DSPIC33EP64GS506T-I/PT - 70 MIPS 16-bit DSC 64KB Flash | Microchip
Teilenummer: DSPIC33EP64GS506T-I/PT ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $12.14 | $12,14 |
| 10 | $11.5 | $115,00 |
| 100 | $10.75 | $1.075,00 |
| 500 | $10.2 | $5.100,00 |
| 1.000 | $9.8 | $9.800,00 |
DSPIC33EP64GS506T-I/PT Übersicht
A Digital Signal Controller combines the computational power of a Digital Signal Processor (DSP) with the peripheral set and ease of use of a microcontroller (MCU). Within the power-management hierarchy, the dsPIC33EP64GS506 belongs to Microchip's SMPS and Digital Power Conversion family - a class of 16-bit RISC controllers purpose-built to close control loops digitally in switch-mode power supplies (SMPS).
Key features include a 70 MIPS (70 MHz) 16-bit RISC DSP core, interconnected high-speed PWM peripherals, high-speed ADC with PGA (programmable gain amplifier) inputs, integrated comparators, and connectivity including I2C, SPI, UART/USART, IrDA, and LINbus. IEEE 1149.2-compatible (JTAG) boundary scan, trace, and run-time watch support aid debugging. Flash-based program memory simplifies field updates.
Architecturally, the GS50X family tightly couples the PWM, ADC, and comparator resources so that current- and voltage-loop feedback paths complete within a single PWM cycle - the defining requirement for multi-loop digital power supplies. Barrel-shifter DSP instructions accelerate loop compensation math, while the Peripheral Trigger Generator automates ADC sampling synchronization with PWM events.
Typical applications include AC-to-DC power factor correction (PFC) converters, LLC and half-bridge resonant converters, DC-DC server power supplies, solar micro-inverters, and battery chargers. Microchip's 350 W Interleaved PFC reference design demonstrates the universal-input capability of this device family.
For design, budget the 3V to 3.6V supply rail carefully and use the remappable peripheral pin select (PPS) feature noted in the datasheet when assigning PWM and timer pins on the 64-pin package.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für DSPIC33EP64GS506T-I/PT – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33EP64GS506T-I/PT (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, DSP Features, Peripherals, Program Memory Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33EP64GS506-I/PT
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33EP64GS506T-E/PT
✅ Drop-In✓ Auf Lager
$13.1 / Stück
Datenblatt ansehen →DSPIC33EP128GS506T-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP32GS506T-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33EP64GS505T-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$4.85 / Stück
Datenblatt ansehen →DSPIC33EP512MC506T-I/PT
✅ Drop-In✓ Auf Lager
$5.55 / Stück
Datenblatt ansehen →DSPIC33EP64GS506T-I/PT Grenzwerte & elektrische Eigenschaften
| Core | dsPIC33EP, 16-bit RISC DSC |
| Maximum CPU Speed | 70 MIPS |
| Maximale Taktfrequenz | 70 MHz |
| Program Memory Size | 64KB (64K x 8) Flash |
| RAM Size | 8KB |
| Supply Voltage Range | 3 V to 3.6 V |
| Betriebstemperatur | -40C to +85C (I grade) |
| Gehäuse | 64-TQFP (10x10 mm), 0.5 mm pitch |
| Montageart | Surface Mount |
| Connectivity | I2C, SPI, UART/USART, IrDA, LINbus |
| Peripherals | High-speed PWM, high-speed ADC with PGA, comparators, DMA |
| Debug / Test | JTAG, IEEE 1149.2 compatible boundary scan, trace, run-time watch |
| DSP Features | Barrel shifter, fixed-point DSP instructions |
| Program Memory Type | Flash |
| Series | dsPIC33EP64GS50x Functional Safety (FuSa) |
| Target Application | SMPS and Digital Power Conversion |
| Packaging | Tape and Reel (T suffix) |
DSPIC33EP64GS506T-I/PT 64-tqfp (10x10 mm), 0.5 mm pitch Pinbelegungsleitfaden
Pinbelegung für DSPIC33EP64GS506T-I/PT (64-tqfp (10x10 mm), 0.5 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33EP64GS506T-I/PT.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33EP64GS506T-I/PT ist geeignet für 6 Anwendungs: AC-DC Power Factor Correction (PFC), LLC and Half-Bridge Resonant Converters, Server and Telecom DC-DC Power Supplies, Solar Micro-Inverters and String Optimizers, Battery Chargers and BMS Front Ends, Industrial SMPS and Uninterruptible Power Supplies.
AC-DC Power Factor Correction (PFC)
The DSPIC33EP64GS506T-I/PT is purpose-built for AC-to-DC power factor correction within Microchip's SMPS and Digital Power Conversion family. Its interconnected high-speed PWM and high-speed ADC with PGA close the inductor current loop fast enough for boost and interleaved PFC stages, while integrated comparators provide cycle-by-cycle overcurrent protection in hardware. Microchip's own 350 W Interleaved PFC reference design uses this device family with universal AC input to produce a single high-voltage DC output, providing validated firmware as a starting point. Placed as the sole controller, the DSC replaces analog PFC controllers and delivers adaptive, load-dependent compensation with firmware-tunable parameters. The trade-off versus an analog controller is firmware development effort, repaid by flexibility across voltage ranges and topologies.
Empfohlen
LLC and Half-Bridge Resonant Converters
Resonant topologies such as LLC half-bridge demand precise, rapidly updating switching frequency and dead-time control - exactly what the DSPIC33EP64GS506T-I/PT provides. Its 70 MIPS core executes compensator math for the voltage and current loops within each switching period, and the high-speed PWM module adjusts frequency, phase shift, and dead time with sub-nanosecond-class resolution at carrier frequencies typical of LLC designs. The high-speed ADC with PGA samples the output and resonant-tank currents synchronized to PWM events via the peripheral trigger architecture, minimizing sampling jitter. Compared with a fixed-function resonant controller, this DSC enables burst mode, adaptive dead-time optimization, and fault-recovery state machines in firmware. The 64-pin TQFP leaves enough GPIO for housekeeping tasks such as fan control and telemetry.
Empfohlen
Server and Telecom DC-DC Power Supplies
Server and telecom rectifier boards need multi-rail digital control with telemetry, and the DSPIC33EP64GS506T-I/PT fits both roles. The 70 MIPS 16-bit core runs nested voltage/current loops for buck or LLC stages while the UART/I2C peripherals stream PMBus-style telemetry to the system BMC, reducing the BOM by eliminating a separate housekeeping MCU. The high-speed ADC with PGA handles low-amplitude shunt or current-transformer feedback directly, and hardware comparators enforce cycle-by-cycle current limiting without CPU latency. The 3V to 3.6V supply matches common logic rails on these boards, and the -40C to +85C I-grade range covers forced-air server environments. Firmware updates via Flash programming allow field tuning of loop parameters and protection thresholds without hardware changes.
Empfohlen
Solar Micro-Inverters and String Optimizers
In solar micro-inverters, the DSPIC33EP64GS506T-I/PT performs MPPT, grid-current shaping, and protection in one controller. The 70 MIPS core executes MPPT algorithms and grid-synchronized inverter control concurrently, while the interconnected high-speed PWM drives the power stage with the precision required for low-THD grid current. The high-speed ADC with PGA samples panel voltage, current, and grid feedback with PWM-synchronized triggers, and comparators provide hardware-level fault gating for grid anomalies. The IEEE 1149.2-compatible JTAG boundary scan assists production board test of dense power PCBs. The -40C to +85C rating suits outdoor enclosures, and the 64-pin TQFP (10x10 mm) balances GPIO count against board area. Flash memory supports field firmware updates as grid codes evolve.
Empfohlen
Battery Chargers and BMS Front Ends
The DSPIC33EP64GS506T-I/PT implements multi-stage CC/CV battery charging algorithms digitally, adapting charge profiles per cell chemistry in firmware. Its high-speed ADC with PGA reads shunt currents and cell voltages with PWM-synchronized sampling that rejects switching ripple, and the 70 MIPS core runs charging state machines plus coulomb counting concurrently with the power-conversion loop. Integrated comparators provide immediate hardware shutdown on overcurrent or overvoltage events, a critical safety layer independent of software. LINbus and UART connectivity support communication with vehicle or pack-level controllers in automotive-adjacent charging products. Compared with analog charge controllers, this DSC enables adaptive thermal derating, diagnostic logging, and multi-chemistry support on one PCB. The 3.3V logic supply integrates cleanly with supervisory circuitry on charger boards.
Empfohlen
Industrial SMPS and Uninterruptible Power Supplies
Industrial power systems such as UPS units and distributed 48V converters benefit from the DSPIC33EP64GS506T-I/PT's ability to run multiple nested control loops - rectifier PFC, inverter output regulation, and battery-management charging - on a single 70 MIPS core. The interconnected high-speed PWM, high-speed ADC, and comparators guarantee that fast protection paths never wait on software, while firmware handles mode transitions (line, battery, bypass) and communication over UART or I2C to facility monitoring. The -40C to +85C industrial temperature range and 3V to 3.6V supply match standard industrial board constraints, and the 0.5 mm-pitch 64-TQFP supports reliable wave-free SMT assembly. JTAG boundary scan shortens production test development on densely populated power boards with fine-pitch digital sections.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33EP64GS506T-I/PT – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33EP64GS506-I/PT | DSPIC33EP64GS506T-E/PT | DSPIC33EP128GS506T-I/PT | DSPIC33EP512MC506T-I/PT |
|---|---|---|---|---|---|
| Package | 64-TQFP (10x10 mm) | 64-TQFP (10x10) - same | 64-TQFP (10x10) - same | 64-TQFP (10x10) - same | 64-TQFP (10x10) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 64 KB | 64 KB | 64 KB | 128 KB | 512 KB |
| Peripheral Focus | SMPS / Digital Power (high-speed PWM, ADC with PGA) | SMPS / Digital Power - same | SMPS / Digital Power - same | SMPS / Digital Power - same | Motor Control / General Purpose |
| Packaging Format | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
Wichtigste Unterscheidungsmerkmale
- SMPS-optimized peripheral interconnect (vs. DSPIC33EP512MC506T-I/PT)
- Flash-upgradable path without PCB change (vs. DSPIC33EP128GS506T-I/PT)
- Extended temperature option for harsh power environments (vs. DSPIC33EP64GS506T-E/PT)
Designhinweise
The DSPIC33EP64GS506T-I/PT requires a tightly regulated 3V to 3.6V supply. In SMPS designs the controller shares the board with large dv/dt switching nodes, so decouple each VDD pin with 0.1uF ceramics placed within 2 mm of the pin, plus bulk 10uF per supply group. Cross-talk from power-stage switching into the ADC reference will directly corrupt control-loop measurements; use a dedicated low-noise LDO or filtered rail for VDD/VDDCORE and the ADC reference path rather than tapping the noisy digital rail.
The 64-TQFP (10x10 mm, 0.5 mm pitch) leaves a central 5x5 mm area ideal for via stitching to ground planes; connect the DSC ground directly to a solid ground pour and keep the high-speed PWM traces short and matched for half-bridge gate-drive symmetry. Keep the high-speed ADC input traces away from PWM and gate-drive nets - route them as short, guarded traces over an unbroken ground plane. Use IEEE 1149.2 JTAG test-access pads on the PCB to enable boundary-scan production testing of fine-pitch sections.
Do not interchange the I-grade (-40C to +85C) and E-grade (-40C to +125C) order codes casually: they are pin-compatible but the I grade is not qualified above +85C, which matters in sealed power enclosures. Also note from the datasheet that some peripherals have pin-remapping limits - for example, external clock inputs for Timer1/2/3 are remappable, but INT0/INT4 external interrupts and PWM4/PWM5 on 64-pin devices are not. Verify PPS assignments early in schematic capture to avoid respins.
Compliance-Informationen
Compliance status not explicitly stated in the retrieved distributor snippets. Microchip standard dsPIC33EP production parts are typically RoHS-compliant/lead-free; confirm on the official Microchip product page before design-in.
