrated triple op-amps eliminate external current-sense amplifiers (vs. DSPIC33CK64MP505-I/MR)
- Memory-upgrade path without PCB change (vs. DSPIC33CK32MP506-I/MR)
- CAN-FD plus 3.5 Msps ADC in a single 3.3V DSC (vs. DSPIC33CK32MP506-E/MR)
Designhinweise
Connect ALL VDD and VSS pin pairs. Per Microchip programming documentation (Northern Software dsPIC33CK64MP506 notes), leaving even one power pin unconnected can cause ICSP programming failure. The 64-QFN exposed pad must be soldered to a grounded thermal pad array on the PCB - use a 3x3 or larger via array under the pad for both thermal dissipation and a low-inductance ground return. Place 100 nF ceramic decoupling capacitors within 2 mm of each VDD pin pair, plus bulk 4.7 uF to 10 uF per supply group.
Programming (ICSP) requires matching PGECx/PGEDx pairs: if PGEC2 carries ICSPCLK, ICSPDAT must connect to PGED2. Mixing pins from different pairs (e.g., PGEC2 with PGED3) will fail silently or intermittently. Design the programming header to a single consistent pair, and route the traces away from high-di/dt PWM nodes to prevent corrupt in-circuit programming. Reserve the pair even if unused in the final build to keep the board field-programmable.
Feed the part from a clean 3.3V rail within the 3.0V to 3.6V window. Because the 12-bit 3.5 Msps ADC and the three op-amps share the analog domain, digital switching noise from the 100 MHz core couples into conversions if supply impedance is high; a ferrite bead plus local decoupling between the digital rail and AVDD, and careful star grounding at the exposed pad, measurably reduce ADC noise floor. Estimated: at 100 MHz with typical active current on the order of tens of mA (consult the datasheet electrical characteristics table for exact ICC), power dissipation is tens of mW - no heatsinking needed, but the exposed pad remains mandatory for ground integrity.
Keep high-resolution PWM outputs and gate-driver traces short and away from the analog sense lines feeding the ADC and op-amps. At 3.5 Msps sampling of shunt currents in digital power designs, ground bounce from switching edges is the dominant error source: use Kelvin connections at the shunt resistor, route sense pairs differentially to the op-amp inputs, and place a small RC anti-alias filter (e.g., 1 kOhm / 1 nF) at the ADC input pins. Reference the datasheet typical-application section for Microchip's recommended filter values.
Compliance-Informationen
RoHS compliant and lead-free per Microchip/distributor listings. AEC-Q100 qualification grade not stated in provided data - consult Microchip qualification documentation or the FuSa family designation for safety-related deployments.
