DSPIC33EP128GS702-E/MM - 16-bit DSC 70 MIPS 128KB Flash | Microchip
MPN: DSPIC33EP128GS702-E/MM ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.12 | $5.12 |
| 10 | $4.61 | $46.10 |
| 100 | $4.1 | $410.00 |
| 500 | $3.69 | $1,845.00 |
| 1,000 | $3.32 | $3,320.00 |
DSPIC33EP128GS702-E/MM Overview
A Digital Signal Controller combines the compute architecture of a microcontroller with the numeric acceleration of a digital signal processor. In the power-management hierarchy, the dsPIC33EP GS family sits at the heart of digital power-conversion systems, replacing analog control loops with firmware-driven control implemented through interconnected high-speed PWM modules, high-speed ADCs, programmable gain amplifiers (PGA), and analog comparators.
Key features include the interconnected high-speed PWM peripheral designed specifically for switch-mode power supply (SMPS) topologies, a high-speed 10/12-bit ADC capable of sampling multiple channels in tight control-loop timing windows, integrated PGA and comparators that reduce external analog component count, and a 16-bit modified Harvard DSP core with a barrel shifter, DSP multiply-accumulate instructions, and 24-bit wide program memory.
The -E suffix denotes an extended automotive-grade operating temperature range of -40C to +125C, and the device carries AEC-Q100 qualification, making it suitable for automotive and other harsh-environment designs. The 3.3V CMOS device offers 7 timers, 4 external interrupts, boundary scan, and multiple low-power modes. This specific family, dsPIC33EPXXXGS70X/80X, is documented by Microchip as 16-Bit Digital Signal Controllers for Digital Power Applications with Interconnected High-Speed PWM, ADC, PGA and Comparators.
Typical applications include AC-DC power supplies, power factor correction (PFC) stages, DC-DC converters, solar inverters, battery chargers, LED drivers, and digital lighting ballasts where deterministic closed-loop control at tens to hundreds of kHz is required.
When designing, allocate the exposed thermal pad to a solid ground plane and ensure ADC/PWM interconnect scheduling matches your control-loop bandwidth; the peripherals are interconnected by design, but loop timing must still be budgeted in firmware.
This page synthesizes distributor inventory and pricing context, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, with pricing referenced as of 2026-09-23.
Drop-in alternatives for DSPIC33EP128GS702-E/MM — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP128GS702-E/MM (same form factor and footprint) — differing in Core, Operating Temperature, Package, Qualification.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP64GS702-E/MM
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP32GS702-E/MM
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP128GS702-I/MM
✅ Drop-In✓ In Stock
$4.25 / Unit
View Datasheet →DSPIC33EP128GS702-E/MM Maximum Ratings & Electrical Characteristics
| Core | dsPIC33EP 16-bit DSC core with integrated DSP |
| Instruction Rate | 70 MIPS |
| Program Memory (Flash) | 128 KB (43K x 24) |
| RAM | 8 KB |
| Supply Voltage | 3.3 V |
| Package | 28-QFN-S (6x6x0.9 mm) with exposed pad (EP) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +125C (Extended, E grade) |
| Qualification | AEC-Q100 Automotive |
| Timers | 7 |
| External Interrupts | 4 |
| Special Features | Interconnected high-speed PWM, high-speed ADC, PGA, comparators |
| DSP Features | Barrel shifter, DSP multiply-accumulate, 24-bit program memory |
| Packaging | Tube |
| Program Memory Type | FLASH |
| Low-Power Modes | Yes |
DSPIC33EP128GS702-E/MM 28-qfn-s (6x6x0.9 mm) with exposed pad (ep) Pin Configuration Guide
Pin configuration for DSPIC33EP128GS702-E/MM (28-qfn-s (6x6x0.9 mm) with exposed pad (ep) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP128GS702-E/MM.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP128GS702-E/MM is suitable for 6 applications: AC-DC Power Supplies, Power Factor Correction (PFC), DC-DC Converters, Automotive Power Systems, Solar Inverters and Micro-Inverters, Battery Chargers and LED Drivers.
AC-DC Power Supplies
The DSPIC33EP128GS702-E/MM is purpose-built for digitally controlled AC-DC power supplies, where its interconnected high-speed PWM and high-speed ADC replace analog control ICs with firmware-defined voltage-mode, current-mode, or multi-loop control. The 70 MIPS core executes PI or nonlinear control laws within each switching cycle at typical SMPS frequencies of 65 kHz to 500 kHz. On-chip PGA and comparators enable cycle-by-cycle current limiting without external op-amps, while the 12-bit ADC samples output voltage and current with precise PWM-triggered timing. AEC-Q100 qualification and the -40C to +125C range also allow use in server and industrial PSUs exposed to elevated ambient temperatures.
Recommended
Power Factor Correction (PFC)
In PFC stages, the DSPIC33EP128GS702-E/MM implements average-current-mode or critical-conduction-mode control with the deterministic timing that power factor regulation demands. The interconnected high-speed PWM can synchronize ADC sampling to inductor current zero-crossings and PWM edges, minimizing switching-noise-induced measurement error. The 70 MIPS core leaves ample headroom for RMS line-voltage computation, feed-forward terms, and THD-optimizing algorithms running in parallel with the inner current loop. Integrated comparators support fast overcurrent protection independent of software latency, and the 8KB RAM buffers waveform data for in-circuit diagnostics across the 3.3V, -40C to +125C AEC-Q100 operating envelope.
Recommended
DC-DC Converters
For digital DC-DC conversion - buck, boost, buck-boost, LLC, and phase-shifted full-bridge topologies - the DSPIC33EP128GS702-E/MM provides complementary or overlapping PWM outputs with sub-nanosecond-class edge resolution via the high-speed PWM module, dead-time insertion, and ADC-triggered control-loop sampling. The 128KB Flash accommodates soft-start, hiccup-mode fault handling, telemetry, and PMBus-style communication alongside the core control loop. The on-chip PGA amplifies low-level shunt signals for the ADC, and comparators provide cycle-by-cycle peak-current protection. The 6x6 mm QFN-S with exposed pad suits compact converter boards where both controller footprint and thermal performance are constrained.
Recommended
Automotive Power Systems
With AEC-Q100 qualification, an extended -40C to +125C temperature range, and functional-safety-relevant features noted by distributors (Microchip USA lists FuSa support for the dsPIC33EP GS family), the DSPIC33EP128GS702-E/MM targets automotive power electronics: LED headlight drivers, onboard chargers, DC-DC auxiliary converters, and battery-management supervision. The 70 MIPS DSP core handles control plus housekeeping (LIN/CAN-gatewayed diagnostics, fault logging), while the interconnected PWM/ADC blocks maintain deterministic loop timing despite software load. The 6x6x0.9 mm exposed-pad QFN-S supports reliable solder-joint and thermal performance required in automotive vibration and thermal-cycling environments.
Recommended
Solar Inverters and Micro-Inverters
Grid-tied solar conversion benefits from the DSPIC33EP128GS702-E/MM's ability to run MPPT algorithms, grid-current shaping, and anti-islanding detection concurrently. The 70 MIPS core with DSP multiply-accumulate instructions accelerates the RMS and FFT computations needed for grid monitoring, while the high-speed PWM generates the high-frequency switching waveforms for the DC-DC and DC-AC stages. Multiple ADC channels sample panel voltage/current and grid voltage/current with PWM-synchronized timing, and the 128KB Flash holds communication stacks and firmware-update routines. Extended temperature rating supports outdoor enclosures where ambient temperatures exceed standard industrial limits.
Recommended
Battery Chargers and LED Drivers
Digital battery chargers and high-power LED drivers require precise current regulation with fast fault response - both strengths of the DSPIC33EP128GS702-E/MM. Its integrated comparators execute hardware cycle-by-cycle current limiting, while the ADC and 70 MIPS core implement CC/CV charging profiles, charge-termination algorithms, thermal derating, and LED dimming schemes (analog or PWM-based) with high resolution. The interconnected high-speed PWM supports multi-string LED control and multi-cell charger sequencing. The 3.3V AEC-Q100 device in a 6x6 mm QFN-S suits both consumer adapter boards and automotive lighting modules operating up to +125C ambient.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP128GS702-E/MM — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP64GS702-E/MM | DSPIC33EP32GS702-E/MM | DSPIC33EP128GS702-I/MM |
|---|---|---|---|---|
| Package | 28-QFN-S 6x6x0.9 mm EP | 28-QFN-S 6x6x0.9 mm EP - same | 28-QFN-S 6x6x0.9 mm EP - same | 28-QFN-S 6x6x0.9 mm EP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 128 KB (43K x 24) | 64 KB | 32 KB | 128 KB (43K x 24) |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB |
| Performance | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Temperature Range | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +85C |
| AEC-Q100 Automotive | Yes | Yes (E grade) | Yes (E grade) | No (industrial grade) |
| High-Speed PWM / ADC / PGA | Yes | Yes - same peripheral set | Yes - same peripheral set | Yes - same peripheral set |
| Relative Cost | Baseline (highest in family) | Lower (half flash) | Lowest | Lower (non-automotive) |
Key Differentiators
- Maximum 128KB Flash in the 28-pin QFN-S GS family (vs DSPIC33EP64GS702-E/MM)
- Extended -40C to +125C with AEC-Q100 (vs DSPIC33EP128GS702-I/MM)
- Full firmware compatibility with smaller siblings (vs DSPIC33EP32GS702-E/MM)
Design Notes
The 28-QFN-S exposed pad (EP) must be soldered to a contiguous ground plane via an array of thermal vias (typical 4x4 via pattern, 0.3 mm vias filled or tented). The EP is the primary ground return and heat-removal path for the die; relying on perimeter pins alone degrades both thermal performance and ground integrity for the high-speed PWM and ADC. Follow the Microchip family datasheet landing-pattern dimensions for the 6x6x0.9 mm MM package exactly to guarantee reliable reflow.
Keep PWM output traces to gate drivers short and route them away from ADC input traces; the interconnected high-speed PWM toggles edges that couple into high-impedance analog nodes. Use the on-chip PGA as close to the shunt as possible in firmware gain planning, and place RC anti-alias filters directly at ANx pins. Synchronize ADC sampling to PWM triggers in firmware so that samples are taken during quiet windows of the switching cycle rather than at switch-node transitions.
Verify firmware size before selecting a family variant: 128KB vs 64KB vs 32KB Flash is the only code-space difference, but compiler-generated images with communication stacks and diagnostics can exceed 64KB unexpectedly. Also confirm temperature grade versus actual junction temperature - the -E grade allows +125C ambient only if self-heating is budgeted; a design validated at +85C with the -I part may exceed limits when the same layout runs the -E part in an enclosed automotive housing.
Decouple VDD and AVDD with 0.1 uF ceramic capacitors placed within 2 mm of the respective pins, plus bulk capacitance per the Microchip family datasheet recommendations. The 3.3V supply must remain within datasheet tolerance under peak core switching load; analog performance of the high-speed ADC degrades measurably if AVDD ripple exceeds a few tens of millivolts. Separate analog and digital supply filtering where board real estate permits.
Compliance Information
AEC-Q100 automotive qualification and functional safety (FuSa) family listing confirmed via datasheets.com and Microchip USA product listings. RoHS/REACH/lead-free status not explicitly stated in provided data; verify on the official Microchip product page.
