DSPIC33EP64GS504T-I/ML - 16-bit 70 MIPS DSC | Microchip Technology
Référence : DSPIC33EP64GS504T-I/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.08 | $5,08 |
| 10 | $4.65 | $46,50 |
| 100 | $4.2 | $420,00 |
| 500 | $3.85 | $1 925,00 |
| 1 000 | $3.55 | $3 550,00 |
DSPIC33EP64GS504T-I/ML Présentation
A Digital Signal Controller combines a microcontroller (MCU) with DSP processing capability in a single silicon device. Within the power-management hierarchy, a DSC such as the dsPIC33EP64GS504 replaces analog control loops with firmware-executed control, serving as the brain of a digital switch-mode power supply alongside drivers, MOSFETs and sensing circuits.
Key features include high-speed analog peripherals purpose-built for power conversion: fast ADCs for multi-loop current and voltage sensing, on-chip DACs, and PWM engines supporting advanced topologies. The device is designated by Microchip as a Functional Safety (FuSa) capable part, simplifying safety-oriented system design.
Technically, the dsPIC33E core executes an enhanced 16-bit RISC instruction set with DSP instructions (MAC, DSP multiply) at 70 MIPS, enabling tight control-loop deadlines for peak-current-mode and multi-phase converters. 64 KB of self-programmable Flash supports field firmware updates, and the QFN exposed pad provides low-inductance grounding critical for switching-noise immunity.
Typical applications include AC-to-DC converters, DC-to-DC converters, power factor correction (PFC) stages, and multi-loop digital SMPS in industrial, telecom and server power systems.
Design consideration: budget the exposed thermal/electrical pad connection carefully on the PCB; a solid ground plane under the QFN improves both heat dissipation and ADC accuracy in high dv/dt switching environments.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical digital-power design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33EP64GS504T-I/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP64GS504T-I/ML (même facteur de forme et même empreinte) — différant par Package, Core, Operating Temperature, Flash Program Memory, Functional Safety Support.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP64GS504-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.45 / unité
Voir la fiche technique →DSPIC33EP64GS504T-E/ML
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EP64GS504-E/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.35 / unité
Voir la fiche technique →DSPIC33EP64GP504T-E/TL
✅ Remplacement direct✓ En stock
$3.5 / unité
Voir la fiche technique →DSPIC33EP64GS504T-I/ML Valeurs maximales et caractéristiques électriques
| Core | dsPIC33E 16-bit RISC with DSP |
| Maximum CPU Speed | 70 MIPS |
| Flash Program Memory | 64 KB (64K x 8) |
| Tension d'alimentation | 3.3 V (3V to 3.6V) |
| Boîtier | 44-QFN (8x8 mm) with exposed pad |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +85C (I grade) |
| Packaging | Tape and Reel (T suffix) |
| Product Family | dsPIC33EPXXGS50X Digital Power SMPS DSC |
| High-Speed ADC | Yes |
| DAC | Yes |
| Functional Safety Support | Yes (FuSa) |
| Target Applications | SMPS and Digital Power Conversion |
| Statut RoHS | Compliant (lead-free, per standard Microchip QFN offering) |
| Nombre de broches | 44 |
Guide de configuration des broches du DSPIC33EP64GS504T-I/ML 44-qfn (8x8 mm) with exposed pad
Configuration des broches du DSPIC33EP64GS504T-I/ML (boîtier 44-qfn (8x8 mm) with exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33EP64GS504T-I/ML.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33EP64GS504T-I/ML convient pour 6 applications: AC-DC Power Supply Control, DC-DC Converter Control, Power Factor Correction (PFC), Multi-Loop Digital SMPS, Industrial Automation Power Stages, Telecom and Server Power.
AC-DC Power Supply Control
The DSPIC33EP64GS504T-I/ML is explicitly listed by Microchip as supporting AC-to-DC converter applications. Its 70 MIPS DSP core executes voltage and current control loops for PFC and secondary-side regulation, while the high-speed ADC samples switch currents synchronized to the SMPS PWM events. Using one programmable DSC replaces multiple dedicated analog controllers, enabling firmware-updatable output characteristics and digital telemetry. The 44-QFN 8x8 exposed pad grounds the controller to the power ground plane, reducing switching-noise coupling into the analog front end in compact flyback and LLC designs.
Recommandé
DC-DC Converter Control
For DC-to-DC stages such as buck, boost and half-bridge converters, the GS504's SMPS-optimized PWM peripherals with high resolution and the on-chip DAC comparators implement fast peak-current-mode control. The 70 MIPS dsPIC33E core closes the outer voltage loop in firmware while hardware handles per-cycle current limiting. The high-speed ADC's simultaneous sampling capability captures input, output and current sense channels with deterministic latency, keeping phase margin predictable. The 3.3 V QFN controller is typically placed on the controller side of an isolation boundary with optocoupler or digital isolator feedback.
Recommandé
Power Factor Correction (PFC)
Microchip's dsPIC33EPXXGS50X family targets power factor correction among its headline digital-power applications. In a boost-PFC stage the GS504 samples input voltage, inductor current and output bus with its high-speed ADC, computes the current reference envelope, and drives the PFC switch through the SMPS PWM module - achieving power factors above 0.99 in reference designs. The 70 MIPS headroom accommodates harmonic compensation and feedforward algorithms while remaining below 50 percent CPU load. The -40C to +85C industrial rating of the -I/ML grade suits telecom rectifier front ends and industrial AC supplies.
Recommandé
Multi-Loop Digital SMPS
The GS50X family was architected specifically for common multi-loop digital switch-mode power supplies, per Microchip's product overview. Multiple fast control loops - voltage mode outer loop plus per-phase current loops - run concurrently using the SMPS PWM engine and ADC-triggered sampling. The 64 KB Flash holds both control firmware and compensation tables, and the on-chip DACs set comparators for cycle-by-cycle protection. Digital implementation allows runtime tuning of loop gains, soft-start profiles and fault thresholds without hardware changes, which shortens development cycles in server and telecom power platforms.
Recommandé
Industrial Automation Power Stages
Industrial drives, PLC power modules and automation cabinets embed digital power conversion controlled by the GS504. Its Functional Safety (FuSa) designation, noted by DigiKey, supports safety-oriented power architectures required in machinery. The 70 MIPS DSP core also handles motor-adjacent control tasks (e.g., servo drive power stages) while the 64 KB Flash stores application logic. The -40C to +85C operating range and surface-mount 44-QFN (8x8) footprint allow automated assembly on standard industrial SMT lines, and tape-and-reel supply supports high-volume manufacturing with pick-and-place equipment.
Recommandé
Telecom and Server Power
Telecom rectifiers and server PSUs demand high efficiency, telemetry and hot-swap behavior - all served by firmware control on the GS504. The DSC implements PFC plus LLC control, digital current sharing between paralleled modules, and PMBus-style reporting over its serial peripherals. With 70 MIPS and hardware DSP MAC instructions, loop bandwidths sufficient for >100 kHz switching are achievable. The QFN exposed-pad package provides low-inductance grounding that keeps ADC readings clean in high dv/dt environments typical of 48 V server power shelves, and the -I temperature grade covers equipment-room ambient extremes.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP64GS504T-I/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP64GS504-I/ML | DSPIC33EP64GS504T-E/ML | DSPIC33EP64GP504T-E/TL |
|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) ML | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | UQFN-44 (different body, GS peripherals absent) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Performance | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 64 KB (64K x 8) | 64 KB | 64 KB | 64 KB |
| Supply Voltage | 3.3 V (3V to 3.6V) | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | -40C to +85C (I) | -40C to +85C | -40C to +125C | -40C to +125C |
| SMPS ADC/DAC Peripherals | Yes (GS digital-power family) | Yes | Yes | No (GP family) |
| Packaging Option | Tape & Reel (T) | Tube/sleeve | Tape & Reel (T) | Tape & Reel (T) |
Principaux différenciateurs
- Dedicated digital-power analog subsystem (vs DSPIC33EP64GP504T-E/TL)
- Extended-temperature drop-in availability (vs DSPIC33EP64GS504T-E/ML)
- Tape-and-reel supply for volume manufacturing (vs DSPIC33EP64GS504-I/ML)
Notes de conception
The 44-QFN (8x8) exposed pad is the primary ground return and heat path. Connect it to the PCB ground plane through a filled array of vias (typically 5x5 grid under the pad). A poor exposed-pad connection raises ground bounce and corrupts ADC readings synchronized to PWM switching events. Follow Microchip's QFN layout guidelines in the GS504 datasheet layout section, and keep analog sense routing away from switch-node traces.
The device operates from a 3V to 3.6V rail; design the 3.3 V supply with bulk (10 uF) plus local (0.1 uF) decoupling on each VDD pin. In SMPS environments, place an RC filter or ferrite between the noisy power ground rail and the DSC supply to protect ADC accuracy. Estimated: at 70 MIPS the core draws tens of mA - negligible thermally (tens of mW), but supply ripple must stay well below the ADC LSB for control-loop precision.
Do not substitute GP-family dsPIC33EP parts (e.g., DSPIC33EP64GP504) for the GS504: the SMPS high-speed ADC, DAC and PWM modules differ, and firmware built on Microchip's digital-power libraries will not link. Verify the exact temperature suffix (-I vs -E) against your worst-case ambient; the -I grade tops out at +85C. Confirm tape-and-reel quantity (standard full reel) matches your production batch to avoid cut-tape handling fees.
Informations de conformité
RoHS/lead-free per Microchip standard green packaging for current dsPIC33EP QFN devices; formal REACH, halogen-free and conflict-minerals declarations should be obtained from Microchip's compliance documentation portal.
