DSPIC33CK64MP506-I/MR - 100MHz DSC, 64KB Flash, CAN-FD | Microchip
Référence : DSPIC33CK64MP506-I/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2.19 | $2,19 |
| 10 | $2.06 | $20,60 |
| 100 | $1.88 | $188,00 |
| 500 | $1.72 | $860,00 |
| 1 000 | $1.58 | $1 580,00 |
DSPIC33CK64MP506-I/MR Présentation
A digital signal controller combines the compute throughput of a DSP with the peripheral integration and interrupt responsiveness of a microcontroller. Within the power-management hierarchy, the dsPIC33CK sits between general-purpose MCUs and dedicated DSPs, targeting digital power conversion, motor control, and advanced sensing where control loops must execute in microseconds.
Key features include a 100 MHz pipelined core with DSP instructions (single-cycle multiply, fast 6-cycle divide), a high-speed 12-bit ADC capable of 3.5 Msps, three on-chip operational amplifiers, three analog comparators, high-resolution PWM for precision power stages, and CAN Flexible Data (CAN-FD) for automotive and industrial networking. A Peripheral Trigger Generator (PTG) enables autonomous peripheral sequencing that offloads the CPU.
Architecturally, the dsPIC33CK core integrates a DSP engine with dual 40-bit accumulators and hardware looping, while the high-resolution PWM modules provide nanosecond-edge resolution for LLC, totem-pole PFC, and synchronous buck topologies. The 3.5 Msps 12-bit ADC supports simultaneous multi-channel sampling of current and voltage sense signals without external front-ends in many designs.
Typical applications include digital switch-mode power supplies, BLDC and PMSM motor drives with field-oriented control, automotive and industrial CAN-FD nodes, power-factor-correction stages, and high-density battery chargers. The three integrated op-amps reduce BOM cost by eliminating external current-sense amplifiers.
Design consideration: all VDD/VSS pairs must be connected and any PGECx/PGEDx pair must be used consistently as a pair for ICSP programming, per Microchip programming guidance; mixing PGEC2 with PGED3 will cause programming failure.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour DSPIC33CK64MP506-I/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33CK64MP506-I/MR (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Program Flash, PWM, Core.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33CK32MP506-I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.1 / unité
Voir la fiche technique →DSPIC33CK32MP506-E/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.55 / unité
Voir la fiche technique →DSPIC33CK128MP506-I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.35 / unité
Voir la fiche technique →DSPIC33CK128MP506-E/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.42 / unité
Voir la fiche technique →DSPIC33CK64MP505-I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33CK64MP506-I/MR Valeurs maximales et caractéristiques électriques
| Core | dsPIC33CK 16-bit DSC core |
| CPU Speed | 100 MHz |
| Program Memory (Flash) | 64 KB (64K x 8) |
| RAM | 8 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| ADC Resolution | 12-bit |
| ADC Conversion Rate | 3.5 Msps |
| On-chip Op-Amps | 3 |
| Analog Comparators | 3 |
| Communication Interfaces | CAN-FD, UART, SPI, I2C |
| High-Resolution PWM | Yes |
| Peripheral Trigger Generator (PTG) | Yes |
| Température de fonctionnement | -40C to +125C |
| Boîtier | 64-QFN (9x9 mm), exposed pad |
| Type de montage | Surface Mount |
| Functional Safety Support | FuSa family designation (per Microchip) |
| DAC (on-chip) | Yes, for comparator references |
| Statut RoHS | Compliant |
Guide de configuration des broches du DSPIC33CK64MP506-I/MR 64-qfn (9x9 mm), exposed pad
Configuration des broches du DSPIC33CK64MP506-I/MR (boîtier 64-qfn (9x9 mm), exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33CK64MP506-I/MR.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33CK64MP506-I/MR convient pour 6 applications: Digital Switch-Mode Power Supplies, BLDC/PMSM Motor Drives (Field-Oriented Control), Automotive CAN-FD Network Nodes, Power Factor Correction (PFC) Stages, High-Density Battery Chargers, Advanced Sensing and Industrial IoT Nodes.
Digital Switch-Mode Power Supplies
The DSPIC33CK64MP506-I/MR fits digital power conversion because its 100 MHz DSP core closes voltage- and current-mode loops in microseconds while the high-resolution PWM provides nanosecond-level edge adjustment for LLC, totem-pole PFC, and synchronous buck stages. The 3.5 Msps 12-bit ADC samples output voltage and inductor current with enough bandwidth to implement predictive and multi-loop control without external sample-and-hold circuitry. In a typical topology, the DSC sits between the feedback divider and the gate drivers, replacing analog compensation networks with firmware - enabling adaptive mode switching, telemetry over UART or CAN-FD, and firmware-based protection such as cycle-by-cycle current limiting using the three on-chip comparators. The integrated op-amps condition shunt-current signals directly, reducing BOM cost.
Recommandé
BLDC/PMSM Motor Drives (Field-Oriented Control)
Field-oriented control demands fast current-loop math and precise PWM timing, both native strengths of the DSPIC33CK64MP506-I/MR. Its 100 MHz core with single-cycle multiply and fast 6-cycle divide executes Clarke/Park transforms and PI current loops at switching frequencies beyond 100 kHz, while the 3.5 Msps ADC captures two or three phase shunt currents simultaneously. The three integrated op-amps amplify low-side shunt signals internally, eliminating external current-sense amplifiers and their offset errors. High-resolution PWM updates duty cycle every cycle for smooth torque, and the comparators provide hardware overcurrent trip without CPU latency. CAN-FD connects the drive to vehicle or factory networks, making the part equally suitable for industrial servo drives, e-bike controllers, and HVAC blower drives where efficiency and acoustic noise matter.
Recommandé
Automotive CAN-FD Network Nodes
The CAN Flexible Data (CAN-FD) module on the DSPIC33CK64MP506-I/MR supports the higher payload and bitrate of modern in-vehicle networks, making the DSC a strong candidate for body-control, gateways, and smart-sensor nodes. The 100 MHz core leaves ample headroom for protocol stacks alongside application firmware within 64KB of Flash, and the -40C to +125C industrial-grade temperature rating suits harsh under-hood and chassis environments (verify AEC-Q100 grade variant requirements per Microchip qualification data). The PTG (Peripheral Trigger Generator) autonomously sequences ADC sampling and PWM updates, freeing CPU bandwidth for communication stack processing. On-chip comparators and DACs enable local threshold monitoring, and the QFN-64 package integrates readily into space-constrained modules such as lighting controllers and pump drivers.
Recommandé
Power Factor Correction (PFC) Stages
Average-current-mode PFC requires precise control of the input current envelope synchronized to the rectified AC line - a workload matched to the DSPIC33CK64MP506-I/MR's architecture. The 3.5 Msps ADC samples input voltage and inductor current every switching cycle, while the high-resolution PWM shapes the boost-switch duty with the fine edge resolution needed to minimize harmonics at light load. The on-chip comparators implement hardware cycle-by-cycle current limiting as a fast secondary protection layer, and the DSP engine computes RMS line voltage and power metrics for digital telemetry. Because the control law lives in firmware, a single DSC firmware image can support multiple input-voltage ranges and standards, simplifying product variants for server power supplies, telecom rectifiers, and EV onboard chargers where efficiency regulations are strict.
Recommandé
High-Density Battery Chargers
Multi-chemistry battery charging combines precision analog measurement with state-machine control, and the DSPIC33CK64MP506-I/MR covers both in one chip. The 12-bit 3.5 Msps ADC monitors pack voltage, charge current, and cell temperatures with sufficient accuracy for CC/CV profiles and Li-ion balancing decisions, while the three integrated op-amps condition current-shunt signals without external amplification. The high-resolution PWM drives the buck or buck-boost power stage with fine duty resolution for tight constant-current regulation, and firmware implements charge termination, pre-charge, fault recovery, and CAN-FD or UART reporting to host systems. The 100 MHz core executes coulomb-counting and safety algorithms in the background, and the -40C to +125C rating supports outdoor and industrial charging equipment from e-mobility packs to UPS systems.
Recommandé
Advanced Sensing and Industrial IoT Nodes
As a sensing and control node, the DSPIC33CK64MP506-I/MR combines a 3.5 Msps 12-bit ADC, three op-amps, and three DACs-referenced comparators to perform signal conditioning and thresholding entirely on-chip - ideal for vibration, acoustic, and power-quality monitoring where high-rate capture matters. The DSP engine runs FFT and filtering kernels efficiently on the 100 MHz core, extracting frequency-domain features from raw sensor data before transmission. UART, SPI, and I2C interfaces connect external sensors and radio modules, while CAN-FD links the node to factory networks. The PTG autonomously triggers sample-and-PWM sequences, allowing periodic burst acquisition at minimal CPU cost and duty-cycled power consumption. This makes the part a compact fit for condition-monitoring sensors, smart breakers, and industrial gateways requiring local analytics.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33CK64MP506-I/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33CK32MP506-I/MR | DSPIC33CK32MP506-E/MR | DSPIC33CK128MP506-I/MR | DSPIC33CK64MP505-I/MR |
|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB | 32 KB | 32 KB | 128 KB | 64 KB |
| CPU Speed | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Operating Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| ADC | 12-bit, 3.5 Msps | 12-bit, 3.5 Msps | 12-bit, 3.5 Msps | 12-bit, 3.5 Msps | 12-bit, 3.5 Msps |
| Temperature Range | -40C to +125C | -40C to +125C | -40C to +150C (extended) | -40C to +125C | -40C to +125C |
| CAN-FD | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Integrated triple op-amps eliminate external current-sense amplifiers (vs DSPIC33CK64MP505-I/MR)
- Memory-upgrade path without PCB change (vs DSPIC33CK32MP506-I/MR)
- CAN-FD plus 3.5 Msps ADC in a single 3.3V DSC (vs DSPIC33CK32MP506-E/MR)
Notes de conception
Connect ALL VDD and VSS pin pairs. Per Microchip programming documentation (Northern Software dsPIC33CK64MP506 notes), leaving even one power pin unconnected can cause ICSP programming failure. The 64-QFN exposed pad must be soldered to a grounded thermal pad array on the PCB - use a 3x3 or larger via array under the pad for both thermal dissipation and a low-inductance ground return. Place 100 nF ceramic decoupling capacitors within 2 mm of each VDD pin pair, plus bulk 4.7 uF to 10 uF per supply group.
Programming (ICSP) requires matching PGECx/PGEDx pairs: if PGEC2 carries ICSPCLK, ICSPDAT must connect to PGED2. Mixing pins from different pairs (e.g., PGEC2 with PGED3) will fail silently or intermittently. Design the programming header to a single consistent pair, and route the traces away from high-di/dt PWM nodes to prevent corrupt in-circuit programming. Reserve the pair even if unused in the final build to keep the board field-programmable.
Feed the part from a clean 3.3V rail within the 3.0V to 3.6V window. Because the 12-bit 3.5 Msps ADC and the three op-amps share the analog domain, digital switching noise from the 100 MHz core couples into conversions if supply impedance is high; a ferrite bead plus local decoupling between the digital rail and AVDD, and careful star grounding at the exposed pad, measurably reduce ADC noise floor. Estimated: at 100 MHz with typical active current on the order of tens of mA (consult the datasheet electrical characteristics table for exact ICC), power dissipation is tens of mW - no heatsinking needed, but the exposed pad remains mandatory for ground integrity.
Keep high-resolution PWM outputs and gate-driver traces short and away from the analog sense lines feeding the ADC and op-amps. At 3.5 Msps sampling of shunt currents in digital power designs, ground bounce from switching edges is the dominant error source: use Kelvin connections at the shunt resistor, route sense pairs differentially to the op-amp inputs, and place a small RC anti-alias filter (e.g., 1 kOhm / 1 nF) at the ADC input pins. Reference the datasheet typical-application section for Microchip's recommended filter values.
Informations de conformité
RoHS compliant and lead-free per Microchip/distributor listings. AEC-Q100 qualification grade not stated in provided data - consult Microchip qualification documentation or the FuSa family designation for safety-related deployments.
