DSPIC33EP512GM310-E/BG - 16-bit DSC, 60 MIPS, 512KB Flash | Microchip
MPN: DSPIC33EP512GM310-E/BG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.19 | $8.19 |
| 10 | $7.6 | $76.00 |
| 100 | $6.95 | $695.00 |
| 500 | $6.4 | $3,200.00 |
| 1,000 | $5.95 | $5,950.00 |
DSPIC33EP512GM310-E/BG Overview
A digital signal controller combines the computational core of a microcontroller with the DSP capability of a digital signal processor. Within the power management hierarchy of embedded systems, the DSC sits between general-purpose MCUs and dedicated DSPs, offering deterministic interrupt latency, single-cycle MAC and divide instructions, and DSP-style addressing modes while retaining the peripherals and ease of use of a microcontroller. Microchip's dsPIC33E family is positioned for precision motor control, digital power conversion, and sensor signal processing.
Key features include the 16-bit dsPIC33EP CPU core with DSP engine, barrel shifter, and hardware multiply-accumulate; up to 60 MIPS operation; 12 motor-control PWM channels; eight input captures and eight output compares; two quadrature encoder interfaces for servo feedback; and four integrated operational amplifiers that reduce external component count in current-sense front ends. Four DMA channels offload the CPU for high-throughput data movement.
The GM310 silicon integrates an enhanced analog portfolio: multiple 10/12-bit ADC options with simultaneous sampling, comparators, and the four on-chip op amps, enabling current shunt amplification directly on-chip in motor drive designs. The -E temperature grade is qualified from -40C to +125C ambient, supporting under-hood and industrial automation environments.
Typical applications include BLDC/PMSM/ACIM motor control, digital power supplies and inverters, automotive body and powertrain subsystems, and industrial automation. The QEI peripherals make it a natural fit for servo and encoder-based positioning systems, while the op amps and ADCs simplify field-oriented control (FOC) implementations.
Design consideration: the 121-ball TFBGA requires fine-pitch PCB layout with controlled solder reflow and a solid ground plane; verify ball assignment against the datasheet before routing. Balance the peripheral-rich -E package cost against smaller GM variants if pin count requirements are lower.
This page synthesizes distributor pricing, drop-in family alternatives, design notes, and application guidance not consolidated in the manufacturer datasheet alone.
Drop-in alternatives for DSPIC33EP512GM310-E/BG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP512GM310-E/BG (same form factor and footprint) — differing in Qualification, Package, Core, RAM, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP512GM310-I/BG
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$6.2 / Unit
View Datasheet →DSPIC33EP512GM310T-E/BG
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP256GM310-E/BG
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$6.05 / Unit
View Datasheet →DSPIC33EP128GM310-E/BG
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.55 / Unit
View Datasheet →DSPIC33EP512GM610-I/BG
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP512GM310-E/BG Maximum Ratings & Electrical Characteristics
| Core | dsPIC33EP 16-bit DSC core |
| Maximum Clock Speed | 60 MIPS |
| Program Memory Size | 512 KB (170K x 24) Flash |
| RAM Size | 16 KB |
| Supply Voltage | 3.3 V |
| Package | 121-TFBGA (10x10 mm) |
| Operating Temperature | -40C to +125C (E grade) |
| Motor Control PWM Channels | 12 MC |
| Input Capture / Output Compare | 8 IC / 8 OC |
| Quadrature Encoder Interfaces | 2 QEI |
| On-chip Operational Amplifiers | 4 OpAmp |
| DMA Channels | 4 |
| Data Bus Width | 16 bit |
| Qualification | Automotive, AEC-Q100 |
| Core Architecture | Harvard |
| Special Features | Barrel shifter, boundary scan |
| Packaging Type | Tray |
| Mounting Type | Surface Mount |
DSPIC33EP512GM310-E/BG 121-tfbga (10x10 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP512GM310-E/BG (121-tfbga (10x10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP512GM310-E/BG.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP512GM310-E/BG is suitable for 6 applications: Precision Motor Control (FOC), Digital Power Conversion, Automotive Body and Auxiliary Electronics, Industrial Automation and Robotics, Sensor Signal Processing and Data Acquisition, Embedded Control and IoT Gateways.
Precision Motor Control (FOC)
The DSPIC33EP512GM310-E/BG is purpose-built for field-oriented control of BLDC, PMSM, and ACIM motors. Its 12 motor-control PWM channels provide complementary outputs with dead-time insertion for three-phase bridges, while the 4 on-chip op amps amplify shunt-resistor current signals before the ADC, eliminating external amplifier ICs and reducing phase-current measurement error. The 2 quadrature encoder interfaces read position feedback at 60 MIPS interrupt latency budgets, sustaining FOC loop rates above 20 kHz with headroom. The 512KB Flash holds the control algorithm plus field-weakening and communication stacks simultaneously. The -E grade tolerates drive-enclosure temperatures up to +125C ambient.
Recommended
Digital Power Conversion
In digital power supplies, PFC stages, solar inverters, and LLC converters, the DSPIC33EP512GM310-E/BG closes fast control loops using its high-speed 16-bit ADC and DSP MAC instructions for PI and resonant controller execution. The 12 PWM channels support interleaved and phase-shifted topologies with hardware dead time, while 4 DMA channels stream ADC results without CPU intervention, minimizing loop jitter. The 3.3V core with AEC-Q100 qualification and -40C to +125C operation suits power stages in industrial and automotive-adjacent environments. The 512KB Flash stores multiple converter profiles, enabling firmware-selectable output configurations in one hardware design.
Recommended
Automotive Body and Auxiliary Electronics
With AEC-Q100 qualification, a -40C to +125C operating range, and 3.3V single-supply operation, the DSPIC33EP512GM310-E/BG fits automotive body control modules, pump and fan controllers, and auxiliary actuator systems. The rich timer resources (8 input captures, 8 output compares) decode LIN/CAN-adjacent pulse protocols and drive actuators, while boundary-scan support aids production test per automotive quality flows. The 121-ball TFBGA conserves PCB area in dense modules. Designers should implement redundant ADC sampling of safety-related inputs and verify Flash retention over vehicle lifetime using the datasheet endurance specifications.
Recommended
Industrial Automation and Robotics
Servo drives, joint controllers, and factory automation nodes benefit from the DSPIC33EP512GM310-E/BG's combination of 2 QEI modules for incremental encoder feedback, 12 MC PWM channels for inverter drive, and 4 op amps for current sensing. At 60 MIPS, the core executes position/velocity/torque cascaded loops with deterministic latency across all three stages. The 512KB Flash and 16KB RAM accommodate motion profile generators plus EtherCAT-adjacent or CANopen application layers. The 121-ball TFBGA's 10x10 mm footprint integrates a complete multi-axis drive node controller into minimal board space on PC/104-style automation stacks.
Recommended
Sensor Signal Processing and Data Acquisition
The 4 integrated op amps and DSP-capable core make the DSPIC33EP512GM310-E/BG a single-chip front end for sensor conditioning: amplify bridge or shunt signals on-chip, sample with the high-speed ADC, then apply FIR/IIR filters using single-cycle MAC instructions. 4 DMA channels move conversion results to RAM while the CPU computes, sustaining high continuous sample rates without software bottlenecks. The barrel shifter accelerates fixed-point scaling across heterogeneous sensor ranges. 512KB Flash stores per-sensor calibration tables and compensation curves, supporting multi-channel systems in one -40C to +125C qualified device.
Recommended
Embedded Control and IoT Gateways
As a general high-performance embedded controller, the DSPIC33EP512GM310-E/BG provides 512KB Flash for protocol stacks and application firmware, 16KB RAM for buffering, and 4 DMA channels for efficient peripheral data movement. The plentiful input capture/output compare resources generate and decode timing-critical waveforms for ultrasonic, IR, and custom serial links, while the DSP engine handles feature extraction at the edge. The -E grade extends deployment into unconditioned outdoor enclosures up to +125C. Boundary-scan support eases ICT fixtures during manufacturing test of BGA-based designs.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP512GM310-E/BG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP512GM310-I/BG | DSPIC33EP512GM310T-E/BG | DSPIC33EP256GM310-E/BG | DSPIC33EP128GM310-E/BG |
|---|---|---|---|---|---|
| Package | 121-TFBGA (10x10 mm) | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same | 121-TFBGA (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 512 KB | 512 KB | 512 KB | 256 KB | 128 KB |
| RAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Maximum Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Temperature Range | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +125C (E grade) |
| Motor Control Peripherals | 12 MC PWM, 8 IC/8 OC, 2 QEI, 4 OpAmp | Same peripheral set | Same peripheral set | Same peripheral set | Same peripheral set |
| AEC-Q100 Automotive Qualification | Yes (automotive grade) | No (industrial grade) | Yes (automotive grade) | Yes (automotive grade) | Yes (automotive grade) |
Key Differentiators
- Extended -40C to +125C automotive-grade temperature range (vs DSPIC33EP512GM310-I/BG)
- Integrated analog front end reduces BOM (vs DSPIC33EP512GM610-I/BG)
- Maximum program memory in the family footprint (vs DSPIC33EP256GM310-E/BG)
Design Notes
The 121-ball TFBGA uses approximately 0.8 mm ball pitch in a 10x10 mm body. Fan out with via-in-pad or dog-bone escapes on 4-mil trace/spacing, and place a solid, unbroken ground plane directly on layer 2 to return the high transient currents of the 60 MIPS core. Tie all VDD balls to a common 3.3V rail with one 0.1 uF decoupling capacitor per supply ball pair plus one 10 uF bulk capacitor. Verify ball assignment against the Microchip datasheet ball map before routing; never copy a BGA map between GM3xx variants without checking.
Supply the device from a clean 3.3V rail; the dsPIC33EP core at 60 MIPS draws transient currents on every clock edge, so size the decoupling network for di/dt, not just average current. Estimated: with ~50-100 mA typical operating current and 0.1 uF per supply pin plus 10 uF bulk, rail droop stays in the tens of millivolts range during PWM burst events - verify with the datasheet electrical characteristics for your exact configuration. Sequencing is single-rail (3.3V only), simplifying power tree design compared to multi-rail MCUs.
Do not assume peripheral pin mapping from other dsPIC33EP packages - peripheral remapping (PPS) assignments differ between the 121-BG and 100-pin TQFP variants; confirm each I/O in the datasheet. When substituting the -I/BG for the -E/BG, remember the +85C ceiling: a design validated at 105C ambient on -E silicon will fail on -I. For FOC designs, keep the op-amp input routing to shunt resistors short and Kelvin-connect to the shunt pads to preserve the accuracy benefit of the integrated amplifiers.
The -E grade is rated to +125C ambient, which requires attention to self-heating: Estimated: at 3.3V and ~80 mA active current, internal dissipation is roughly 0.26 W; with a BGA theta-JA of approximately 30-40 C/W on a standard 4-layer board (verify exact value in the datasheet thermal table), junction rise is about 8-11 C above ambient - comfortably within margin at +125C ambient, but recheck at your actual operating frequency and I/O loading.
Compliance Information
Distributor data (adatasheet/Octopart) identifies this MPN as automotive AEC-Q100 qualified with -40C to +125C range. RoHS/REACH/lead-free/halogen-free declarations were not present in the provided verified data and must be confirmed from the Microchip product page or certificate of conformance.
