DSPIC33FJ256GP710A-I/PT - 16-bit 40MIPS 256KB DSC | Microchip
Teilenummer: DSPIC33FJ256GP710A-I/PT ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $19.47 | $19,47 |
| 10 | $18.55 | $185,50 |
| 25 | $17.65 | $441,25 |
| 100 | $16.95 | $1.695,00 |
| 500 | $16.25 | $8.125,00 |
| 1.000 | $15.6 | $15.600,00 |
DSPIC33FJ256GP710A-I/PT Übersicht
A digital signal controller combines the computing architecture of a microcontroller with the DSP engine of a digital signal processor. Within the power management hierarchy of embedded systems, a DSC such as the dsPIC33F family sits between general-purpose MCUs and dedicated DSPs: it executes digital filter algorithms and high-speed precision digital control loops with single-cycle MAC and 40-bit accumulators, while retaining the peripherals, interrupts, and flash self-programming of a modern MCU. Microchip's dsPIC33FJXXXGPX06A/X08A/X10A family is explicitly designed for applications that need to perform under pressure.
Key features include 256 KB of on-chip flash with ECC-style self-programming support, 30 KB of SRAM, up to 53 general-purpose I/O pins, and rich communication peripherals including CAN, I2C, SPI, and UART. The GP (general purpose) variant adds a high-speed 10/12-bit ADC and the DCI (Data Converter Interface) for codec connection, making it a strong fit for audio and precision sensing signal chains.
Architecturally, the dsPIC33F core uses a modified Harvard pipeline with hardware loop support, 16 x 16 working register arrays, DSP multiply-accumulate, and modulo/bit-reversed addressing for FFTs. The A-suffix die is Microchip's enhanced revision of the original dsPIC33FJ256GP710 with improved analog and timing specifications.
Typical applications include motor control front-ends, digital power supplies, audio processing and codec interfaces, industrial sensing, and general embedded control requiring DSP-class math. Migration within the dsPIC33F family is seamless, and the Explorer 16/32 Development Board supports this device through a 100-pin PIM for rapid prototyping.
Design consideration: the device is a 3.3 V-supply part, so level shifting is required for 5 V logic, and ICSP programming must use matched PGECx/PGEDx pin pairs per the programming specification.
This page synthesizes distributor pricing, verified drop-in alternatives, and practical design notes not found in a single manufacturer datasheet.
Drop-in-Alternativen für DSPIC33FJ256GP710A-I/PT – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit DSPIC33FJ256GP710A-I/PT (gleiche Bauform und Footprint) – abweichend in Core Architecture, Package, Operating Temperature, Maximum CPU Speed, ADC.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
DSPIC33FJ256GP710A-H/PT
✅ Drop-In✓ Auf Lager
$6.4 / Stück
Datenblatt ansehen →DSPIC33FJ256GP710A-E/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$15.45 / Stück
Datenblatt ansehen →DSPIC33FJ256GP510T-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$6.95 / Stück
Datenblatt ansehen →DSPIC33FJ192GP710A-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33FJ128GP710A-I/PT
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
DSPIC33FJ128MC710-I/PT
✅ Drop-In✓ Auf Lager
$6.9 / Stück
Datenblatt ansehen →DSPIC33FJ256GP710A-I/PT Grenzwerte & elektrische Eigenschaften
| Core Architecture | 16-bit dsPIC33F DSC core |
| Maximum CPU Speed | 40 MIPS |
| Flash Memory | 256 KB |
| SRAM | 30 KB |
| Gehäuse | 100-TQFP (12x12 mm), PT suffix |
| I/O Pins | 53 |
| Communication Interfaces | CAN, I2C, SPI, UART |
| Betriebstemperatur | -40C to +85C (I grade) |
| Montageart | Surface Mount |
| Product Family | dsPIC33FJXXXGPX06A/X08A/X10A |
| Product Series | dsPIC33F |
| Development Support | Explorer 16/32 Development Board, MPLAB XC-DSC Compiler |
| RoHS-Status | Compliant |
| Programming Interface | ICSP via PGECx/PGEDx pin pairs |
DSPIC33FJ256GP710A-I/PT 100-tqfp (12x12 mm), pt suffix Pinbelegungsleitfaden
Pinbelegung für DSPIC33FJ256GP710A-I/PT (100-tqfp (12x12 mm), pt suffix-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für DSPIC33FJ256GP710A-I/PT.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
DSPIC33FJ256GP710A-I/PT ist geeignet für 6 Anwendungs: Audio Processing and Codec Interfaces, Industrial Sensing and Data Acquisition, Digital Power and Precision Control Loops, CAN Networking and Embedded Gateways, Motor Control Front-Ends and Motion Systems, General Embedded Control and Prototyping.
Audio Processing and Codec Interfaces
The DSPIC33FJ256GP710A-I/PT suits audio signal chains because its 40 MIPS DSP core performs single-cycle MAC operations for filters, and its Data Converter Interface (DCI) connects directly to audio codecs. Placed as the system controller between a codec and host interfaces, it executes IIR/FIR filtering, sample-rate conversion, and level detection in fixed-point arithmetic without an external DSP. The 256 KB flash holds substantial algorithm plus protocol stacks, while the 53 I/O pins drive buttons, LEDs, and displays around the audio path. Design trade-off: fixed-point audio math requires careful scaling compared to floating-point MCUs, but eliminates the cost and power of a separate DSP chip.
Empfohlen
Industrial Sensing and Data Acquisition
In industrial sensing nodes, the DSPIC33FJ256GP710A-I/PT combines its -40C to +85C industrial rating with DSP-class math for sensor linearization, FFT-based vibration analysis, and noise filtering. The integrated high-speed ADC samples analog channels directly, and the 40 MIPS core executes digital filter algorithms in real time, exactly the workload Microchip designed dsPIC33Fs for. CAN and UART interfaces publish results to PLCs and SCADA systems, while I2C and SPI manage external sensors and memory. The 30 KB SRAM buffers acquisition windows for block processing. Trade-off: for extremely long record lengths, add external SPI SRAM, as on-chip RAM is 30 KB.
Empfohlen
Digital Power and Precision Control Loops
High-speed precision digital control loops are a primary dsPIC33F design target, and the DSPIC33FJ256GP710A-I/PT executes proportional-integral-derivative and predictive control routines at 40 MIPS with deterministic interrupt latency. In digital power supplies, UPS systems, and power-factor-correction stages, the fast ADC samples current and voltage waveforms each switching cycle, and the DSP MAC computes the duty-cycle update in a few microseconds. The 256 KB flash supports complex multi-mode control with firmware upgradability in the field. Design consideration: loop timing depends on consistent ADC-to-PWM latency, so schedule control interrupts against the ADC conversion-complete event rather than a free-running timer.
Empfohlen
CAN Networking and Embedded Gateways
The integrated CAN module makes the DSPIC33FJ256GP710A-I/PT a strong protocol-bridge and gateway controller. It terminates CAN traffic while simultaneously running UART, SPI, and I2C links, using the 40 MIPS core to translate between protocols in firmware without external glue logic. Typical uses include industrial CAN gateways, building automation nodes, and vehicle ancillary controllers operating within the -40C to +85C grade. The 256 KB flash accommodates dual protocol stacks plus OTA-style firmware update code, and 53 I/O pins handle board-level signaling. Trade-off: the CAN peripheral bitrate ceiling should be verified against the target bus speed in the datasheet electrical section before finalizing topology.
Empfohlen
Motor Control Front-Ends and Motion Systems
While Microchip's MC-family dsPICs carry the richest motor-control PWM peripherals, the DSPIC33FJ256GP710A-I/PT still fits motion-system roles such as encoder processing, trajectory generation, and supervisory control inside multi-axis drives. Its 40 MIPS DSP engine executes Clarke/Park transforms and current-loop math when paired with external PWM hardware or low-complexity single-motor drives, and its timer resources capture quadrature encoder inputs. The industrial temperature grade suits factory-floor environments, and the 100-pin TQFP provides the I/O count for multi-sensor motion boards. Design consideration: for complementary-output PWM with fault shutdown, cross-reference the MC-family dsPIC33FJ128MC710 in the same package footprint.
Empfohlen
General Embedded Control and Prototyping
As a general-purpose 16-bit controller, the DSPIC33FJ256GP710A-I/PT serves embedded products needing more math throughput than a PIC18 but no full DSP pedigree: printers, meters, HVAC controllers, and instrumentation front panels. The Explorer 16/32 Development Board plus a 100-pin PIM allows firmware development before custom hardware exists, and the MPLAB XC-DSC compiler supports standard ANSI C. The large 53-I/O count and 256 KB flash give headroom for feature-rich firmware, while family pin compatibility lets one PCB scale across flash sizes (64/128/192/256 KB). Trade-off: the 3.3 V I/O levels require level shifters when interfacing legacy 5 V peripherals.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für DSPIC33FJ256GP710A-I/PT – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | DSPIC33FJ256GP710A-H/PT | DSPIC33FJ256GP710A-E/PT | DSPIC33FJ256GP510T-I/PT | DSPIC33FJ192GP710A-I/PT | DSPIC33FJ128MC710-I/PT |
|---|---|---|---|---|---|---|
| Package | 100-TQFP (12x12 mm), PT | 100-TQFP (12x12 mm) - same | 100-TQFP (12x12 mm) - same | 100-TQFP (12x12 mm) - same | 100-TQFP (12x12 mm) - same | 100-TQFP (12x12 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB | 256 KB | 256 KB | 256 KB | 192 KB | 128 KB |
| CPU Speed | Up to 40 MIPS | 40 MIPS (H speed grade) | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS |
| Temperature Grade | -40C to +85C (I) | High-speed grade (verify datasheet) | -40C to +125C (E) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) |
| Peripheral Focus | General purpose (GP): ADC, DCI, CAN, I2C, SPI, UART | Same GP peripheral set | Same GP peripheral set | GP, pre-A analog revision | Same GP peripheral set | Motor control (MC) PWM focus |
| Drop-in Fit | Reference part | Pin-to-pin, identical die | Pin-to-pin, identical die | Pin-to-pin, older die rev | Pin-to-pin, less flash | Pin-to-pin, MC peripherals |
Wichtigste Unterscheidungsmerkmale
- Maximum flash in the GP710 100-pin group (vs. DSPIC33FJ192GP710A-I/PT)
- A-suffix enhanced die revision (vs. DSPIC33FJ256GP510T-I/PT)
- General-purpose analog and DCI orientation (vs. DSPIC33FJ128MC710-I/PT)
- Extended-temperature sibling exists (vs. DSPIC33FJ256GP710A-E/PT)
Designhinweise
ICSP programming requires PGECx and PGEDx pins to be used strictly as matched pairs: if PGEC2 carries ICSPCLK, ICSPDAT must route to PGED2. Microchip's programming documentation for the dsPIC33FJ256GP710 explicitly warns that mixing pairs across indexes causes programming failure. Route the programming header to one complete pair and keep series resistors on programming traces so they do not load attached peripheral circuitry during debug.
This is a 3.3 V family device; all I/O banks share the single VDD domain, so 5 V legacy signals need level shifting or current-limiting series resistors per the datasheet absolute maximum ratings. Decouple each VDD/VSS pair with 0.1 uF ceramics placed within 2 mm of the pins, and add 4.7-10 uF bulk capacitance near the supply entry. Estimated: with ~53 I/O toggling, transient core + I/O current peaks can exceed 100 mA at 40 MIPS, so verify regulator transient response against the Microchip app-note guidance for dsPIC33F supply design.
The 100-TQFP (12x12 mm) has a 0.5 mm pin pitch; design the land pattern per IPC-7351 with slightly elongated pads to aid self-alignment during reflow. Use at least a two-layer board with a solid ground plane under the device to keep ADC reference noise low - route analog sensor traces away from CAN and PWM switching nets. Expose the die-attach area generously with thermal vias even though dissipation is modest, improving ADC accuracy by reducing die heating.
At 40 MIPS operation, keep crystal/oscillator traces short (under 15 mm), guard them with ground pour, and place the crystal load capacitors close to the OSC pins. MCLR must be pulled up through a 10 k-ohm resistor with a provision for the programmer connection, since ICSP shares this pin. Untouched PGECx/PGEDx pairs that are reused as GPIO should include jumpers or series resistors so a debug probe can be attached without re-spinning the board.
Compliance-Informationen
RoHS compliant and lead-free per distributor listings. REACH, halogen-free, and conflict-minerals declarations must be requested from Microchip; not stated in the provided web data.
