DSPIC33EP512GM310-H/BG - 70 MIPS 16-bit DSC | Microchip
Teilenummer: DSPIC33EP512GM310-H/BG ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7.2 | $7,20 |
| 10 | $6.6 | $66,00 |
| 100 | $5.9 | $590,00 |
| 500 | $5.4 | $2.700,00 |
| 1.000 | $4.85 | $4.850,00 |
DSPIC33EP512GM310-H/BG Übersicht
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and ease of use of a microcontroller. Within the power management hierarchy of embedded systems, DSCs sit above general-purpose MCUs for math-intensive real-time control, making the dsPIC33E family a common choice wherever fast control loops meet complex peripheral sets.
Key features of the GM310 variant include an enhanced dsPIC33E core running at 70 MIPS, 12-channel motor control PWM (MCPWM), 8 input capture and 8 output compare channels, 2 quadrature encoder interfaces (QEI), and 4 integrated operational amplifiers. The device also integrates a Charge Time Measurement Unit (CTMU) for capacitive touch and precision time measurement, plus a Peripheral Trigger Generator (PTG) for autonomous peripheral sequencing. This peripheral density allows a single chip to close position, current, and voltage loops without external analog front-end components.
Architecturally, the dsPIC33E core uses a modified Harvard pipeline with DSP multiply-accumulate instructions, dual operand fetch, and single-cycle MAC, enabling efficient execution of FIR filters, PI controllers, and field-oriented control (FOC) algorithms for PMSM and BLDC motors.
Typical applications include precision motor control (servo drives, industrial automation), digital power supplies and inverters, automotive auxiliary systems benefiting from the AEC-Q100-qualified H and E temperature grades, and general high-performance embedded control.
Design considerations: the 121-TFBGA package requires careful PCB fan-out and via-in-pad or dog-bone breakout on a fine-pitch BGA land pattern; verify 3.3V supply sequencing and decoupling per the Microchip datasheet layout guidelines.
This page synthesizes distributor availability data, drop-in alternatives, and package-level design notes not consolidated in the manufacturer datasheet, verified as of 2026-09-25.
Drop-in-Alternativen für DSPIC33EP512GM310-H/BG – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33EP512GM310-H/BG (gleiche Bauform und Footprint) – abweichend in Core, Package, Core Architecture, Program Memory Size, Qualification.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33EP512GM310-I/BG
✅ Drop-In✓ Auf Lager
$6.2 / Stück
Datenblatt ansehen →DSPIC33EP512GM310-E/BG
✅ Drop-In✓ Auf Lager
$5.95 / Stück
Datenblatt ansehen →DSPIC33EP512GM310-H/PT
✅ Drop-In✓ Auf Lager
$6.2 / Stück
Datenblatt ansehen →DSPIC33EP512GM310-H/BG Grenzwerte & elektrische Eigenschaften
| Core | dsPIC33E 16-bit |
| Maximum CPU Speed | 70 MIPS |
| Flash Program Memory | 512 KB (170K x 24) |
| RAM | 16 KB |
| Versorgungsspannung | 3.3 V |
| Gehäuse | 121-TFBGA (10 x 10 x 1.20 mm) |
| Motor Control PWM Channels | 12 MCPWM |
| Input Capture / Output Compare | 8 / 8 |
| Quadrature Encoder Interfaces | 2 QEI |
| Integrated Op-Amps | 4 |
| Charge Time Measurement Unit | CTMU |
| Peripheral Trigger Generator | PTG |
| Qualification | AEC-Q100, Automotive |
| Montageart | Surface Mount |
| Packaging | Tray |
| RoHS-Status | Compliant (per Newark listing) |
DSPIC33EP512GM310-H/BG 121-tfbga (10 x 10 x 1.20 mm) Pinbelegungsleitfaden
Pinbelegung für DSPIC33EP512GM310-H/BG (121-tfbga (10 x 10 x 1.20 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33EP512GM310-H/BG.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33EP512GM310-H/BG ist geeignet für 6 Anwendungs: Precision Motor Control, Automotive Auxiliary ECUs, Digital Power Supplies and Inverters, Industrial Automation and Robotics, Capacitive Touch Human-Machine Interfaces, Test and Measurement Instrumentation.
Precision Motor Control
The DSPIC33EP512GM310-H/BG is purpose-built for precision motor control: its 12-channel motor-control PWM peripheral provides complementary outputs with hardware dead-time insertion, while 2 quadrature encoder interfaces deliver position feedback for servo and BLDC/PMSM drives. The 70 MIPS DSP core executes field-oriented control (FOC) algorithms with single-cycle multiply-accumulate instructions, keeping current-loop bandwidth high. Integrated op-amps condition shunt-resistor current signals on-chip, removing external amplifiers and reducing BOM cost. In a typical servo drive, the DSC closes current loops at 10-20 kHz and velocity/position loops at 1 kHz, all within one 121-TFBGA device.
Empfohlen
Automotive Auxiliary ECUs
With AEC-Q100 qualification and the extended -H temperature grade, the DSPIC33EP512GM310-H/BG fits automotive auxiliary electronic control units such as pump controllers, HVAC blower drives, and actuator positioning. The 12 MCPWM channels can independently drive multiple motors, and the CTMU supports capacitive touch interfaces for in-cabin user panels. The 3.3V operation aligns with modern automotive low-voltage domains through existing point-of-load regulation. Designers gain the extended-temperature margin needed for under-hood-adjacent zones while retaining a single-chip solution that consolidates control, sensing, and communication peripherals in one automotive-qualified 121-TFBGA package.
Empfohlen
Digital Power Supplies and Inverters
In digitally controlled power supplies, solar micro-inverters, and UPS stages, the DSPIC33EP512GM310-H/BG closes voltage and current loops with 70 MIPS of DSP throughput. The high-resolution MCPWM module supports phase-shifted and interleaved topologies, while the PTG (Peripheral Trigger Generator) sequences ADC sampling and PWM updates autonomously, offloading timing-critical tasks from software and reducing loop jitter. Input capture channels synchronize to zero-crossing events for grid-tied applications. The integrated op-amps condition feedback signals without external amplifiers, and the 512KB Flash accommodates firmware for multiple operating modes, protection state machines, and communication stacks on a single controller.
Empfohlen
Industrial Automation and Robotics
Factory automation nodes benefit from the DSPIC33EP512GM310-H/BG's combination of 2 QEI modules, 8 input captures, and 8 output compares, allowing simultaneous multi-axis coordination from one controller. The 70 MIPS core executes trajectory interpolation and PID cascades in real time, while 512KB Flash holds motion profiles, communication firmware, and safety logic. The PTG automates repetitive peripheral sequences such as encoder polling, lowering CPU load. Four on-chip op-amps digitize analog sensor signals directly, and the AEC-Q100-qualified build quality provides the robustness margins demanded by industrial environments with wide temperature swings and electrical noise.
Empfohlen
Capacitive Touch Human-Machine Interfaces
The integrated Charge Time Measurement Unit (CTMU) enables capacitive touch sensing directly on the DSPIC33EP512GM310-H/BG, allowing designers to merge a touch HMI and motor control into a single DSC - useful for appliances, power tools, and industrial panels. The CTMU measures charge time on touch pads with microsecond precision and supports current-source-based sensing methods described in Microchip application notes. Combined with the 12 MCPWM channels, one device can run a touch UI and a fan or pump drive simultaneously. The 512KB Flash leaves ample room for touch-tuning firmware, debouncing state machines, and user-interface logic.
Empfohlen
Test and Measurement Instrumentation
In handheld and bench instrumentation, the DSPIC33EP512GM310-H/BG serves as a real-time acquisition and control engine. The 8 input capture channels timestamp external events with high resolution, the CTMU provides precise time-interval and charge measurement for impedance sensing, and the 70 MIPS core executes DSP filtering (FIR/IIR) on sampled data using hardware MAC instructions. The 512KB Flash and 16KB RAM hold calibration tables, protocol firmware, and waveform buffers. The 121-TFBGA BGA package concentrates I/O in 10x10 mm, fitting dense multi-channel front-end boards where QFP alternatives would consume excessive board area.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33EP512GM310-H/BG – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33EP512GM310-I/BG | DSPIC33EP512GM310-E/BG | DSPIC33EP512GM310-H/PT |
|---|---|---|---|---|
| Package | 121-TFBGA (10x10x1.20 mm) | 121-TFBGA - same | 121-TFBGA - same | 100-TQFP (12x12) - different footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 512 KB (170K x 24) | 512 KB | 512 KB | 512 KB |
| RAM | 16 KB | 16 KB | 16 KB | 16 KB |
| MCPWM Channels | 12 | 12 | 12 | 12 |
| Temperature Grade | -H (extended/automotive grade) | -I (industrial) | -E (extended) | -H (extended) |
| Qualification | AEC-Q100, Automotive | AEC-Q100 (same die) | AEC-Q100, Automotive | AEC-Q100 (same die) |
| Drop-in on Same PCB | - | Yes | Yes | No (TQFP footprint) |
Wichtigste Unterscheidungsmerkmale
- Extended automotive temperature grade in BGA package (vs. DSPIC33EP512GM310-I/BG)
- Highest peripheral density in the GM31x family (vs. DSPIC33EP512GM306 (100-pin))
- Compact 10x10 mm BGA saves board area (vs. DSPIC33EP512GM310-H/PT)
Designhinweise
The 121-ball TFBGA (10x10 mm) requires a fine-pitch BGA breakout strategy. Plan a 2-4 layer board with via-in-pad or dog-bone fan-out, and escape signals on inner layers. Connect ALL VDD and VSS balls as required by the datasheet - omitting a supply ball on a BGA causes hard-to-diagnose brownouts. Place a 0.1uF ceramic decoupling capacitor adjacent to each supply ball cluster plus one bulk 10uF capacitor per rail.
ICSP programming uses paired PGECx/PGEDx pins - per NorthernSoftware device notes, ICSPCLK and ICSPDAT must come from the SAME pair (e.g., PGEC2 with PGED2); mixing pairs from different channels prevents programming. Provide a programming-header footprint connected to one chosen pair on the BGA fan-out, since reworking BGA balls after assembly is impractical.
Estimated: at 70 MIPS with typical core current on the order of tens of mA from a 3.3V rail, internal power dissipation is roughly 0.1-0.3 W, which a 10x10 BGA on a standard 4-layer PCB dissipates with a junction-to-ambient rise well within automotive temperature limits. For exact theta_JA and the -H grade temperature range, consult the Microchip datasheet; verify margins for your actual peripheral loading (op-amps, PWM drivers).
Compliance-Informationen
RoHS Compliant: Yes per Newark listing. Automotive, AEC-Q100 qualification per Hotenda and FindIC product descriptions. REACH and halogen-free status not stated in provided data.
