EP1AGX35DF780C6 - 33,520-Cell Arria GX FPGA | Intel
Teilenummer: EP1AGX35DF780C6 ✓ Aktiv| Menge | Stückpreis | Gesamt |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
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| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
EP1AGX35DF780C6 Übersicht
An FPGA, or field-programmable gate array, is a programmable semiconductor that implements digital logic through a configurable matrix of logic elements, routing resources, memory blocks, and specialized I/O circuits. Unlike an application-specific integrated circuit, the FPGA configuration can be changed after manufacturing. In the system hierarchy, an FPGA sits between general-purpose processors and fixed-function ASICs: it can provide hardware parallelism, deterministic interfaces, protocol bridging, signal processing, and logic consolidation. The Arria GX family is designed for data-path and communications-oriented designs where programmable high-speed interfaces are important.
The verified headline characteristics are 33,520 cells, 1.2 V operation, 341 I/O pins, 90 nm technology, and a 780-pin FC-FBGA package. The 1.2 V supply supports low-voltage digital implementation, while 341 I/O terminals provide broad connectivity for parallel interfaces, memory controllers, custom logic, and data-conversion links. A 780-terminal BGA also provides high I/O density, but it requires controlled PCB escape routing, via structures, thermal analysis, assembly capability, and careful signal-integrity review.
The C6 suffix denotes the commercial C6 speed grade in the ordering information. Designers should treat the FPGA architecture as programmable hardware: logic functions are implemented through a device-specific configuration bitstream generated with supported Intel or Altera design tools. The configuration must match the exact device, package, speed grade, and design revision. Engineering sign-off should therefore include power estimation, pin assignment, timing closure, I/O standards, configuration scheme, and post-layout signal-integrity verification rather than relying on functional simulation alone.
Typical applications include communications equipment, data acquisition systems, industrial imaging, video and display processing, protocol conversion, test and measurement hardware, and embedded control. EP1AGX35DF780C6 is most suitable when a design needs substantial programmable logic and high I/O count in a compact BGA footprint. Its Arria GX positioning also makes it relevant to designs that benefit from high-speed serial connectivity, although exact transceiver counts, data rates, memory resources, and supported I/O standards are not included in the verified snippets and must be confirmed from the manufacturer datasheet before design release.
A primary design consideration is BGA implementation. Confirm the ball map, land pattern, stack-up, via-in-pad or dog-bone escape strategy, decoupling network, clock distribution, and thermal solution against the official manufacturer package documentation. Use the exact manufacturer datasheet for the device because distributor summaries can omit architecture and timing details. This page combines verified package, cell-count, process, supply, I/O, and speed-grade facts with a practical implementation checklist for procurement and PCB planning.
Drop-in-Alternativen für EP1AGX35DF780C6 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1AGX35DF780C6 (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Operating Temperature, Embedded Memory, Transceivers.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1AGX35DF780C5N
✅ Drop-In✓ Auf Lager
$198 / Stück
Datenblatt ansehen →EP1AGX35DF780
✅ Drop-In✓ Auf Lager
$142.6 / Stück
Datenblatt ansehen →EP1AGX35CF780I6N
✅ Drop-In✓ Auf Lager
$278.75 / Stück
Datenblatt ansehen →EP1AGX35CF484I6N
✅ Drop-In✓ Auf Lager
$120 / Stück
Datenblatt ansehen →EP1AGX35CF484C6N
✅ Drop-In✓ Auf Lager
$118 / Stück
Datenblatt ansehen →EP1AGX35DF780C6 Grenzwerte & elektrische Eigenschaften
| Product Type | Field Programmable Gate Array (FPGA) |
| Manufacturer | Intel |
| Original Manufacturer | Altera |
| Series | Arria GX |
| Logic Cells | 33,520 cells |
| Process Technology | 90 nm |
| Versorgungsspannung | 1.2 V |
| Number of I/O | 341 I/O |
| Number of Terminals | 780 pins |
| Gehäuse | 780-pin FC-FBGA |
| Package Code | BGA |
| Terminal Form | Ball |
| Package Shape | Square |
| Speed Grade | C6 |
| Programmable | Field programmable |
EP1AGX35DF780C6 square Pinbelegungsleitfaden
Pinbelegung für EP1AGX35DF780C6 (square-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1AGX35DF780C6.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1AGX35DF780C6 ist geeignet für 6 Anwendungs: Communications Interface Equipment, High-Speed Data Acquisition, Industrial Imaging and Vision, Video and Display Processing, Industrial Control and Automation, Test and Measurement Hardware.
Communications Interface Equipment
EP1AGX35DF780C6 is a strong candidate for communications-interface equipment that needs programmable logic, high I/O density, and the Arria GX feature family. Its verified 33,520 logic cells can implement protocol bridges, packet-processing functions, framing logic, and control state machines, while 341 I/O terminals provide substantial interface flexibility. The 1.2 V supply and 90 nm process support a high-density digital implementation. Exact transceiver count, lane rate, reference-clock requirements, and protocol certifications are not present in the verified data, so the official device handbook must be reviewed before committing to a line-card or communications design.
Empfohlen
High-Speed Data Acquisition
EP1AGX35DF780C6 can serve as the programmable processing and interface core in a high-speed data-acquisition platform. The verified 33,520-cell architecture is capable of handling parallel digital logic, sample synchronization, channel multiplexing, and data formatting, while 341 I/O pins help connect ADC or DAC interfaces, memory, clocks, and control paths. Its 780-pin FC-FBGA package allows a compact board implementation with many signals. For acquisition hardware, designers must still confirm the device's maximum clock rates, I/O standards, memory resources, and timing constraints from the manufacturer datasheet, because the supplied distributor summaries do not state those limits.
Empfohlen
Industrial Imaging and Vision
EP1AGX35DF780C6 is suitable for industrial imaging and machine-vision controllers that require parallel data handling and deterministic programmable processing. The device offers 33,520 logic cells for pixel aggregation, buffering control, region-of-interest processing, and interface conversion, plus 341 I/O terminals for image-sensor links, memory, encoders, and control signals. Its 90 nm process and 1.2 V supply are useful for a dense digital design. Exact camera-interface support, operating-temperature range, and industrial qualification are not verified, so the design should not assume them. Confirm the official environmental rating and supported memory and I/O standards before production release.
Empfohlen
Video and Display Processing
EP1AGX35DF780C6 can be used in video and display-processing systems that benefit from parallel programmable logic and high external connectivity. Its 33,520 logic cells support timing generators, format conversion, color-space processing, overlays, and control-plane functions, while 341 I/O terminals can connect video transceivers, memory, test points, and system controllers. The 780-pin FC-FBGA package supports dense routing but demands a controlled multilayer PCB and careful high-speed layout. The verified data does not identify supported video protocols, pixel-clock limits, memory interface rates, or display resolutions, so those requirements must be checked against the official documentation before selection.
Empfohlen
Industrial Control and Automation
EP1AGX35DF780C6 can provide configurable control, timing, and interface functions in industrial automation equipment. The verified 33,520-cell count supports multiple control loops, protocol adapters, safety-interlock logic, and data preprocessing, while 341 I/O terminals help aggregate sensors, actuators, encoders, and communication links. The 1.2 V supply and high-density 780-pin FC-FBGA package are appropriate for compact controller designs. Industrial deployment additionally requires verified temperature, reliability, lifecycle, and electromagnetic-compatibility data; those attributes are not supplied in the source snippets. Use the official datasheet and system qualification plan to close those gaps before release.
Empfohlen
Test and Measurement Hardware
EP1AGX35DF780C6 can function as the programmable timing, capture, formatting, and control fabric in test and measurement equipment. Its 33,520 logic cells can implement trigger generation, channel sequencing, protocol decoding, and custom measurement algorithms, while 341 I/O pins provide connectivity to converters, memory, front-panel controllers, and synchronization circuits. The Arria GX family placement suggests suitability for high-speed data paths, but the verified sources do not state maximum clock, transceiver, or memory performance. Engineers should therefore validate timing, signal integrity, thermal behavior, and instrument-control software compatibility using the official datasheet and hardware qualification measurements.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1AGX35DF780C6 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1AGX35DF780C5N | EP1AGX35DF780 | EP1AGX35CF780I6N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 780-pin FC-FBGA | 780-pin FC-FBGA designation | 780-pin FC-FBGA designation | 780-pin FC-FBGA designation |
| Series | Arria GX | Arria GX | Arria GX | Arria GX |
Wichtigste Unterscheidungsmerkmale
- Verified 33,520-cell Arria GX capacity (vs. EP1AGX35CF780I6N)
- Verified 1.2 V operating specification (vs. EP1AGX35DF780C5N)
- High-density 780-pin FC-FBGA implementation (vs. EP1AGX35CF484C6N)
Designhinweise
EP1AGX35DF780C6 is a 780-pin FC-FBGA device, so schematic capture must use the exact Intel or Altera symbol and verified ball assignment. The supplied web data confirms 780 ball terminals, BGA package code, and square package form, but it does not provide a complete pinout. Create the footprint from the official package drawing and verify land diameters, pitch, ball numbering, keepouts, and the PCB stack-up with the assembly house. Do not use a generic BGA footprint because a 780-terminal device requires exact mechanical and escape-routing control.
The verified supply voltage for EP1AGX35DF780C6 is 1.2 V, but the supplied sources do not state core current, auxiliary-rail requirements, power-up sequencing, or recommended decoupling. Treat the regulator and decoupling network as datasheet-controlled items and confirm the official electrical-characteristics section before design freeze. Check startup sequencing, voltage tolerances, load transients, and the number and placement of local capacitors. A 1.2 V label alone is insufficient to select a regulator, PCB copper area, or thermal solution.
Do not infer that a different Arria GX ordering code is a drop-in replacement merely because it uses a 780-pin package designation. The alternatives results compare the target with other devices, but the supplied evidence does not establish identical balls, speed grades, temperature grades, power rails, configuration interfaces, or timing behavior. Use the official cross-reference data and compare the complete ordering information before substitution. If the alternate part is from a different package, treat it as a redesign requirement, not a drop-in candidate.
High-density BGA routing and programmable I/O banks require an early signal-integrity plan. Assign clock, differential, memory, and high-speed transceiver signals before routing general-purpose I/O; then review the selected I/O standards, terminations, reference-clock distribution, and return paths. The verified snippets do not state maximum data rates or supported I/O standards, so use the manufacturer datasheet to set constraints. Simulate or measure critical interfaces after layout, particularly when the FPGA is connected to converters, memories, or long board traces.
Compliance-Informationen
No verified RoHS, REACH, lead-free, halogen-free, or conflict-minerals information was provided. AEC-Q100 status was not established for the target and is therefore not assumed.
