DSPIC33FJ256GP710A-H/PT - 16-bit 40 MIPs DSC 256KB | Microchip
Teilenummer: DSPIC33FJ256GP710A-H/PT ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $9.85 | $9,85 |
| 10 | $8.9 | $89,00 |
| 100 | $7.95 | $795,00 |
| 500 | $7.1 | $3.550,00 |
| 1.000 | $6.4 | $6.400,00 |
DSPIC33FJ256GP710A-H/PT Übersicht
A Digital Signal Controller combines the control peripherals of a microcontroller with the multiply-accumulate engine of a DSP. Within the power-management hierarchy, the dsPIC33F family sits between standard MCUs and dedicated DSPs: it is a 16-bit microcontroller (PIC24 architecture) with DSP instructions, making it a single-chip solution for motor control and digital power conversion.
Key features include a 16-bit RISC dsPIC33F core running at 40 MIPs, 256KB self-programmable FLASH with ECC, 30KB SRAM, and rich connectivity: CANbus, I2C, IrDA, LINbus, SPI, and UART/USART. Analog peripherals and multiple timers plus PWM modules enable closed-loop digital control without external DSP support.
Technical depth: the dsPIC33F core executes most instructions in one cycle and includes a 17-bit x 17-bit single-cycle hardware multiplier, dual 40-bit accumulators, and DSP addressing modes. Seamless migration paths exist to PIC24F, PIC24H MCUs and dsPIC30F DSCs in similar packages. The -H/PT variant is specified over an automotive-oriented extended temperature range with 3.3V operation.
Typical applications include automotive electronic control units, digital power supplies, industrial motor drives, sensor fusion nodes, and communication gateways using the on-chip CAN module.
Design consideration: only matched PGECx/PGEDx pin pairs may be used for ICSP programming (e.g., PGEC2 with PGED2), and multiple voltage-rail domains require attention during in-circuit debugging.
This page adds value beyond the datasheet by synthesizing distributor pricing, drop-in alternatives, design notes, and AEO-optimized Q&A in one structured reference.
Drop-in-Alternativen für DSPIC33FJ256GP710A-H/PT – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33FJ256GP710A-H/PT (gleiche Bauform und Footprint) – abweichend in Core Architecture, Operating Temperature, Package, Packaging, Programming Interface.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33FJ256GP710A-I/PT
✅ Drop-In✓ Auf Lager
$15.6 / Stück
Datenblatt ansehen →DSPIC33FJ256GP710T-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$6.45 / Stück
Datenblatt ansehen →DSPIC33FJ128GP710A-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33FJ64GP710A-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33FJ256GP710A-E/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$15.45 / Stück
Datenblatt ansehen →DSPIC33FJ256GP710A-H/PT Grenzwerte & elektrische Eigenschaften
| Core | dsPIC33F, 16-bit RISC |
| Program Memory | 256KB (256K x 8) FLASH |
| RAM Size | 30KB |
| Maximum Performance | 40 MIPs |
| Versorgungsspannung | 3.3 V |
| Connectivity | CANbus, I2C, IrDA, LINbus, SPI, UART/USART |
| Gehäuse | 100-TQFP (12x12 mm) |
| Montageart | Surface Mount |
| Pin-Anzahl | 100 |
| Automotive Qualification | Automotive suitable per findic listing |
| Packaging | Tray (PT suffix) |
| Architecture | dsPIC33F (PIC24-based DSC core) |
| Programmability | ICSP via matched PGECx/PGEDx pairs |
| Development Platform | Explorer 16/32 Development Board with PIM |
| Compiler Support | MPLAB XC-DSC C/C++ Compiler |
DSPIC33FJ256GP710A-H/PT 100-tqfp (12x12 mm) Pinbelegungsleitfaden
Pinbelegung für DSPIC33FJ256GP710A-H/PT (100-tqfp (12x12 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33FJ256GP710A-H/PT.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33FJ256GP710A-H/PT ist geeignet für 6 Anwendungs: Automotive ECU and Body Control, Digital Power Supplies, Industrial Motor Drives, Communication Gateways, Sensor Acquisition and Fusion Nodes, Test, Measurement and Prototyping.
Automotive ECU and Body Control
The DSPIC33FJ256GP710A-H/PT fits automotive nodes because its -H temperature grading and integrated CANbus plus LINbus connectivity remove external protocol controllers. Distributor data (findic.us, lisleapex) explicitly categorize this 3.3V, 40 MIPs part as automotive-suitable. In a body control module the DSC runs deterministic control loops on its 16-bit core while CAN and LIN stacks share the 256KB FLASH with application code. The 30KB RAM buffers message queues; the 100-pin TQFP provides enough I/O for lamp loads, switches, and diagnostics. The trade-off: confirm the exact AEC qualification level with Microchip for your program before design freeze.
Empfohlen
Digital Power Supplies
Digital power conversion is a native fit: the dsPIC33F core executes single-cycle 17x17 MAC operations with dual 40-bit accumulators, enabling high-bandwidth voltage- and current-loop compensation at 40 MIPs. The 3.3V controller closes loops around power stages via its analog and PWM peripherals, replacing analog compensators with firmware that can be updated in the field from 256KB self-programmable FLASH. The 100-pin TQFP exposes multiple PWM outputs for multiphase or full-bridge topologies. Performance consideration: the DSP MAC throughput bounds loop bandwidth, so verify per-phase sampling rates against your switching frequency during architecture definition.
Empfohlen
Industrial Motor Drives
For PMSM, BLDC, and induction motor control, this DSC combines 40 MIPs of 16-bit DSP throughput with PWM and ADC resources on one 3.3V chip, computing field-oriented control inner loops while UART or CAN reports to a factory network. The 256KB FLASH hosts FOC libraries, protection state machines, and parameter storage; 30KB RAM holds current/voltage sample buffers. The 100-pin TQFP gives generous gate-drive and feedback I/O. Design consideration: keep current-sense returns short to the ADC pins and use matched PGECx/PGEDx pairs reserved for programming per Microchip guidance to avoid contention with control I/O.
Empfohlen
Communication Gateways
With CANbus, LINbus, IrDA, I2C, SPI, and UART/USART on-chip, this part serves as a protocol gateway translating between vehicle or industrial buses and local sensors. Two independent stacks coexist in 256KB FLASH; the 40 MIPs core keeps message routing latency low even with CRC and scheduling overhead. The 100-pin package supports dual transceiver interfaces plus status LEDs and debug headers. Typical usage: bridge CAN to Modbus-style RS-485 UART links with per-message filtering in hardware. Benefit: one-chip implementation cuts BOM cost versus MCU-plus-protocol-controller designs and shortens firmware qualification cycles.
Empfohlen
Sensor Acquisition and Fusion Nodes
The DSC's 16-bit DSP engine accelerates filtering, FFT, and fusion math on multi-sensor streams, while I2C and SPI connect digital sensors and UART streams results upward. 30KB SRAM buffers windows of samples; 256KB FLASH retains calibration tables across power cycles. At 40 MIPs, oversampled averaging and FIR filtering run comfortably within real-time deadlines at typical sensor rates. The 100-TQFP footprint leaves headroom for additional analog front-ends. Performance note: reserve DMA-capable peripherals for high-rate streams to keep the CPU free for fusion algorithms, and validate ADC channel allocation against your channel count before layout.
Empfohlen
Test, Measurement and Prototyping
Microchip's Explorer 16/32 Development Board with a 100-pin PIM supports the dsPIC33FJ256GP710 family, giving teams a low-cost modular platform with PICtail Plus daughter-card expansion. Instruments and fixtures benefit from the DSC's deterministic 16-bit core, hardware UART/SPI for stimulus generation, and self-programmable 256KB FLASH for firmware-in-field updates. Third-party NSDSP programmers measure full-chip program/verify times for production flashing, simplifying end-of-line programming. Consideration: when moving from Explorer 16/32 to production boards, remember that ICSP requires matched PGECx/PGEDx pin pairs exactly as connected on the PIM to avoid rework.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33FJ256GP710A-H/PT – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33FJ256GP710A-I/PT | DSPIC33FJ256GP710T-I/PT | DSPIC33FJ128GP710A-I/PT |
|---|---|---|---|---|
| Package | 100-TQFP (12x12 mm) | 100-TQFP (12x12 mm) - same | 100-TQFP (12x12 mm) - same | 100-TQFP (12x12 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Performance | 40 MIPs (16-bit) | 40 MIPs | 40 MIPs | 40 MIPs |
| FLASH | 256KB | 256KB | 256KB | 128KB |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Temperature Grade | -H (automotive-oriented extended) | -I (industrial) | -I (industrial) | -I (industrial) |
| Connectivity | CAN, I2C, IrDA, LIN, SPI, UART/USART | CAN, I2C, IrDA, LIN, SPI, UART/USART | CAN, I2C, IrDA, LIN, SPI, UART/USART | CAN, I2C, IrDA, LIN, SPI, UART/USART |
| Packaging | Tray (PT) | Tray (PT) | Tape & Reel (T) | Tray (PT) |
Wichtigste Unterscheidungsmerkmale
- Maximum FLASH in the GP710A 100-pin family (vs. DSPIC33FJ128GP710A-I/PT)
- Extended -H temperature grade (vs. DSPIC33FJ256GP710A-I/PT)
- Single-chip CAN + LIN connectivity (vs. DSPIC33FJ64GP710A-I/PT)
Designhinweise
ICSP programming requires matched PGECx/PGEDx pairs. Per Microchip documentation, dsPIC33FJ256GP710 has more than one pair and you must use them as a pair - e.g., if PGEC2 drives ICSPCLK, ICSPDAT must connect to PGED2. Mixing pins from different pairs is the most common bring-up failure. Reserve one pair exclusively for the programming header and keep series resistors on those traces to isolate application loads during debug sessions.
Place 0.1uF ceramic decoupling capacitors at each VDD/VSS pair of the 100-TQFP, keeping loops short to the 12x12 mm package. The 3.3V rail should enter through a local bulk capacitor (10uF) plus ferrite to suppress switching noise from motor drives or power stages sharing the same rail. Route CANH/CANL as a matched pair with 120-ohm termination at the bus ends; keep the transceiver within a few centimeters of the CAN pins.
With a 40 MIPs core, external clock integrity matters: use a crystal or oscillator meeting Microchip's drive-level spec, with load capacitors placed within 10 mm of the OSC pins and a ground guard trace. Avoid routing fast PWM edges parallel to analog sense lines feeding the ADC; a small ground moat or spacing rule prevents digital noise from corrupting current-sense readings. If using internal PLL, verify clock settings against the family datasheet oscillator sections before committing the board.
The device operates from a 3.3V supply; ensure the regulator can supply the full 40 MIPs core current plus I/O loads with margin. Estimated: budget core plus peripheral current per the family datasheet current tables and add at least 30% headroom for I/O toggling. Brown-out behavior should be verified - configure the internal BOR so the 256KB FLASH self-programming operations never execute below the minimum voltage specified in the datasheet.
Compliance-Informationen
Verified web data does not include explicit RoHS/REACH/AEC-Q100 declarations for this MPN. Distributor listings categorize the part as automotive-suitable. Obtain current compliance certificates from Microchip's quality portal before design release.
