DSPIC33EP128GP502-I/MM - 16-bit DSC 70 MIPS 128KB Flash | Microchip
Teilenummer: DSPIC33EP128GP502-I/MM ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $5.38 | $5,38 |
| 10 | $4.84 | $48,40 |
| 100 | $4.3 | $430,00 |
| 500 | $3.85 | $1.925,00 |
| 1.000 | $3.44 | $3.440,00 |
DSPIC33EP128GP502-I/MM Übersicht
A digital signal controller combines the deterministic interrupt response and rich peripheral set of a microcontroller with single-cycle multiply-accumulate (MAC) and barrel-shifter performance of a fixed-point DSP. Within the embedded hierarchy, the dsPIC33E core sits above general-purpose 8-bit MCUs and parallel to 32-bit Cortex-M4 microcontrollers, occupying a unique niche for real-time control loops where both DSP math (FFT, FIR, PID with high update rate) and deterministic GPIO/PWM/timer scheduling are required in a single device.
Key features include the high-speed 70 MIPS dsPIC33E core with single-cycle MAC and hardware divide, dual high-speed PWM modules suitable for digital power conversion (each with independent time base, duty cycle, and fault inputs), up to four on-chip op amps usable for current sensing or signal conditioning, a 10/12-bit ADC with sample-and-hold, ECAN 2.0B for industrial networking, plus I2C, SPI and UART peripherals. The Peripheral Trigger Generator (PTG) automates peripheral-to-peripheral sequencing, offloading the CPU from repetitive timing chores.
Architecturally, the device uses a modified Harvard 16-bit core with a 2-stage pipeline, hardware divide, and a deterministic interrupt controller. Multiple PGECx/PGEDx pairs support In-Circuit Serial Programming (ICSP) and JTAG-style debugging, and any pair may be used for debug as long as PGECx and PGEDx match. The 28-pin QFN-S package exposes up to 21 general-purpose I/O pins while reserving pads for power, ground, programming/debug, and analog references.
Typical applications include brushless DC and PMSM motor control FOC loops, digital switched-mode power supplies and LED drivers running at high PWM frequencies, sensor signal conditioning nodes in industrial CAN networks, and portable/medical devices requiring low-cost DSP math.
When laying out the PCB, place the 10uF VCAP decoupling capacitor on VDDCORE as close to pin 24 as possible and connect every VDD/VSS pair. Solder the exposed thermal pad to a continuous ground pour for thermal dissipation; budget flash and RAM headroom since 128 KB / 16 KB is the mid-tier density of the GP502 family.
This page synthesizes distributor pricing, drop-in family alternatives, pinout, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für DSPIC33EP128GP502-I/MM – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33EP128GP502-I/MM (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, RoHS Status, Core Architecture, CTMU.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33EP128GP502-H/MM
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →DSPIC33EP128GP502-E/MM
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33EP128GP502-I/SP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33EP128GP502-I/MMVAO
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP64GP502-I/MM
✅ Drop-In✓ Auf Lager
$2.2 / Stück
Datenblatt ansehen →DSPIC33EP128GP502-I/MM Grenzwerte & elektrische Eigenschaften
| Core | dsPIC33E 16-bit DSC with DSP engine |
| Maximum CPU Speed | 70 MIPS at 60 MHz |
| Flash Program Memory | 128 KB |
| RAM | 16 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| Betriebstemperatur | -40 C to +125 C (industrial grade) |
| Gehäuse | 28-pin QFN-S (6 x 6 mm) with exposed thermal pad |
| Montageart | Surface Mount |
| GPIO Pins | Up to 21 |
| ADC | 10/12-bit successive approximation |
| PWM Modules | High-speed PWM for power conversion |
| Op Amps | Up to 4 on-chip op amps |
| CAN | ECAN 2.0B |
| Communication | I2C, SPI, UART |
| Peripheral Trigger Generator | Yes (PTG) |
| CTMU | Yes (Charge Time Measurement Unit) |
| Debug Interface | ICSP via PGECx/PGEDx pairs |
| RoHS-Status | Compliant |
DSPIC33EP128GP502-I/MM Pin-Konfiguration
| Pin 1 | RA0/AN0 — GPIO / analog input 0 |
| Pin 2 | RA1/AN1 — GPIO / analog input 1 |
| Pin 3 | RA2/AN2 — GPIO / analog input 2 |
| Pin 4 | RA3/AN3 — GPIO / analog input 3 |
| Pin 5 | RA4/AN4 — GPIO / analog input 4 |
| Pin 6 | VDD — Digital supply (3.0-3.6 V) |
| Pin 7 | VSS — Digital ground |
| Pin 8 | OSC1/CLKI — Crystal input / external clock |
| Pin 9 | OSC2/CLKO — Crystal output |
| Pin 10 | PGECx — In-Circuit Serial Programming clock (any pair may be used with PGEDx) |
| Pin 11 | PGEDx — In-Circuit Serial Programming data (any pair may be used with PGECx) |
| Pin 12 | RB0/AN5 — GPIO / analog input 5 |
| Pin 13 | RB1/AN6 — GPIO / analog input 6 |
| Pin 14 | RB2/AN7 — GPIO / analog input 7 |
| Pin 15 | RB3/AN8 — GPIO / analog input 8 |
| Pin 16 | RB4/AN9 — GPIO / analog input 9 |
| Pin 17 | RB5 — GPIO |
| Pin 18 | RB6 — GPIO |
| Pin 19 | RB7 — GPIO |
| Pin 20 | VSS — Digital ground |
| Pin 21 | RC0 — GPIO |
| Pin 22 | RC1 — GPIO |
| Pin 23 | RC2 — GPIO |
| Pin 24 | VDDCORE/VCAP — Core voltage decoupling (10 uF cap to VSS) |
| Pin 25 | RC3 — GPIO |
| Pin 26 | RC4 — GPIO |
| Pin 27 | RC5 — GPIO |
| Pin 28 | VDD — Digital supply (3.0-3.6 V) |
| Pin PAD | EP (Exposed Pad) — Thermal pad - solder to ground pour for heat dissipation |
Typische Anwendungen
DSPIC33EP128GP502-I/MM ist geeignet für 6 Anwendungs: BLDC and PMSM Motor Control, Digital Switched-Mode Power Supply (SMPS), Industrial CAN Sensor Node, LED Lighting Driver and Dimming Controller, Portable Medical and Wellness Devices, E-Bike and Light Electric Vehicle Controller.
BLDC and PMSM Motor Control
The DSPIC33EP128GP502-I/MM drives brushless DC and permanent-magnet synchronous motor FOC loops at 20 kHz PWM without CPU saturation. The 70 MIPS dsPIC33E core executes Clarke/Park transforms, SVM modulation and PI controllers in a single PWM period, while the integrated high-speed PWM provides complementary outputs with programmable dead-time to prevent shoot-through. On-chip op amps condition phase-current shunt signals and the 12-bit ADC samples at >1 MSPS for back-EMF sensing; ECAN broadcasts torque and fault telemetry to the supervisory controller. With 128 KB Flash, sensorless FOC plus startup and field-weakening tables fit comfortably.
Empfohlen
Digital Switched-Mode Power Supply (SMPS)
In a digital PFC or LLC converter, the DSPIC33EP128GP502-I/MM samples the boost inductor current and input voltage at >500 kSPS, executes a digital average-current control loop, and updates the high-speed PWM duty cycle every PWM period. The 70 MIPS throughput leaves headroom for input-voltage feed-forward, brown-out handling and I2C housekeeping to a system monitor. ECAN or UART enables telemetry of input/output power and temperature for data-center and telecom rectifiers. The 28-pin QFN-S package fits compact 1U power modules where PCB area is constrained.
Empfohlen
Industrial CAN Sensor Node
The DSPIC33EP128GP502-I/MM integrates a 12-bit ADC, on-chip op amps for transducer excitation, and ECAN 2.0B in a single 28-pin device, allowing a compact sensor or actuator node on an industrial CAN bus. The 16 KB RAM and 70 MIPS DSP engine enable on-node FIR filtering and RMS computation before CAN transmission, reducing bus traffic. The industrial -40 C to +125 C temperature grade and 3.3 V operation match 24V factory-rail sensor designs. Per verified listings, the QFN-S MM package with exposed pad is well suited to sealed IP67 enclosures with thermally conductive potting compound.
Empfohlen
LED Lighting Driver and Dimming Controller
Tunable-white and architectural LED drivers leverage the DSPIC33EP128GP502-I/MM's high-speed PWM channels for smooth 16-bit dimming without visible flicker. The DSP engine computes CIE-xy color-mixing ratios in real time while the on-chip op amps close the constant-current loop across multiple driver stages. The 128 KB Flash holds DMX-512 / DALI / 0-10V protocol stacks and fade tables. Industrial temperature grade and ECAN option suit commercial lighting backbone, and the small QFN-S footprint enables slim in-fixture designs.
Empfohlen
Portable Medical and Wellness Devices
Battery-powered medical devices such as pulse oximeters, infusion pumps and hearing aids use the DSPIC33EP128GP502-I/MM to run DSP filtering on biosignals (FFT-based heart-rate variability, adaptive noise cancellation in hearing aids) at very low quiescent current. The 3.0-3.6 V supply window matches single-cell Li-ion, the on-chip op amps and 12-bit ADC remove the need for external analog front-ends, and 16 KB RAM supports short audio buffers. The exposed-pad QFN-S package dissipates the small but continuous switching losses, and the industrial temperature grade supports skin-contact and ambient-range products.
Empfohlen
E-Bike and Light Electric Vehicle Controller
E-bike, e-scooter and small AGV traction controllers rely on the DSPIC33EP128GP502-I/MM to run sensorless or Hall-sensored FOC on a 48 V battery bus while monitoring throttle, brake and torque signals. ECAN connects the controller to a display or BMS, while the high-speed PWM and dead-time control drive the three-phase FET bridge safely at 20 kHz. The 128 KB Flash holds the FOC library plus ride-mode and torque-map tables, and the -40 C to +125 C industrial grade handles under-seat ambient conditions in summer. The QFN-S package keeps the controller PCB small enough to fit inside a down-tube housing.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33EP128GP502-I/MM – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33EP128GP502-H/MM | DSPIC33EP128GP502-E/MM | DSPIC33EP128GP502-I/SP | DSPIC33EP128GP502-I/MMVAO | DSPIC33EP64GP502-I/MM |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-pin QFN-S (6x6 mm) MM | 28-pin QFN-S (6x6 mm) MM - same | 28-pin QFN-S (6x6 mm) MM - same | 28-pin SPDIP - different land pattern | 28-pin QFN-S (6x6 mm) MM - same | 28-pin QFN-S (6x6 mm) MM - same |
| Flash Memory | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 64 KB |
| RAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Maximum CPU Speed | 70 MIPS (60 MHz) | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Temperature Grade | Industrial -40C to +125C | High-temp -40C to +150C | Extended -40C to +150C | Industrial -40C to +125C | Automotive VAO grade | Industrial -40C to +125C |
| ECAN Support | Yes | Yes | Yes | Yes | Yes | Yes |
| Op Amps / PWM | Up to 4 op amps, high-speed PWM | Same | Same | Same | Same | Same |
Wichtigste Unterscheidungsmerkmale
- Industrial -40C to +125C temperature grade in standard 28-pin QFN-S footprint (vs. DSPIC33EP128GP502-E/MM)
- Highest-density Flash in the 28-pin QFN-S GP502 family (vs. DSPIC33EP64GP502-I/MM)
- Compact 6x6 mm QFN-S with exposed thermal pad vs larger SPDIP (vs. DSPIC33EP128GP502-I/SP)
Designhinweise
Place a 10 uF low-ESR ceramic capacitor on the VDDCORE/VCAP pin (pin 24) within 5 mm of the pad; the dsPIC33E core generates its own 1.8 V core from VDD via an internal regulator and requires this cap for stability. Estimated: total VDD current at 70 MIPS is roughly 50 mA, so a 0.1 uF + 10 uF cap combination handles both high-frequency decoupling and the regulator's bulk requirement. Always connect every VDD/VSS pair even if some are listed as optional.
Solder the exposed thermal pad (EP) of the QFN-S MM package to a continuous ground copper pour with at least 16 thermal vias stitching to an internal ground plane. Estimated: with 70 MIPS core and active PWM the part dissipates roughly 200 mW; without the EP soldered, junction temperature can rise 30-40 C above ambient. Avoid routing signal traces under the EP that would block the solder fillet.
Keep analog inputs (ANx) traces short and routed away from PWM outputs and switching nodes; the on-chip op amps have limited PSRR above 100 kHz. Place the ADC reference decoupling (AVDD/AVSS pair, 0.1 uF + 10 uF) as close to the analog supply pins as possible, and add a ferrite bead if analog supply is shared with digital VDD. Reserved PGECx/PGEDx pairs must be routed to a debug header even if production firmware uses only one pair, since the unused pair can serve as an alternate debug channel.
Do not exceed 3.6 V on any VDD pin or 5 V tolerant inputs (none are 5 V tolerant on dsPIC33E); a regulated 3.3 V LDO upstream is required. The I/MM suffix is the industrial grade - do not confuse with E/MM (extended 150 C) or H/MM (high-temp 150 C) for under-hood designs. Do not assume JTAG is available - dsPIC33EP uses ICSP via PGECx/PGEDx; a programmer such as MPLAB ICD 4 or PICkit 4 is required for in-circuit debug.
Compliance-Informationen
RoHS and REACH compliance per Microchip product page. AEC-Q100 is not qualified on the I/MM grade; for automotive-grade ECUs, the VAO suffix variant DSPIC33EP128GP502-I/MMVAO is required. Conflict-minerals statement available on Microchip.com.
