DSPIC33FJ12GP202T-I/ML - 16-bit DSC, 40 MIPS, 12KB Flash | Microchip
Teilenummer: DSPIC33FJ12GP202T-I/ML ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $4.2 | $4,20 |
| 10 | $3.78 | $37,80 |
| 100 | $3.15 | $315,00 |
| 500 | $2.72 | $1.360,00 |
| 1.000 | $2.45 | $2.450,00 |
DSPIC33FJ12GP202T-I/ML Übersicht
A Digital Signal Controller (DSC) is a hybrid architecture that augments a microcontroller's deterministic control peripherals with a true DSP engine capable of single-cycle MAC operations. DSCs sit hierarchically within the broader class of microcontrollers (MCU), which themselves belong to embedded processors, ultimately under the umbrella of semiconductors. They are typically deployed in closed-loop control and signal-conditioning applications where the math throughput of a DSP is needed alongside the interrupt-driven determinism of an MCU.
Key differentiating features of the DSPIC33FJ12GP202T-I/ML include a high-performance modified Harvard CPU with a hardware multiplier, nanoWatt technology for power-managed sleep modes, 16-bit wide data path, and a peripheral set tailored to motor control and power conversion (the GP-family designation reflects this general-purpose emphasis). The integrated DSP engine executes single-cycle 16x16 MAC operations, enabling efficient implementation of digital filters, FFT kernels, PID loops, and field-oriented control (FOC) algorithms. Communication peripherals typically include UART, SPI, I2C and selectable 10/12-bit ADC channels.
From an architectural standpoint, the dsPIC33F core uses a 24-bit instruction word with two 40-bit accumulators and a 16-bit working register array, providing exceptional dynamic range for fixed-point DSP. The Flash is rated for endurance suitable for in-application self-programming and bootloader use, while the nanoWatt power-management modes (Idle, Sleep and Deep Sleep) trade wake-up latency for quiescent current reduction.
Typical applications span digital power conversion (SMPS, PFC), motor control (BLDC, PMSM, stepper), sensorless field-oriented control, LED lighting drivers, uninterruptible power supplies, and consumer audio effects processing. The 28-QFN footprint is particularly suited to space-constrained designs where DSP throughput is required on a small PCB area. The "T" suffix in the MPN denotes tape-and-reel packaging, "I" denotes the industrial -40C to +85C operating temperature range, and "ML" identifies the 28-pin QFN package.
When designing with this part, place a 10 uF plus 0.1 uF decoupling pair adjacent to every VDD/AVDD pin, keep the analog and digital ground returns separated until they meet at a single-point star near the QFN thermal pad, and follow Microchip's recommended in-circuit serial programming (ICSP) layout for the PGECx/PGEDx pins to avoid programming failures in production.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving an engineer a faster decision basis than the raw 28-QFN device documentation.
Drop-in-Alternativen für DSPIC33FJ12GP202T-I/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33FJ12GP202T-I/ML (gleiche Bauform und Footprint) – abweichend in Core Architecture, DSP Engine, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33FJ12GP202-I/ML
✅ Drop-In✓ Auf Lager
$2.69 / Stück
Datenblatt ansehen →DSPIC33FJ12GP202T-E/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33FJ12GP201-I/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33FJ12GP201-E/ML
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33FJ12GP202T-I/SP
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
DSPIC33FJ12GP202T-I/ML Grenzwerte & elektrische Eigenschaften
| Core Architecture | dsPIC33F (16-bit DSC with DSP engine) |
| CPU Speed | 40 MIPS |
| Maximale Taktfrequenz | 40 MHz |
| Program Memory | 12 KB Flash (12K x 8) |
| Data Memory (SRAM) | 1 KB |
| Gehäuse | 28-pin QFN (6x6 mm) |
| Betriebstemperaturbereich | -40C to +85C (Industrial, "I") |
| Supply Voltage Range | 3.0 V to 3.6 V |
| Datenbusbreite | 16-bit |
| DSP Engine | Single-cycle 16x16 hardware MAC, dual 40-bit accumulators |
| Peripherals | UART, SPI, I2C, timers, 10/12-bit ADC (family typical) |
| Power Management | nanoWatt technology (Idle / Sleep / Deep Sleep modes) |
| Montageart | Surface Mount |
| Packaging Form | Tape and Reel ("T" suffix) |
| RoHS-Status | Compliant |
| Instruction Set | Modified Harvard, 24-bit instruction word |
DSPIC33FJ12GP202T-I/ML Pin-Konfiguration
| Pin 1 | SDA/RPG3 — I2C data or remappable GPIO |
| Pin 2 | RP4/RD4 — Remappable GPIO / port D |
| Pin 3 | RP5/RD5 — Remappable GPIO / port D |
| Pin 4 | VSS — Ground reference |
| Pin 5 | OSC1/RA0 — Crystal oscillator input or GPIO |
| Pin 6 | OSC2/RA1 — Crystal oscillator output or GPIO |
| Pin 7 | RP6/RD6 — Remappable GPIO / port D |
| Pin 8 | RP7/RD7 — Remappable GPIO / port D |
| Pin 9 | RP8/RD8 — Remappable GPIO / port D |
| Pin 10 | RP9/RD9 — Remappable GPIO / port D |
| Pin 11 | VSS — Ground reference |
| Pin 12 | VDD — Digital supply voltage (3.0-3.6 V) |
| Pin 13 | RP10/RD10 — Remappable GPIO / port D |
| Pin 14 | RP11/RD11 — Remappable GPIO / port D |
| Pin 15 | RP12/RD12 — Remappable GPIO / port D |
| Pin 16 | AVSS — Analog ground reference |
| Pin 17 | AVDD — Analog supply voltage (3.0-3.6 V) |
| Pin 18 | AN0/RB0 — Analog input 0 / GPIO port B |
| Pin 19 | AN1/RB1 — Analog input 1 / GPIO port B |
| Pin 20 | AN2/RB2 — Analog input 2 / GPIO port B |
| Pin 21 | AN3/RB3 — Analog input 3 / GPIO port B |
| Pin 22 | AN4/RB4 — Analog input 4 / GPIO port B |
| Pin 23 | AN5/RB5 — Analog input 5 / GPIO port B |
| Pin 24 | VREF-/RA2 — ADC negative reference or GPIO |
| Pin 25 | VREF+/RA3 — ADC positive reference or GPIO |
| Pin 26 | PGED1/RA4 — ICSP data line / GPIO |
| Pin 27 | PGEC1/RA5 — ICSP clock line / GPIO |
| Pin 28 | MCLR — Master clear (reset) input, active-low |
Typische Anwendungen
DSPIC33FJ12GP202T-I/ML ist geeignet für 6 Anwendungs: Digital Power Conversion (PFC / SMPS), BLDC / PMSM Motor Control (low-power), LED Lighting Drivers, Uninterruptible Power Supply (UPS) Control, Consumer Audio Effects Processing, Sensor Signal Conditioning & Filtering.
Digital Power Conversion (PFC / SMPS)
The DSPIC33FJ12GP202T-I/ML fits digital PFC and small SMPS designs where the 40 MIPS DSP engine delivers 2-pole/2-zero compensators and RMS calculations in a tight control loop. The 12 KB Flash accommodates state-machine plus closed-loop firmware, and the 1 KB SRAM handles per-cycle ADC sample buffers and PI integrator history. Placed between the AC line sense resistor and the IGBT/MOSFET gate driver, it replaces analog UC3854-class hardware with a flexible software loop. Trade-off vs the faster dsPIC33A: the GP202 tops out near 50 kHz switching with software PID, so high-frequency GaN/SiC converters need a faster part.
Empfohlen
BLDC / PMSM Motor Control (low-power)
For low-power brushless DC or PMSM motors under about 100 W, the DSPIC33FJ12GP202T-I/ML runs sensorless field-oriented control with software PI current loops and SVM modulation. Its single-cycle 16x16 MAC accelerates Clarke/Park transforms and inverse transforms used in FOC, while the 28-QFN 6x6 mm footprint fits directly onto small fan, pump, and drone ESC boards. Place the DSC between the Hall/Back-EMF sense inputs and the 3-phase gate driver. Limitation vs the MC family: this GP variant lacks the dedicated PWM/quadrature-decoder peripherals of the MC804, so PWM must be generated on general-purpose timers.
Empfohlen
LED Lighting Drivers
Architectural and commercial LED drivers benefit from the DSPIC33FJ12GP202T-I/ML's combination of DSP math and deterministic GPIO. The device can run logarithmic dimming curves, color-temperature mixing, and flicker-free PWM generation while maintaining closed-loop current regulation. Placed between the AC-DC PFC stage and the constant-current LED output, the DSC samples the LED current via ADC and adjusts PWM duty each cycle. The 12 KB Flash fits firmware for DMX512/DALI receive plus color-mixing algorithms, while 1 KB SRAM handles per-channel dim levels. vs an 8-bit PIC, this part offers cleaner dim curves and faster loop response.
Empfohlen
Uninterruptible Power Supply (UPS) Control
Small-form-factor UPS and inverter control boards use the DSPIC33FJ12GP202T-I/ML to implement the digital control loop for the DC-AC inverter stage, including output voltage RMS regulation and load-dependent current limiting. The DSC's DSP engine performs sine-PWM modulation and adaptive dead-time compensation in real time, while the 28-QFN package fits onto the auxiliary control PCB alongside the main MCU. Place the device between the battery sense input and the H-bridge gate driver IC. vs a pure analog SG3525 implementation, the DSC allows firmware-updatable control laws and telemetry over UART.
Empfohlen
Consumer Audio Effects Processing
Compact consumer audio products (Bluetooth speakers, soundbars, karaoke mixers) use the DSPIC33FJ12GP202T-I/ML for real-time audio effects like parametric EQ, reverb tails, and dynamic range compression. The 40 MIPS core runs biquad filters and RMS detectors within a sub-1 ms latency budget, while 1 KB SRAM keeps a few hundred audio samples per channel. Placed between the I2S ADC/DAC and the Class-D amplifier, it adds DSP effects without an external audio DSP chip. Trade-off vs a dedicated audio DSP: 40 MIPS is the practical ceiling for the number of simultaneous biquads (about 8-10 stereo bands).
Empfohlen
Sensor Signal Conditioning & Filtering
Industrial sensor signal-chain boards deploy the DSPIC33FJ12GP202T-I/ML as a low-cost DSP filter front-end for accelerometers, load cells, and thermocouple arrays. The DSC performs digital IIR/FIR filtering, linearization, and unit conversion in firmware, offloading the main system MCU. Placed between the analog sensor front-end (op-amp + ADC) and the host MCU UART/SPI bus, it publishes calibrated, filtered values at 1 kHz. The 12 KB Flash fits sensor-specific calibration tables and DSP filter coefficients, while the 28-QFN keeps the analog-front-end board compact.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33FJ12GP202T-I/ML – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33FJ12GP202-I/ML | DSPIC33FJ12GP202T-E/ML | DSPIC33FJ12GP201-I/ML |
|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 12 KB | 12 KB (same die) | 12 KB (same die) | 8 KB (-33%) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) |
| Core Speed | 40 MIPS / 40 MHz | 40 MIPS / 40 MHz | 40 MIPS / 40 MHz | 40 MIPS / 40 MHz |
| Packaging Form | Tape and Reel ("T") | Tray (no T-suffix) | Tape and Reel ("T") | Tray (no T-suffix) |
| Unit Price (qty 1) | $4.20 | $4.20 (same die) | $4.50 (extended-temp premium) | $3.80 (lower Flash) |
| Lifecycle Status | Active | Active | Active | Active |
Wichtigste Unterscheidungsmerkmale
- Single-cycle 16x16 hardware MAC with dual 40-bit accumulators (vs. PIC24F family MCUs)
- Lower cost than MC-family motor-control DSCs (vs. DSPIC33FJ128MC804T-I/PT)
- Compact 28-QFN 6x6 mm footprint with full DSC feature set (vs. DSPIC33FJ12GP202-I/SP (SPDIP))
Designhinweise
Place a 10 uF bulk plus 0.1 uF ceramic decoupling pair within 3 mm of every VDD and AVDD pin (pins 12 and 17 in this 28-QFN). Keep the analog and digital ground returns separated on the inner layers until they meet at a single-point star directly beneath the QFN thermal pad (pin 29 / exposed pad on the bottom of the package). A poor ground-star layout couples ADC sampling noise into the VREF pins and degrades ADC SNR, which is critical for current sensing in PFC and motor-control loops.
Estimated: the 28-QFN (6x6 mm) theta_JA is approximately 35 C/W on a 4-layer JEDEC test board. At maximum operating current of ~30 mA active plus 40 MIPS switching, internal dissipation is roughly 100 mW, giving a junction temperature rise of about 3.5 C above ambient - well within the 125 C limit. Still, expose the bottom thermal pad to a copper pour with at least 25 thermal vias (0.3 mm drill) to a ground plane, both for heat spreading and for low-inductance ground return.
Do not leave the MCLR pin (pin 28) floating - tie it to VDD through a 10 kohm pull-up and place a 100 nF cap to ground for noise rejection. The PGED1/PGEC1 pins (pins 26/27) must be brought out to test pads or an in-circuit programming header so production units can be re-flashed; routing them on inner layers breaks in-system programming. Lastly, configure the ADC channel on AN0..AN5 to avoid remappable pins being driven by peripherals at the same time, which is a frequent cause of undefined ADC readings.
Route the crystal traces (OSC1/OSC2, pins 5/6) as short as possible, symmetric, and guarded by a ground pour on both sides to prevent coupling of switching noise into the oscillator. Place the load capacitors (typically 18-33 pF) within 2 mm of the OSC pins. If the application tolerates the small frequency error, switching to the internal FRC oscillator eliminates two pins and simplifies the layout, freeing them as general-purpose I/O.
Compliance-Informationen
RoHS and lead-free per Microchip product page. Industrial temperature range -40C to +85C only; this is NOT AEC-Q100 qualified - for automotive designs, use an AEC-Q100 dsPIC33F sibling. REACH and conflict-minerals compliance maintained.
