DSPIC33EP64GS506T-E/PT - 60 MIPS Digital Power DSC | Microchip
Teilenummer: DSPIC33EP64GS506T-E/PT ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $17.72 | $17,72 |
| 10 | $16.9 | $169,00 |
| 100 | $15.6 | $1.560,00 |
| 500 | $14.3 | $7.150,00 |
| 1.000 | $13.1 | $13.100,00 |
DSPIC33EP64GS506T-E/PT Übersicht
A digital signal controller combines the computational throughput of a DSP core with the peripherals and deterministic behavior of a microcontroller, sitting within the hierarchy of MCU -> digital signal controller -> digital signal processor. The dsPIC33EP GS50X family is purpose-built for digital switch-mode power supplies (SMPS), where firmware closes voltage and current control loops in place of analog compensation networks.
Key features include interconnected high-speed PWM modules with advanced modulation modes, a high-speed 12-bit ADC with multiple sample-and-hold circuits, programmable gain amplifiers (PGA), and analog comparators that can be cross-wired directly into PWM fault inputs for cycle-by-cycle current limiting. The parallel, independent power-supply-oriented architecture supports multi-loop, multi-phase and interleaved converter topologies such as AC-DC PFC stages, LLC resonant converters, and DC-DC modules.
The device executes a modified Harvard RISC instruction set with DSP engine (barrel shifter, single-cycle MAC) and includes boundary scan support for board-level test. 64KB of self-programmable Flash supports field firmware updates in deployed power products. The GS506 variant provides 64 pins of I/O-rich connectivity, fitting converter boards that need many gating and telemetry signals.
Typical applications include AC-DC power factor correction (interleaved PFC reference designs from Microchip producing up to 350W are documented for this family), LLC and half-bridge DC-DC converters, solar micro-inverters, battery chargers, LED drivers, and UPS systems.
Design consideration: the 60 MIPS core requires a clean 3.3V rail with adequate decoupling and careful grounding of the high-speed PWM and ADC domain; use Microchip's SMPS reference designs as a proven starting layout.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für DSPIC33EP64GS506T-E/PT – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33EP64GS506T-E/PT (gleiche Bauform und Footprint) – abweichend in Package, Core Architecture, DSP Features, Mounting Type, Packaging.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33EP64GS506-E/PT
✅ Drop-In✓ Auf Lager
$4.15 / Stück
Datenblatt ansehen →DSPIC33EP64GS506-I/PT
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33EP64GS506T-I/PT
✅ Drop-In✓ Auf Lager
$9.8 / Stück
Datenblatt ansehen →DSPIC33EP64GS504T-E/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.18 / Stück
Datenblatt ansehen →DSPIC33EP128GS506T-E/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP64GS506T-E/PT Grenzwerte & elektrische Eigenschaften
| Core Architecture | 16-bit dsPIC33EP Modified Harvard RISC with DSP engine |
| Maximum CPU Speed | 60 MIPS |
| Program Memory (Flash) | 64 KB (64K x 8) |
| Operating Voltage | 3.3 V |
| Gehäuse | 64-TQFP (10x10 mm), 0.5 mm terminal pitch |
| Montageart | Surface Mount (Gull Wing) |
| Qualification | Automotive, AEC-Q100 |
| Functional Safety | FuSa supported (per Microchip) |
| Betriebstemperaturbereich | -40C to +125C (Extended, E suffix) |
| Specialized Peripherals | High-Speed PWM, High-Speed ADC, PGA, Comparators |
| Target Applications | SMPS and digital power conversion |
| DSP Features | Barrel shifter, boundary scan support |
| Process Technology | CMOS |
| Packaging | Tape & Reel (T suffix) |
DSPIC33EP64GS506T-E/PT 64-tqfp (10x10 mm), 0.5 mm terminal pitch Pinbelegungsleitfaden
Pinbelegung für DSPIC33EP64GS506T-E/PT (64-tqfp (10x10 mm), 0.5 mm terminal pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33EP64GS506T-E/PT.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33EP64GS506T-E/PT ist geeignet für 6 Anwendungs: AC-DC Power Factor Correction (PFC), LLC Resonant DC-DC Converters, Solar Micro-Inverters, Battery Chargers and Battery Management Power Stages, UPS and Inverter Systems, High-Power LED Drivers.
AC-DC Power Factor Correction (PFC)
The DSPIC33EP64GS506T-E/PT closes voltage and current loops entirely in firmware for boost and interleaved PFC stages. Its interconnected high-speed PWM supports phase-shifted and interleaved gating, while the high-speed ADC with PGA samples inductor current and bus voltage with sub-microsecond latency, enabling average-current-mode control at 60 MIPS. Microchip documents an Interleaved PFC reference design for this family working from universal AC input to a single high-voltage DC output up to 350W. Placing comparators in the PWM fault path provides cycle-by-cycle overcurrent protection independent of CPU load, so the loop remains protected even during firmware faults - a key advantage over purely analog controllers needing external protection circuitry.
Empfohlen
LLC Resonant DC-DC Converters
For LLC half-bridge and full-bridge converters, the DSPIC33EP64GS506T-E/PT generates complementary high-speed PWM with programmable dead time and frequency modulation to regulate the resonant tank. The 60 MIPS DSP core with single-cycle MAC executes PI and compensator updates fast enough for control bandwidths in the tens of kilohertz, while the high-speed ADC captures output voltage and primary current synchronously with the switching period. Burst mode and soft-start sequencing are implemented in the PWM module, reducing stress at startup. AEC-Q100 qualification in the Extended -40C to +125C grade makes this controller suitable for telecom rectifiers, server power supplies, and onboard charger DC-DC stages.
Empfohlen
Solar Micro-Inverters
Micro-inverters demand MPPT control, grid-synchronous current injection, and anti-islanding protection from one controller. The DSPIC33EP64GS506T-E/PT delivers all three: the DSP engine computes MPPT perturb-and-observe at 60 MIPS, the high-speed ADC multiplexes panel voltage/current and grid voltage/current samples through its multiple sample-and-hold inputs, and the PWM module synthesizes the grid-frequency-modulated gating waveform. The 64KB Flash accommodates grid-compliance firmware with margin for field updates via self-programming. Extended temperature operation (-40C to +125C) suits sealed outdoor enclosures where ambient temperatures plus self-heating push junctions high, and AEC-Q100 qualification provides additional reliability screening.
Empfohlen
Battery Chargers and Battery Management Power Stages
Multi-chemistry battery chargers require CC/CV profiling, temperature-qualified charging, and protection timing - all firmware-defined on the DSPIC33EP64GS506T-E/PT. The high-speed ADC with PGA handles low-amplitude current-shunt signals directly, reducing external signal conditioning, while PWM channels independently drive buck/boost charging stages or multi-cell balancing switches. Comparators provide hardware overcurrent shutdown with nanosecond response, and the 60 MIPS core executes coulomb counting and state-machine logic concurrently with the control loop. The 64-pin package supplies ample I/O for cell-tap monitoring multiplexers, LED indication, and CAN or UART communication to a vehicle or pack-level BMS controller.
Empfohlen
UPS and Inverter Systems
Line-interactive and double-conversion UPS designs use the DSPIC33EP64GS506T-E/PT to run the inverter control loop, transfer switch logic, and battery management simultaneously. The DSP core computes sinusoidal reference generation and harmonic compensation at 60 MIPS, while the high-speed ADC samples AC output, bus voltage, and current through synchronized sample triggers tied to the PWM period for repeatable, low-jitter measurements. Dead-time and fault blanking are handled in hardware, improving robustness against shoot-through during load transients. Functional Safety (FuSa) support documentation from Microchip assists developers targeting uptime-critical medical, industrial, and data-center power architectures requiring documented failure analysis.
Empfohlen
High-Power LED Drivers
Dimmable, high-power LED drivers benefit from the DSPIC33EP64GS506T-E/PT combination of high-resolution PWM dimming and firmware control loops. The high-speed PWM delivers precise constant-current regulation of buck or boost LED stages, and the ADC continuously monitors LED current and heatsink temperature, enabling thermal foldback that protects the luminaire without additional analog circuitry. DALI, PWM, or 0-10V dimming interfaces are implemented in firmware using the 64-pin package's communication and timer peripherals. AEC-Q100 qualification makes the controller viable for automotive exterior lighting and daytime running lamps, where -40C cold-crank and +125C underhood-adjacent temperatures exceed standard commercial temperature ratings.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33EP64GS506T-E/PT – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33EP64GS506-E/PT | DSPIC33EP64GS506-I/PT | DSPIC33EP64GS506T-I/PT | DSPIC33EP64GS504T-E/PT | DSPIC33EP128GS506T-E/PT |
|---|---|---|---|---|---|---|
| Package | 64-TQFP (10x10 mm) | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Flash Program Memory | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 128 KB |
| Temperature Range | -40C to +125C (Extended) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +125C (Extended) |
| Packaging Format | Tape & Reel | Tube/Tray | Tube/Tray | Tape & Reel | Tape & Reel | Tape & Reel |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Wichtigste Unterscheidungsmerkmale
- Automotive Extended temperature with FuSa support in one SKU (vs. DSPIC33EP64GS506T-I/PT)
- Double the program memory on the same footprint (vs. DSPIC33EP64GS504T-E/PT)
- SMPS-optimized interconnect absent from GP-family parts (vs. DSPIC33EP64GP503T-I/TL)
Designhinweise
Power the DSPIC33EP64GS506T-E/PT from a clean 3.3V rail with dedicated decoupling per supply pin pair: place 100 nF ceramic capacitors at each VDD/VSS pair within 2 mm of the pins, plus a bulk 10 uF near the device. Because the SMPS-optimized ADC and PWM switch with nanosecond edges, avoid sharing this rail with gate-driver supplies; a small ferrite bead or dedicated LDO between the 5V/12V gate-drive domain and the 3.3V controller domain prevents gate-charge transients from corrupting ADC readings. Follow Microchip's SMPS reference design power tree as the proven baseline.
Separate the analog ground of the ADC/PGA pins from the power ground of the PWM gate signals, joining them at a single star point beneath the controller. Route high-speed PWM outputs away from analog sense lines, and place current-sense shunt routing as a Kelvin pair directly to the PGA/ADC input pins to preserve measurement accuracy. The 64-TQFP 0.5 mm pitch permits 6-8 mil traces; keep clock and PWM lines short with ground return vias nearby. Boundary scan (JTAG) support simplifies post-assembly verification of these routing nets on production boards.
Do not interchange the E (Extended, -40C to +125C) and I (Industrial, -40C to +85C) grades in automotive or high-temperature designs - the junction in a sealed SMPS enclosure routinely exceeds 85C even at moderate ambient, and the I grade will fail spec though it is otherwise pin-identical. Also confirm SRAM and ADC resolution figures from the current Microchip datasheet revision before finalizing the memory map, since third-party listings do not state these values. For Tape & Reel (T suffix) orders, verify moisture sensitivity handling and reflow profile per the product labeling.
Compliance-Informationen
AEC-Q100 automotive qualification and Functional Safety (FuSa) support are confirmed by DigiKey and Microchip USA listings. RoHS/REACH/lead-free/halogen status not stated in the provided data - verify on the official Microchip product page.
