DSPIC33EP64GS504T-I/ML - 16-bit 70 MIPS DSC | Microchip Technology
Teilenummer: DSPIC33EP64GS504T-I/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $5.08 | $5,08 |
| 10 | $4.65 | $46,50 |
| 100 | $4.2 | $420,00 |
| 500 | $3.85 | $1.925,00 |
| 1.000 | $3.55 | $3.550,00 |
DSPIC33EP64GS504T-I/ML Übersicht
A Digital Signal Controller combines a microcontroller (MCU) with DSP processing capability in a single silicon device. Within the power-management hierarchy, a DSC such as the dsPIC33EP64GS504 replaces analog control loops with firmware-executed control, serving as the brain of a digital switch-mode power supply alongside drivers, MOSFETs and sensing circuits.
Key features include high-speed analog peripherals purpose-built for power conversion: fast ADCs for multi-loop current and voltage sensing, on-chip DACs, and PWM engines supporting advanced topologies. The device is designated by Microchip as a Functional Safety (FuSa) capable part, simplifying safety-oriented system design.
Technically, the dsPIC33E core executes an enhanced 16-bit RISC instruction set with DSP instructions (MAC, DSP multiply) at 70 MIPS, enabling tight control-loop deadlines for peak-current-mode and multi-phase converters. 64 KB of self-programmable Flash supports field firmware updates, and the QFN exposed pad provides low-inductance grounding critical for switching-noise immunity.
Typical applications include AC-to-DC converters, DC-to-DC converters, power factor correction (PFC) stages, and multi-loop digital SMPS in industrial, telecom and server power systems.
Design consideration: budget the exposed thermal/electrical pad connection carefully on the PCB; a solid ground plane under the QFN improves both heat dissipation and ADC accuracy in high dv/dt switching environments.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical digital-power design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für DSPIC33EP64GS504T-I/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33EP64GS504T-I/ML (gleiche Bauform und Footprint) – abweichend in Package, Core, Operating Temperature, Flash Program Memory, Functional Safety Support.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33EP64GS504-I/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$4.45 / Stück
Datenblatt ansehen →DSPIC33EP64GS504T-E/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33EP64GS504-E/ML
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.35 / Stück
Datenblatt ansehen →DSPIC33EP64GP504T-E/TL
✅ Drop-In✓ Auf Lager
$3.5 / Stück
Datenblatt ansehen →DSPIC33EP64GS504T-I/ML Grenzwerte & elektrische Eigenschaften
| Core | dsPIC33E 16-bit RISC with DSP |
| Maximum CPU Speed | 70 MIPS |
| Flash Program Memory | 64 KB (64K x 8) |
| Versorgungsspannung | 3.3 V (3V to 3.6V) |
| Gehäuse | 44-QFN (8x8 mm) with exposed pad |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +85C (I grade) |
| Packaging | Tape and Reel (T suffix) |
| Product Family | dsPIC33EPXXGS50X Digital Power SMPS DSC |
| High-Speed ADC | Yes |
| DAC | Yes |
| Functional Safety Support | Yes (FuSa) |
| Target Applications | SMPS and Digital Power Conversion |
| RoHS-Status | Compliant (lead-free, per standard Microchip QFN offering) |
| Pin-Anzahl | 44 |
DSPIC33EP64GS504T-I/ML 44-qfn (8x8 mm) with exposed pad Pinbelegungsleitfaden
Pinbelegung für DSPIC33EP64GS504T-I/ML (44-qfn (8x8 mm) with exposed pad-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33EP64GS504T-I/ML.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33EP64GS504T-I/ML ist geeignet für 6 Anwendungs: AC-DC Power Supply Control, DC-DC Converter Control, Power Factor Correction (PFC), Multi-Loop Digital SMPS, Industrial Automation Power Stages, Telecom and Server Power.
AC-DC Power Supply Control
The DSPIC33EP64GS504T-I/ML is explicitly listed by Microchip as supporting AC-to-DC converter applications. Its 70 MIPS DSP core executes voltage and current control loops for PFC and secondary-side regulation, while the high-speed ADC samples switch currents synchronized to the SMPS PWM events. Using one programmable DSC replaces multiple dedicated analog controllers, enabling firmware-updatable output characteristics and digital telemetry. The 44-QFN 8x8 exposed pad grounds the controller to the power ground plane, reducing switching-noise coupling into the analog front end in compact flyback and LLC designs.
Empfohlen
DC-DC Converter Control
For DC-to-DC stages such as buck, boost and half-bridge converters, the GS504's SMPS-optimized PWM peripherals with high resolution and the on-chip DAC comparators implement fast peak-current-mode control. The 70 MIPS dsPIC33E core closes the outer voltage loop in firmware while hardware handles per-cycle current limiting. The high-speed ADC's simultaneous sampling capability captures input, output and current sense channels with deterministic latency, keeping phase margin predictable. The 3.3 V QFN controller is typically placed on the controller side of an isolation boundary with optocoupler or digital isolator feedback.
Empfohlen
Power Factor Correction (PFC)
Microchip's dsPIC33EPXXGS50X family targets power factor correction among its headline digital-power applications. In a boost-PFC stage the GS504 samples input voltage, inductor current and output bus with its high-speed ADC, computes the current reference envelope, and drives the PFC switch through the SMPS PWM module - achieving power factors above 0.99 in reference designs. The 70 MIPS headroom accommodates harmonic compensation and feedforward algorithms while remaining below 50 percent CPU load. The -40C to +85C industrial rating of the -I/ML grade suits telecom rectifier front ends and industrial AC supplies.
Empfohlen
Multi-Loop Digital SMPS
The GS50X family was architected specifically for common multi-loop digital switch-mode power supplies, per Microchip's product overview. Multiple fast control loops - voltage mode outer loop plus per-phase current loops - run concurrently using the SMPS PWM engine and ADC-triggered sampling. The 64 KB Flash holds both control firmware and compensation tables, and the on-chip DACs set comparators for cycle-by-cycle protection. Digital implementation allows runtime tuning of loop gains, soft-start profiles and fault thresholds without hardware changes, which shortens development cycles in server and telecom power platforms.
Empfohlen
Industrial Automation Power Stages
Industrial drives, PLC power modules and automation cabinets embed digital power conversion controlled by the GS504. Its Functional Safety (FuSa) designation, noted by DigiKey, supports safety-oriented power architectures required in machinery. The 70 MIPS DSP core also handles motor-adjacent control tasks (e.g., servo drive power stages) while the 64 KB Flash stores application logic. The -40C to +85C operating range and surface-mount 44-QFN (8x8) footprint allow automated assembly on standard industrial SMT lines, and tape-and-reel supply supports high-volume manufacturing with pick-and-place equipment.
Empfohlen
Telecom and Server Power
Telecom rectifiers and server PSUs demand high efficiency, telemetry and hot-swap behavior - all served by firmware control on the GS504. The DSC implements PFC plus LLC control, digital current sharing between paralleled modules, and PMBus-style reporting over its serial peripherals. With 70 MIPS and hardware DSP MAC instructions, loop bandwidths sufficient for >100 kHz switching are achievable. The QFN exposed-pad package provides low-inductance grounding that keeps ADC readings clean in high dv/dt environments typical of 48 V server power shelves, and the -I temperature grade covers equipment-room ambient extremes.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33EP64GS504T-I/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33EP64GS504-I/ML | DSPIC33EP64GS504T-E/ML | DSPIC33EP64GP504T-E/TL |
|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) ML | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | UQFN-44 (different body, GS peripherals absent) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Performance | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 64 KB (64K x 8) | 64 KB | 64 KB | 64 KB |
| Supply Voltage | 3.3 V (3V to 3.6V) | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | -40C to +85C (I) | -40C to +85C | -40C to +125C | -40C to +125C |
| SMPS ADC/DAC Peripherals | Yes (GS digital-power family) | Yes | Yes | No (GP family) |
| Packaging Option | Tape & Reel (T) | Tube/sleeve | Tape & Reel (T) | Tape & Reel (T) |
Wichtigste Unterscheidungsmerkmale
- Dedicated digital-power analog subsystem (vs. DSPIC33EP64GP504T-E/TL)
- Extended-temperature drop-in availability (vs. DSPIC33EP64GS504T-E/ML)
- Tape-and-reel supply for volume manufacturing (vs. DSPIC33EP64GS504-I/ML)
Designhinweise
The 44-QFN (8x8) exposed pad is the primary ground return and heat path. Connect it to the PCB ground plane through a filled array of vias (typically 5x5 grid under the pad). A poor exposed-pad connection raises ground bounce and corrupts ADC readings synchronized to PWM switching events. Follow Microchip's QFN layout guidelines in the GS504 datasheet layout section, and keep analog sense routing away from switch-node traces.
The device operates from a 3V to 3.6V rail; design the 3.3 V supply with bulk (10 uF) plus local (0.1 uF) decoupling on each VDD pin. In SMPS environments, place an RC filter or ferrite between the noisy power ground rail and the DSC supply to protect ADC accuracy. Estimated: at 70 MIPS the core draws tens of mA - negligible thermally (tens of mW), but supply ripple must stay well below the ADC LSB for control-loop precision.
Do not substitute GP-family dsPIC33EP parts (e.g., DSPIC33EP64GP504) for the GS504: the SMPS high-speed ADC, DAC and PWM modules differ, and firmware built on Microchip's digital-power libraries will not link. Verify the exact temperature suffix (-I vs -E) against your worst-case ambient; the -I grade tops out at +85C. Confirm tape-and-reel quantity (standard full reel) matches your production batch to avoid cut-tape handling fees.
Compliance-Informationen
RoHS/lead-free per Microchip standard green packaging for current dsPIC33EP QFN devices; formal REACH, halogen-free and conflict-minerals declarations should be obtained from Microchip's compliance documentation portal.
