DSPIC33EP128GS702-E/MM - 16-bit DSC 70 MIPS 128KB Flash | Microchip
Teilenummer: DSPIC33EP128GS702-E/MM ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $5.12 | $5,12 |
| 10 | $4.61 | $46,10 |
| 100 | $4.1 | $410,00 |
| 500 | $3.69 | $1.845,00 |
| 1.000 | $3.32 | $3.320,00 |
DSPIC33EP128GS702-E/MM Übersicht
A Digital Signal Controller combines the compute architecture of a microcontroller with the numeric acceleration of a digital signal processor. In the power-management hierarchy, the dsPIC33EP GS family sits at the heart of digital power-conversion systems, replacing analog control loops with firmware-driven control implemented through interconnected high-speed PWM modules, high-speed ADCs, programmable gain amplifiers (PGA), and analog comparators.
Key features include the interconnected high-speed PWM peripheral designed specifically for switch-mode power supply (SMPS) topologies, a high-speed 10/12-bit ADC capable of sampling multiple channels in tight control-loop timing windows, integrated PGA and comparators that reduce external analog component count, and a 16-bit modified Harvard DSP core with a barrel shifter, DSP multiply-accumulate instructions, and 24-bit wide program memory.
The -E suffix denotes an extended automotive-grade operating temperature range of -40C to +125C, and the device carries AEC-Q100 qualification, making it suitable for automotive and other harsh-environment designs. The 3.3V CMOS device offers 7 timers, 4 external interrupts, boundary scan, and multiple low-power modes. This specific family, dsPIC33EPXXXGS70X/80X, is documented by Microchip as 16-Bit Digital Signal Controllers for Digital Power Applications with Interconnected High-Speed PWM, ADC, PGA and Comparators.
Typical applications include AC-DC power supplies, power factor correction (PFC) stages, DC-DC converters, solar inverters, battery chargers, LED drivers, and digital lighting ballasts where deterministic closed-loop control at tens to hundreds of kHz is required.
When designing, allocate the exposed thermal pad to a solid ground plane and ensure ADC/PWM interconnect scheduling matches your control-loop bandwidth; the peripherals are interconnected by design, but loop timing must still be budgeted in firmware.
This page synthesizes distributor inventory and pricing context, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, with pricing referenced as of 2026-09-23.
Drop-in-Alternativen für DSPIC33EP128GS702-E/MM – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33EP128GS702-E/MM (gleiche Bauform und Footprint) – abweichend in Core, Operating Temperature, Package, Qualification.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33EP64GS702-E/MM
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP32GS702-E/MM
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP128GS702-I/MM
✅ Drop-In✓ Auf Lager
$4.25 / Stück
Datenblatt ansehen →DSPIC33EP128GS702-E/MM Grenzwerte & elektrische Eigenschaften
| Core | dsPIC33EP 16-bit DSC core with integrated DSP |
| Instruction Rate | 70 MIPS |
| Program Memory (Flash) | 128 KB (43K x 24) |
| RAM | 8 KB |
| Versorgungsspannung | 3.3 V |
| Gehäuse | 28-QFN-S (6x6x0.9 mm) with exposed pad (EP) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +125C (Extended, E grade) |
| Qualification | AEC-Q100 Automotive |
| Timers | 7 |
| External Interrupts | 4 |
| Special Features | Interconnected high-speed PWM, high-speed ADC, PGA, comparators |
| DSP Features | Barrel shifter, DSP multiply-accumulate, 24-bit program memory |
| Packaging | Tube |
| Program Memory Type | FLASH |
| Low-Power Modes | Yes |
DSPIC33EP128GS702-E/MM 28-qfn-s (6x6x0.9 mm) with exposed pad (ep) Pinbelegungsleitfaden
Pinbelegung für DSPIC33EP128GS702-E/MM (28-qfn-s (6x6x0.9 mm) with exposed pad (ep)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33EP128GS702-E/MM.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33EP128GS702-E/MM ist geeignet für 6 Anwendungs: AC-DC Power Supplies, Power Factor Correction (PFC), DC-DC Converters, Automotive Power Systems, Solar Inverters and Micro-Inverters, Battery Chargers and LED Drivers.
AC-DC Power Supplies
The DSPIC33EP128GS702-E/MM is purpose-built for digitally controlled AC-DC power supplies, where its interconnected high-speed PWM and high-speed ADC replace analog control ICs with firmware-defined voltage-mode, current-mode, or multi-loop control. The 70 MIPS core executes PI or nonlinear control laws within each switching cycle at typical SMPS frequencies of 65 kHz to 500 kHz. On-chip PGA and comparators enable cycle-by-cycle current limiting without external op-amps, while the 12-bit ADC samples output voltage and current with precise PWM-triggered timing. AEC-Q100 qualification and the -40C to +125C range also allow use in server and industrial PSUs exposed to elevated ambient temperatures.
Empfohlen
Power Factor Correction (PFC)
In PFC stages, the DSPIC33EP128GS702-E/MM implements average-current-mode or critical-conduction-mode control with the deterministic timing that power factor regulation demands. The interconnected high-speed PWM can synchronize ADC sampling to inductor current zero-crossings and PWM edges, minimizing switching-noise-induced measurement error. The 70 MIPS core leaves ample headroom for RMS line-voltage computation, feed-forward terms, and THD-optimizing algorithms running in parallel with the inner current loop. Integrated comparators support fast overcurrent protection independent of software latency, and the 8KB RAM buffers waveform data for in-circuit diagnostics across the 3.3V, -40C to +125C AEC-Q100 operating envelope.
Empfohlen
DC-DC Converters
For digital DC-DC conversion - buck, boost, buck-boost, LLC, and phase-shifted full-bridge topologies - the DSPIC33EP128GS702-E/MM provides complementary or overlapping PWM outputs with sub-nanosecond-class edge resolution via the high-speed PWM module, dead-time insertion, and ADC-triggered control-loop sampling. The 128KB Flash accommodates soft-start, hiccup-mode fault handling, telemetry, and PMBus-style communication alongside the core control loop. The on-chip PGA amplifies low-level shunt signals for the ADC, and comparators provide cycle-by-cycle peak-current protection. The 6x6 mm QFN-S with exposed pad suits compact converter boards where both controller footprint and thermal performance are constrained.
Empfohlen
Automotive Power Systems
With AEC-Q100 qualification, an extended -40C to +125C temperature range, and functional-safety-relevant features noted by distributors (Microchip USA lists FuSa support for the dsPIC33EP GS family), the DSPIC33EP128GS702-E/MM targets automotive power electronics: LED headlight drivers, onboard chargers, DC-DC auxiliary converters, and battery-management supervision. The 70 MIPS DSP core handles control plus housekeeping (LIN/CAN-gatewayed diagnostics, fault logging), while the interconnected PWM/ADC blocks maintain deterministic loop timing despite software load. The 6x6x0.9 mm exposed-pad QFN-S supports reliable solder-joint and thermal performance required in automotive vibration and thermal-cycling environments.
Empfohlen
Solar Inverters and Micro-Inverters
Grid-tied solar conversion benefits from the DSPIC33EP128GS702-E/MM's ability to run MPPT algorithms, grid-current shaping, and anti-islanding detection concurrently. The 70 MIPS core with DSP multiply-accumulate instructions accelerates the RMS and FFT computations needed for grid monitoring, while the high-speed PWM generates the high-frequency switching waveforms for the DC-DC and DC-AC stages. Multiple ADC channels sample panel voltage/current and grid voltage/current with PWM-synchronized timing, and the 128KB Flash holds communication stacks and firmware-update routines. Extended temperature rating supports outdoor enclosures where ambient temperatures exceed standard industrial limits.
Empfohlen
Battery Chargers and LED Drivers
Digital battery chargers and high-power LED drivers require precise current regulation with fast fault response - both strengths of the DSPIC33EP128GS702-E/MM. Its integrated comparators execute hardware cycle-by-cycle current limiting, while the ADC and 70 MIPS core implement CC/CV charging profiles, charge-termination algorithms, thermal derating, and LED dimming schemes (analog or PWM-based) with high resolution. The interconnected high-speed PWM supports multi-string LED control and multi-cell charger sequencing. The 3.3V AEC-Q100 device in a 6x6 mm QFN-S suits both consumer adapter boards and automotive lighting modules operating up to +125C ambient.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33EP128GS702-E/MM – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33EP64GS702-E/MM | DSPIC33EP32GS702-E/MM | DSPIC33EP128GS702-I/MM |
|---|---|---|---|---|
| Package | 28-QFN-S 6x6x0.9 mm EP | 28-QFN-S 6x6x0.9 mm EP - same | 28-QFN-S 6x6x0.9 mm EP - same | 28-QFN-S 6x6x0.9 mm EP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 128 KB (43K x 24) | 64 KB | 32 KB | 128 KB (43K x 24) |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB |
| Performance | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Temperature Range | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +85C |
| AEC-Q100 Automotive | Yes | Yes (E grade) | Yes (E grade) | No (industrial grade) |
| High-Speed PWM / ADC / PGA | Yes | Yes - same peripheral set | Yes - same peripheral set | Yes - same peripheral set |
| Relative Cost | Baseline (highest in family) | Lower (half flash) | Lowest | Lower (non-automotive) |
Wichtigste Unterscheidungsmerkmale
- Maximum 128KB Flash in the 28-pin QFN-S GS family (vs. DSPIC33EP64GS702-E/MM)
- Extended -40C to +125C with AEC-Q100 (vs. DSPIC33EP128GS702-I/MM)
- Full firmware compatibility with smaller siblings (vs. DSPIC33EP32GS702-E/MM)
Designhinweise
The 28-QFN-S exposed pad (EP) must be soldered to a contiguous ground plane via an array of thermal vias (typical 4x4 via pattern, 0.3 mm vias filled or tented). The EP is the primary ground return and heat-removal path for the die; relying on perimeter pins alone degrades both thermal performance and ground integrity for the high-speed PWM and ADC. Follow the Microchip family datasheet landing-pattern dimensions for the 6x6x0.9 mm MM package exactly to guarantee reliable reflow.
Keep PWM output traces to gate drivers short and route them away from ADC input traces; the interconnected high-speed PWM toggles edges that couple into high-impedance analog nodes. Use the on-chip PGA as close to the shunt as possible in firmware gain planning, and place RC anti-alias filters directly at ANx pins. Synchronize ADC sampling to PWM triggers in firmware so that samples are taken during quiet windows of the switching cycle rather than at switch-node transitions.
Verify firmware size before selecting a family variant: 128KB vs 64KB vs 32KB Flash is the only code-space difference, but compiler-generated images with communication stacks and diagnostics can exceed 64KB unexpectedly. Also confirm temperature grade versus actual junction temperature - the -E grade allows +125C ambient only if self-heating is budgeted; a design validated at +85C with the -I part may exceed limits when the same layout runs the -E part in an enclosed automotive housing.
Decouple VDD and AVDD with 0.1 uF ceramic capacitors placed within 2 mm of the respective pins, plus bulk capacitance per the Microchip family datasheet recommendations. The 3.3V supply must remain within datasheet tolerance under peak core switching load; analog performance of the high-speed ADC degrades measurably if AVDD ripple exceeds a few tens of millivolts. Separate analog and digital supply filtering where board real estate permits.
Compliance-Informationen
AEC-Q100 automotive qualification and functional safety (FuSa) family listing confirmed via datasheets.com and Microchip USA product listings. RoHS/REACH/lead-free status not explicitly stated in provided data; verify on the official Microchip product page.
