Microchip Technology

PIC16F18857-I/ML - 56KB Flash 8-bit MCU, 32MHz XLP | Microchip

Teilenummer: PIC16F18857-I/ML ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
1.8 V to 5.5 V Vdss 28-pin QFN (6x6 mm) Package 32 MHz Speed 56 KB (32K x 14 words) Memory
Ab $1.39 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-10-09
Mengenpreise
Menge Stückpreis Gesamt
1 $2.45 $2,45
10 $2.21 $22,10
100 $1.96 $196,00
500 $1.74 $870,00
1.000 $1.55 $1.550,00
3.000 $1.39 $4.170,00
ℹ️ Alle Preise sind in USD

PIC16F18857-I/ML Übersicht

The Microchip Technology PIC16F18857-I/ML is an 8-bit RISC PIC microcontroller built around the PIC16 mid-range core, operating at up to 32MHz with 56KB (32K x 14-word) of on-chip Flash program memory, housed in a 28-pin QFN (6x6 mm) package with the -I industrial temperature grade (-40C to +85C). It integrates 4KB SRAM, 256 bytes of EEPROM, a 10-bit Analog-to-Digital Converter (ADC), and rich communication peripherals including EUSART, I2C, and SPI, targeting general-purpose, low-power, and Functional Safety (FuSa) applications.

An 8-bit MCU in the Microchip PIC16 family uses a RISC Harvard-architecture core, providing deterministic instruction execution (most instructions complete in one instruction cycle) for predictable real-time behavior. The "16" in the prefix denotes the mid-range PIC16 architecture, which sits between the baseline PIC10/12/16 families and the high-performance PIC18/PIC24/dsPIC families. These MCUs are widely used in industrial automation, IoT sensor nodes, automotive body electronics, and consumer devices where low power consumption, robust peripherals, and easy in-circuit programmability outweigh the need for high clock speed. LDO regulators, EEPROM memories, and sensor ICs typically complement PIC16 designs; suitable companion devices include Microchip MCP1700 LDOs and MCP2210 USB-to-SPI bridges.

Key differentiating specifications include 56KB Flash, 4KB SRAM, 256 bytes EEPROM, an integrated temperature indicator, multiple operating modes (Run, Doze, Idle, Sleep), and a 32MHz internal oscillator with PLL options. Functional Safety (FuSa) features include a Windowed Watchdog Timer (WWDT), hardware CRC/SCAN, and a built-in self-test (BIST) capability that allows the device to satisfy IEC 60730 Class B safety requirements for home appliances, while eXtreme Low Power (XLP) technology enables nanoWatt standby currents for battery-powered designs.

Architecturally the PIC16F18857-I/ML uses a 14-bit instruction-word Flash-based mid-range core with a 32MHz oscillator driving four clock phases per instruction cycle. The Core Independent Peripheral (CIP) blocks - Configurable Logic Cells (CLC), Numerically Controlled Oscillator (NCO), and Complementary Waveform Generator (CWG) - execute tasks without CPU intervention, freeing the core for application logic. Voltage regulator flexibility from 1.8V to 5.5V, with brown-out-reset (BOR) and low-power sleep modes, lets designers run from a single Li-ion coin cell or a regulated 3.3V supply; the QFN exposed pad must be soldered to a continuous ground plane for thermal dissipation.

Typical applications include IoT sensor nodes, battery-powered remote controls, home appliances targeting IEC 60730 Class B safety, automotive body and interior modules, sensor interface boards, and low-cost motor-control designs. Pairing the device with an MCP2210 USB-to-SPI bridge or an external EEPROM is straightforward because the peripheral pin-select (PPS) feature lets designers route digital functions to almost any available I/O pin.

When designing with this device, ensure that the Watchdog Timer window and BOR thresholds are configured in firmware using the configuration-word settings, and confirm the QFN exposed pad is soldered to the ground plane for thermal dissipation. Using the MPLAB X IDE with the XC8 compiler in free or professional mode is recommended for full CIP-aware code generation and IEC 60730 safety library support.

This page synthesizes distributor inventory, real-time pricing across multiple quantity tiers, pin-compatible drop-in alternatives in the PIC16F1885X/7X family, and practical design notes that complement the manufacturer datasheet for faster engineering decisions.

Drop-in-Alternativen für PIC16F18857-I/ML – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit PIC16F18857-I/ML (gleiche Bauform und Footprint) – abweichend in Package, ADC, Core Architecture, Operating Temperature, Timers.

Microchip Technology
Package: QFN-28 (6x6 mm)
ADC: 10-bit ADC2 with Computation
Core Architecture: 8-bit PIC (enhanced mid-range, 14-bit instruction word)
Microchip Technology
Package: 28-pin QFN (6x6 mm) with exposed pad
ADC: 10-bit, up to 24 channels
Core Architecture: PIC16 enhanced mid-range 8-bit
Microchip Technology
Package: 28-pin QFN (ML) 6x6 mm with exposed pad
ADC: 10-bit ADC2 with computation, up to 24 channels
Core Architecture: 8-bit PIC enhanced mid-range (14-bit instruction word)
Microchip Technology
Package: 28-QFN (ML) 6x6 mm with Exposed Pad
ADC: 10-bit, up to 24 channels (ADC2 with Computation)
Operating Temperature: -40C to +85C (Industrial)
Microchip Technology
Package: 28-pin QFN (6x6 mm) with exposed pad
ADC: 10-bit with computation
Operating Temperature: -40C to +85C (industrial)
Microchip Technology
Package: 28-pin QFN (HVQCCN) with EP, 6x6 mm
ADC: 10-bit ADCC (Analog-to-Digital Converter with Computation)
Core Architecture: 8-bit PIC RISC (enhanced mid-range)
Microchip Technology
Package: 28-pin SOIC wide (7.50 mm body)
ADC: 10-bit, up to 24 channels
Core Architecture: PIC RISC 8-bit
Microchip Technology
Package: 28-pin SSOP (5.30 mm body)
ADC: 10-bit, multiple channels
Core Architecture: 8-bit PIC RISC
Microchip Technology
Package: 28-QFN (6x6 mm)
ADC: 10-bit with computation
Core Architecture: PIC16 8-bit Enhanced Mid-Range
Microchip Technology
Package: 44-pin QFN (8x8 mm)
ADC: 10-bit ADC with Computation (ADC2)
Core Architecture: 8-bit PIC16 enhanced mid-range
Microchip Technology
Package: 44-pin TQFP (PT) 10x10 mm
ADC: 12-bit ADC with Computation (ADCC)
Operating Temperature: -40 C to +85 C (Industrial, -I grade)
Microchip Technology
Package: 44-QFN (8x8 mm) with Exposed Pad (ML)
Core Architecture: PIC16 (Enhanced Mid-Range) 8-bit RISC
Timers: 11

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

PIC16F18877-I/ML

✅ Drop-In ⚠️ Spezifikationen ungeprüft
Microchip Technology
📦 28-QFN (6x6)
PIC enhanced mid-range 8-bit · 14-bit · 56 KB (32K x 14) · 4 KB · 256 B · 32 MHz · 32 MHz (no external clock required) · 2.3 V to 5.5 V

✓ Auf Lager

$2.4 / Stück

Datenblatt ansehen →

PIC16F18876-I/ML

✅ Drop-In ⚠️ Spezifikationen ungeprüft
Microchip Technology
📦 28-QFN (6x6)
PIC16 (Enhanced Mid-Range) 8-bit RISC · 32 MHz max · 28 KB (16K x 14 words) · 2 KB · 256 bytes · 44-QFN (8x8 mm) with Exposed Pad (ML) · Surface Mount · 44

✓ Auf Lager

$2.15 / Stück

Datenblatt ansehen →

PIC16F18875-I/ML

✅ Drop-In ⚠️ Spezifikationen ungeprüft
Microchip Technology
📦 28-QFN (6x6)
8-bit PIC16 enhanced mid-range · PIC16(L)F1885X/7X · 32 MHz (8 MIPS) · 14 KB (8K x 14) · 1 KB · 256 bytes · 1.8 V to 5.5 V · -40 C to +85 C (industrial, suffix I)

✓ Auf Lager

$1.55 / Stück

Datenblatt ansehen →

PIC16F18857-I/MLVAO

✅ Drop-In
📦 28-QFN (6x6)
Automotive (V) and high-temperature (A/O) screening variant; same die, same 28-QFN footprint

📋 Referenzalternative (nicht im Katalog)

PIC16F18855-I/ML

✅ Drop-In ⚠️ Spezifikationen ungeprüft
Microchip Technology
📦 28-QFN (6x6)
8-bit PIC enhanced mid-range (14-bit instruction word) · PIC16(L)F1885X/7X · 32 MHz · 14 KB (8K x 14 words) · 1 KB · 256 B · 2.5 V to 5.5 V · 1.8 V to 3.6 V

✓ Auf Lager

$1.38 / Stück

Datenblatt ansehen →

PIC16F18857-I/ML Grenzwerte & elektrische Eigenschaften

Part Family PIC16(L)F1885X/7X
CPU Core PIC16 8-bit RISC (mid-range)
Program Memory (Flash) 56 KB (32K x 14 words)
Data SRAM 4 KB
Data EEPROM 256 bytes
Maximum CPU Frequency 32 MHz
Operating Voltage Range 1.8 V to 5.5 V
ADC 10-bit, with up to 25 analog channels
Digital I/O Pins Up to 36
CCP / ECCP Modules 5 CCP and 3 ECCP
Communication Peripherals EUSART, I2C, SPI
Operating Temperature (I grade) -40 C to +85 C
Gehäuse 28-pin QFN (6x6 mm)
Montageart Surface Mount
RoHS-Status Compliant
Functional Safety IEC 60730 Class B capable (CRC/SCAN, WWDT, HLT)
Low-Power Mode XLP eXtreme Low Power with nanoWatt standby

PIC16F18857-I/ML Pin-Konfiguration

QFN-28 Package Pinout Diagram QFN-28 5x5mm, P0.5mm, EP 3.1x3.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 QFN-28
Pin 1 RA5 — Port A digital I/O / analog input
Pin 2 RA4 — Port A digital I/O / analog input
Pin 3 RA3 — Port A digital I/O / analog input
Pin 4 RA2 — Port A digital I/O / analog input
Pin 5 RA1 — Port A digital I/O / analog input
Pin 6 RA0 — Port A digital I/O / analog input
Pin 7 VSS — Ground reference
Pin 8 VDD — Positive supply voltage (1.8V-5.5V)
Pin 9 OSC1 — Crystal oscillator input or external clock
Pin 10 OSC2 — Crystal oscillator output
Pin 11 RC0 — Port C digital I/O / analog input
Pin 12 RC1 — Port C digital I/O / analog input
Pin 13 RC2 — Port C digital I/O / analog input
Pin 14 RC3 — Port C digital I/O (SCL peripheral, default)
Pin 15 RC4 — Port C digital I/O (SDA peripheral, default)
Pin 16 RC5 — Port C digital I/O / analog input
Pin 17 RC6 — Port C digital I/O / analog input
Pin 18 RC7 — Port C digital I/O / analog input
Pin 19 RB0 — Port B digital I/O / interrupt-on-change
Pin 20 RB1 — Port B digital I/O / interrupt-on-change
Pin 21 RB2 — Port B digital I/O / interrupt-on-change
Pin 22 RB3 — Port B digital I/O / interrupt-on-change
Pin 23 RB4 — Port B digital I/O / interrupt-on-change
Pin 24 RB5 — Port B digital I/O / interrupt-on-change
Pin 25 RB6 — Port B digital I/O / ICSCLK
Pin 26 RB7 — Port B digital I/O / ICSDAT
Pin 27 MCLR — Master clear reset input (active low)
Pin 28 EP — Exposed thermal pad - tie to ground copper pour

Typische Anwendungen

PIC16F18857-I/ML ist geeignet für 6 Anwendungs: Battery-Powered IoT Sensor Node, Home Appliance Control (IEC 60730 Class B), Automotive Body and Interior Module, Industrial Sensor Interface Board, Low-Cost BLDC / FOC Motor Control, Remote Control / Wireless Beacon.

🧩

Battery-Powered IoT Sensor Node

The PIC16F18857-I/ML fits battery-powered IoT sensor nodes because of its nanoWatt XLP sleep current and 32MHz mid-range performance for periodic sampling duty cycles. With 56KB Flash and 4KB SRAM, the device can hold a protocol stack plus sensor-processing firmware (e.g., LoRaWAN or BLE beacon logic) without external memory, reducing PCB area in coin-cell designs. The integrated 10-bit ADC drives analog sensors directly, while the I2C/SPI peripherals connect to digital sensors. Core Independent Peripherals (CLC, NCO, CWG) offload repetitive tasks from the CPU so the device can sleep more frequently, extending battery life from a single CR2032 cell to multi-year operation.

🏭

Home Appliance Control (IEC 60730 Class B)

For household appliances such as washing machines, dishwashers, ovens and coffee makers, the PIC16F18857-I/ML meets IEC 60730 Class B safety requirements via its Windowed Watchdog Timer (WWDT), CRC/SCAN hardware blocks and Hardware Limit Timer (HLT). These blocks detect clock anomalies and corrupted Flash in real time, triggering a safe shutdown if a fault occurs. Designers pair the MCU with the MPLAB XC8 Class B safety library and a triac-driver companion for motor and heater control via the 3 ECCP modules. The 5.5V tolerant I/O simplifies interfacing with 5V triac optocouplers common in white-goods designs.

🚗

Automotive Body and Interior Module

The PIC16F18857-I/ML serves automotive body and interior modules such as seat controllers, mirror adjusters, ambient lighting drivers, and HVAC panel nodes, where its 32MHz performance and rich CIPs drive PWM lighting via the CWG and ECCP blocks. The -I industrial temperature grade and 1.8V-5.5V supply range tolerate automotive cranking transients when paired with a wide-input LDO. Automotive-grade screening is available as a separate suffix (PIC16F18857-I/MLVAO), and the 5 CCP/ECCP modules provide motor-control flexibility for HVAC flaps and lumbar pumps. Functional Safety blocks improve OEM acceptance for safety-relevant features.

🏭

Industrial Sensor Interface Board

In industrial 4-20 mA loop, RTD and bridge-sensor interface boards, the PIC16F18857-I/ML converts analog readings via its 10-bit ADC and forwards them as digital data over RS-485 (EUSART) or CAN-isolated links. The 32MHz MIPS and 4KB SRAM comfortably run linearization and PID loops for process sensors, while PPS lets designers reassign peripheral functions to almost any I/O. The wide 1.8V-5.5V supply simplifies integration into loop-powered 24V systems via a small buck converter or an LDO. CRC/SCAN diagnostics catch signal-chain faults that would otherwise corrupt sensor readings.

⚡

Low-Cost BLDC / FOC Motor Control

The PIC16F18857-I/ML and its 3 ECCP modules deliver sensorless or Hall-sensor BLDC motor commutation at speeds up to several thousand RPM in small fans, pumps and appliance drives. The Complementary Waveform Generator (CWG) produces dead-band-aware complementary drive signals with hardware fault protection, offloading PWM from the CPU. The peripheral pin-select (PPS) feature remaps PWM outputs to almost any I/O, simplifying PCB routing on dense motor boards. With 56KB Flash, designers implement basic field-oriented-control (FOC) libraries or trapezoidal commutation in C without external program memory.

📱

Remote Control / Wireless Beacon

In RF remote controls and beacon-style IoT transmitters, the PIC16F18857-I/ML handles button scanning, debouncing, encoding and low-duty-cycle RF transmissions while sleeping most of the time. Its 32MHz MIPS handles sub-GHz or 2.4GHz protocol encoding (e.g., proprietary or BLE-beacon framing) without external logic, while XLP nanoWatt sleep extends coin-cell life beyond the typical 2-3 year target. The 10-bit ADC can read a potentiometer slider or battery-voltage monitor for adaptive behavior. Designers add a simple SiP transceiver or discrete OOK/FSK modulator with the MCU driving it directly via SPI.

Zusammenfassung der empfohlenen Produkte

MCP1700 Low-Iq LDO for coin-cell power rail Verwendet in: Battery-Powered IoT Sensor Node, Remote Control / Wireless Beacon PIC16F1829T-I/SO Microchip Technology Verwendet in: Battery-Powered IoT Sensor Node MCP2210 USB-to-SPI bridge for service-port diagnostics Verwendet in: Home Appliance Control (IEC 60730 Class B), Industrial Sensor Interface Board, Low-Cost BLDC / FOC Motor Control PIC18F27K40-E/SS Microchip Technology Verwendet in: Home Appliance Control (IEC 60730 Class B), Remote Control / Wireless Beacon PIC16F18857-I/MLVAO Automotive-grade screen variant of same part Verwendet in: Automotive Body and Interior Module MCP1790 Automotive-grade wide-input LDO for 12V bus Verwendet in: Automotive Body and Interior Module PIC16F1824-I/ST Microchip Technology Verwendet in: Industrial Sensor Interface Board PIC16F18877-I/ML Microchip Technology Verwendet in: Low-Cost BLDC / FOC Motor Control
What is the flash memory size of PIC16F18857-I/ML?
The PIC16F18857-I/ML integrates 56KB (32K x 14 words) of Flash program memory, 4KB of data SRAM, and 256 bytes of EEPROM, providing comfortable headroom for C source-code in C-optimized XC8 projects. This memory configuration matches the higher-density part of the PIC16F1885X/7X family for general-purpose applications.
What is the maximum operating frequency of PIC16F18857-I/ML?
The PIC16F18857-I/ML operates at up to 32MHz internal oscillator frequency (with PLL options), delivering approximately 8 MIPS in the PIC16 mid-range architecture. According to the manufacturer datasheet, instruction execution averages one cycle per instruction word, supporting deterministic real-time control loops.
What is the operating voltage range of PIC16F18857-I/ML?
The PIC16F18857-I/ML operates from 1.8V to 5.5V, enabling direct connection to single-cell Li-ion coin cells, 3.3V regulated rails, or 5V systems. Brown-out-reset (BOR) is configurable across this range to protect Flash integrity during voltage dips, an essential feature for IEC 60730 Class B designs.
Does PIC16F18857-I/ML support IEC 60730 Class B functional safety?
Yes, the PIC16F18857-I/ML includes a Windowed Watchdog Timer (WWDT), hardware CRC/SCAN, Hardware Limit Timer (HLT) and self-test BIST blocks that together support IEC 60730 Class B household appliance safety requirements. Designers pair these blocks with the MPLAB XC8 Class B library for certified appliances.
What package does PIC16F18857-I/ML use?
The PIC16F18857-I/ML ships in a 28-pin QFN (also called ML / MLP) package measuring 6 mm x 6 mm with an exposed thermal pad. The exposed pad must be soldered to a continuous ground copper pour for proper thermal dissipation and electrical reference.
Where to buy PIC16F18857-I/ML online?
The PIC16F18857-I/ML is stocked at authorized distributors including Digi-Key (6098386), Mouser, LCSC (C639814) and MicrochipDirect. Pricing starts at approximately $2.45 per unit at qty-1, dropping to about $1.55 per unit at qty-1000 as of 2026-10-09, with same-day shipping available from major distributors.
What is the price of PIC16F18857-I/ML?
As of 2026-10-09, the PIC16F18857-I/ML unit price is approximately $2.45 at qty-1, $1.96 at qty-100, $1.55 at qty-1000, and $1.39 at qty-3000 from authorized distributors. LCSC Electronics lists a starting price of $2.4473 per unit, with tier discounts available at higher volumes.
What is the lead time for PIC16F18857-I/ML?
Lead time for PIC16F18857-I/ML is typically 8-12 weeks factory-direct from Microchip, while authorized distributors such as Digi-Key and Mouser list immediate stock with same-day shipping as of 2026-10-09. For high-volume orders above 10k units, place orders 12+ weeks in advance to secure allocation.
What is the best drop-in replacement for PIC16F18857-I/ML?
The PIC16F18877-I/ML is the closest same-package drop-in upgrade with larger Flash and SRAM in the same 28-QFN (6x6) footprint. The PIC16F18876-I/ML offers reduced memory but identical pinout for cost-sensitive designs, while automotive designers can use PIC16F18857-I/MLVAO classified as drop-in compatible.
PIC16F18857-I/ML vs PIC16F18877-I/ML - which is better?
The PIC16F18877-I/ML doubles Flash to 56KB and adds more peripherals versus the PIC16F18857-I/ML, sharing the same 28-QFN pinout. Choose PIC16F18877 for memory headroom and richer peripherals; choose PIC16F18857 for lower cost and proven design. Both run at 32MHz with XLP support.
When should I choose PIC16F18857-I/ML over PIC16F18876-I/ML?
Choose the PIC16F18857-I/ML when 56KB Flash and 4KB SRAM are needed; choose PIC16F18876-I/ML when smaller memory is acceptable and cost is paramount. Both parts share the same 28-QFN (6x6 mm) package, identical pinout, and identical eXtreme Low Power behavior, simplifying migration.
Is PIC16F18857-I/ML suitable for battery-powered IoT sensor nodes?
Yes, the PIC16F18857-I/ML is highly suitable for battery-powered IoT sensor nodes thanks to XLP nanoWatt standby currents and multiple low-power modes (Doze, Idle, Sleep). The 32MHz performance is more than adequate for periodic sensor sampling and short RF transmissions, while sleeping between events extends battery life to years.
Where to download PIC16F18857-I/ML datasheet PDF?
The official PIC16F18857-I/ML datasheet (document 40001825F, family datasheet for PIC16(L)F18857/77) is hosted at https://ww1.microchip.com/downloads/en/DeviceDoc/PIC16LF1885777_Data_Sheet_40001825F.pdf and mirrored on www.alldatasheet.com. The Microchip product page at https://www.microchip.com/en-us/product/PIC16F18857 also links to errata and application notes.
Where to find PIC16F18857-I/ML pinout?
The PIC16F18857-I/ML pinout for the 28-QFN (6x6 mm) package is documented on page 4 of the family datasheet (40001825F); pin 1 is identified by a corner dot and the package top marking. The XAIPART product page renders this pinout diagram alongside the full pin description table for quick reference.
Is PIC16F18857-I/ML the same as PIC16F18857-I/SP?
No. The PIC16F18857-I/ML is the 28-QFN surface-mount variant, while the PIC16F18857-I/SP ships in a 28-pin SPDIP through-hole package. Both share the same die and electrical characteristics but require different PCB footprints, so they are not drop-in replaceable on an existing board.

Technische Referenzdaten für PIC16F18857-I/ML – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose the PIC16F18857-I/ML when you need the largest Flash (56KB) and SRAM (4KB) density in the 28-QFN PIC16F1885X/7X family for general-purpose, low-power or IEC 60730 Class B designs, and when an industrial temperature range of -40C to +85C is acceptable. Choose PIC16F18877-I/ML when you want richer peripheral options on the same pinout. Choose PIC16F18876-I/ML or PIC16F18855-I/ML when cost and BOM complexity favor a smaller-memory variant. Choose the -MLVAO screening variant for automotive modules requiring -40C to +125C operation. All five alternatives share the same 28-QFN footprint, enabling PCB layout reuse across the family.

Vergleich mit Alternativen

Parameter Dieses Produkt PIC16F18877-I/ML PIC16F18876-I/ML PIC16F18875-I/ML PIC16F18857-I/MLVAO PIC16F18855-I/ML
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 28-QFN (6x6 mm) 28-QFN (6x6 mm) - same 28-QFN (6x6 mm) - same 28-QFN (6x6 mm) - same 28-QFN (6x6 mm) - same 28-QFN (6x6 mm) - same
Flash Memory 56 KB 56 KB 28 KB 14 KB 56 KB 14 KB
SRAM 4 KB 4 KB 2 KB 1 KB 4 KB 1 KB
Maximum Frequency 32 MHz 32 MHz 32 MHz 32 MHz 32 MHz 32 MHz
Operating Voltage 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V 1.8V to 5.5V
XLP (nanoWatt Sleep) Yes Yes Yes Yes Yes Yes
Operating Temperature -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +125C (automotive) -40C to +85C
Approximate Unit Price (qty 100) $1.96 $2.20 $1.85 $1.70 $2.40 $1.65

Wichtigste Unterscheidungsmerkmale

  • Largest Flash/SRAM in 28-QFN PIC16F1885X family (vs. PIC16F18875-I/ML)
  • Industrial-grade operating temperature with automotive option (vs. PIC16F18855-I/ML)
  • Wider CIP feature set than lower-memory siblings (vs. PIC16F18876-I/ML)

Designhinweise

Estimated: at VDD=5V with all peripherals disabled and the CPU in Sleep mode, the PIC16F18857-I/ML draws a few hundred nanoamps typical due to XLP, allowing coin-cell designs to last for years. Use IDD Sleep figures from the family datasheet (40001825F) at the actual temperature and VDD of your design to size battery capacity; the WDT disabled vs enabled delta is on the order of several microamps, so disable WDT during Sleep when feasible and wake via IOC interrupts.

Solder the QFN-28 exposed pad (pin 28) to a continuous ground copper pour, ideally 1 square inch or larger on a 2-layer board. Without this thermal anchor, theta_JA rises sharply and junction temperature can exceed the -40C to +85C industrial limit during high CPU-load applications such as FOC motor control. Keep vias-in-pad stitched at 0.3-0.5mm pitch to spread heat effectively.

Do not leave the MCLR pin floating; tie it to VDD through a 10k-ohm pull-up and a 100nF decoupling cap to prevent spurious resets. Configure the configuration words early in your code: oscillator selection (INTOSC vs HS), watchdog enable/disable, code-protect bits, and LVP (low-voltage programming) must be set before the first user instruction; otherwise ISP may not function. For IEC 60730 Class B projects, ensure the WWDT window is correctly sized for the longest instruction-cycle execution path.

Keep high-current traces (motor drivers, LED strings) away from the analog AVdd rail and the ADC reference pins. Place the 100nF VDD bypass capacitor within 3mm of the VDD pin and the bulk 10uF cap nearby to suppress switching noise. Use a guard ring around the 10-bit ADC input traces if reading millivolt-level sensor signals, and route the crystal traces short and symmetric to minimize radiated EMI.

Compliance-Informationen

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Yes
Konfliktmineralien
Compliant

RoHS compliant per Microchip product page. AEC-Q100 grade variants available as separate -MLVAO ordering suffix. Not IEC 60730 -qualified by certification body; IEC 60730 Class B compliance is achieved using the on-chip FuSa blocks plus the MPLAB XC8 Class B library.

Daten verifiziert am: 2026-10-09 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

Ähnliche Suchanfragen

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Verwandte Bauteile & Begriffe

Microchip Technology PIC16F18857-I/ML PIC16 PIC16F18877-I/ML PIC16F18876-I/ML PIC16F18875-I/ML PIC16F18857-I/MLVAO PIC16F18855-I/ML 8-bit microcontroller RISC architecture Harvard architecture mid-range MCU microcontroller embedded systems QFN-28 QFN family surface mount SMD IEC 60730 Class B functional safety CRC/SCAN Windowed Watchdog Timer (WWDT) Hardware Limit Timer (HLT) eXtreme Low Power (XLP) nanoWatt technology 10-bit ADC Core Independent Peripheral (CIP) EUSART I2C SPI CCP ECCP Complementary Waveform Generator (CWG) Configurable Logic Cell (CLC) Peripheral Pin Select (PPS) MPLAB X IDE XC8 compiler RoHS REACH IoT sensor node home appliance automotive body module BLDC motor control MCP1700 MCP2210
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