EP1AGX35CF484I6N - Arria GX FPGA, 33.5K LE, 484-FBGA | Intel
Teilenummer: EP1AGX35CF484I6N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $206.66 | $206,66 |
| 10 | $185 | $1.850,00 |
| 100 | $160 | $16.000,00 |
| 500 | $138 | $69.000,00 |
| 1.000 | $120 | $120.000,00 |
EP1AGX35CF484I6N Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs / LABs) connected via programmable interconnect, allowing designers to implement arbitrary digital logic after PCB fabrication. Within the broader taxonomy, FPGAs sit alongside CPLDs as the dominant programmable-logic devices, bridging the gap between fixed-function ASICs and software-defined microcontrollers. The Arria GX family specifically targets transceiver-rich, mid-density applications such as serial connectivity, video bridging, and protocol conversion, balancing cost, density, and high-speed serial I/O.
Key features of the EP1AGX35CF484I6N include 3.125 Gbps embedded transceivers supporting standards such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI, eliminating the need for external PHY devices. The device combines 33,520 logic elements with embedded multiplier blocks and DSP capability, allowing single-chip implementation of DSP pipelines. The 484-ball FineLine BGA package supports high-density board layouts with extensive I/O access while keeping PCB area compact relative to QFP-equivalent pin counts.
Architecturally, the Arria GX is built on a 90nm CMOS process with a 1.2V core, offering a favorable performance-per-watt ratio for its generation. Designers leverage Quartus II for synthesis, place-and-route, and timing closure. The combination of on-chip transceivers, mid-range logic density, and abundant user I/O makes the EP1AGX35CF484I6N suitable for line-card designs, broadcast video routers, and industrial control systems that require multiple high-speed serial links without external PHY complexity.
Typical applications include telecom line cards, serial-backplane aggregation, video capture and processing cards, military and aerospace signal processing, and industrial imaging systems. The 230 user I/Os provide ample general-purpose connectivity for memory interfaces, control buses, and parallel data paths.
When designing with this device, pay attention to transceiver channel placement and reference-clock routing to meet jitter masks, use a minimum of four PCB layers with controlled-impedance differential pairs for SERDES lanes, and validate signal-integrity with IBIS-AMI models before committing to layout.
This page synthesizes distributor pricing, drop-in alternatives, lifecycle status, and practical design notes that complement the Altera/Intel datasheet and accelerate engineering decisions.
Drop-in-Alternativen für EP1AGX35CF484I6N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1AGX35CF484I6N (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Embedded Memory, Operating Temperature, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1AGX35CF484I6
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$198.5 / Stück
Datenblatt ansehen →EP1AGX35CF484C6N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$118 / Stück
Datenblatt ansehen →EP1AGX35CF484C6
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$295 / Stück
Datenblatt ansehen →EP1AGX35CF484C4N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →EP1AGX20CF484I6N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$210 / Stück
Datenblatt ansehen →EP1AGX35CF484I6N Grenzwerte & elektrische Eigenschaften
| Family | Arria GX |
| Logic Elements (LE) | 33,520 |
| Logic Array Blocks (LABs) | 1,676 |
| User I/Os | 230 |
| Embedded Memory | 1,348,416 bits (approximately 1.35 Mbit) |
| Transceivers | 4 channels up to 3.125 Gbps |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Gehäuse | 484-ball FineLine BGA (FC-FBGA) |
| Montageart | Surface Mount (BGA) |
| Betriebstemperatur | -40 C to +100 C (industrial) |
| RoHS-Status | Compliant |
| Lead Free | Yes |
| Lebenszyklusstatus | Obsolete / Last Time Buy |
| Development Tool | Altera Quartus II (legacy) |
EP1AGX35CF484I6N 484-ball fineline bga (fc-fbga) Pinbelegungsleitfaden
Pinbelegung für EP1AGX35CF484I6N (484-ball fineline bga (fc-fbga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1AGX35CF484I6N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1AGX35CF484I6N ist geeignet für 6 Anwendungs: Telecom Line Cards and Serial Backplanes, Broadcast Video Capture and Processing, Industrial Imaging and Machine Vision, Military and Aerospace Signal Processing, Protocol Bridging and Interface Conversion, Legacy System Sustainment and Field Repair.
Telecom Line Cards and Serial Backplanes
The EP1AGX35CF484I6N suits telecom line-card designs where multiple high-speed serial links aggregate traffic from a backplane or framer. Its four embedded 3.125 Gbps transceivers support protocols such as Serial RapidIO, XAUI, and Gigabit Ethernet, removing the need for external PHY devices and shrinking the BOM. With 33,520 logic elements and 1.35 Mbit of embedded memory, the device can implement link-layer framing, traffic shaping, and rate adaptation in a single chip. The 484-ball FBGA provides ample routing channels for the SERDES lanes and reference clocks required to meet telecom jitter masks. Engineers should validate signal integrity on the differential pairs using IBIS-AMI models before layout commit.
Empfohlen
Broadcast Video Capture and Processing
The EP1AGX35CF484I6N is a strong fit for broadcast video capture cards, frame buffers, and processing pipelines. Its 33,520 logic elements plus dedicated multiplier blocks can implement color-space conversion, scaling, deinterlacing, and overlay composition in real time. The 1.35 Mbit embedded memory provides line buffers and lookup tables, removing the need for external SDRAM in many single-stream pipelines. The 230 user I/Os support wide parallel video buses (BT.1120, DisplayPort auxiliary channels) and connection to external DDR2 memory controllers. Industrial temperature grade ensures reliable operation in ventilated studio and outside-broadcast (OB) truck environments where ambient temperatures can approach +85 C during continuous duty.
Empfohlen
Industrial Imaging and Machine Vision
The EP1AGX35CF484I6N serves well in industrial camera and machine-vision systems that need on-the-fly image preprocessing before forwarding frames to a host processor. Its DSP blocks can implement real-time filtering, edge detection, and Bayer demosaicing, while the embedded transceivers (via Channel Link, CoaXPress, or GigE Vision bridges) allow high-speed pixel-data offload. The 230 user I/Os accommodate parallel sensor interfaces (LVDS, sub-LVDS, CSI-2) alongside GPIO for shutter, trigger, and lighting control. Industrial -40 C to +100 C operation supports factory-floor deployment in unconditioned enclosures, and the 484-FBGA package provides thermal headroom for sustained processing loads typical of inline inspection.
Empfohlen
Military and Aerospace Signal Processing
The EP1AGX35CF484I6N's industrial temperature range, robust 90nm CMOS process, and availability in long-lifecycle mil/aero programs make it suitable for legacy defense signal-processing applications such as radar front-end preprocessing, electronic-warfare channelizers, and avionics databus bridges. The four 3.125 Gbps transceivers can handle digitized RF data, while the 33,520 logic elements implement FFT pipelines, beamforming weights, and protocol-format conversion in a single FPGA. The 484-ball FBGA supports controlled-impedance routing for both SERDES and parallel ADC/DAC interfaces. Programs with established Arria GX firmware bases commonly retain this device until the next modernization cycle.
Empfohlen
Protocol Bridging and Interface Conversion
The EP1AGX35CF484I6N is well-matched to protocol-bridging applications such as PCIe-to-XAUI, RapidIO-to-Ethernet, and Serial RapidIO aggregation, where four transceivers can each run a different protocol at independent line rates. The 33,520 logic elements comfortably implement bridge state machines, header parsing, and DMA engines, while the 230 user I/Os connect to local bus interfaces, memory controllers, and status LEDs. Designers commonly use this device as a cost-effective replacement for ASIC bridges in low-volume or custom networking gear, taking advantage of FPGA reconfigurability to update protocol support over the product life cycle.
Empfohlen
Legacy System Sustainment and Field Repair
A primary ongoing application for the EP1AGX35CF484I6N is sustaining long-deployed systems in telecom central offices, broadcast studios, and industrial control lines where the original PCB was designed around this specific Arria GX device. Because the part is marked obsolete, repair depots and sustainment programs must locate remaining authorized channel stock, factory-excess inventory, or qualified brokers. Verified inventory (320 pcs at DigiKey as of 2025-08-19 per Octopart, and additional open-market stock at LCSC and Jotrin) supports near-term repair needs. Engineers should plan a forward-looking migration to Cyclone V GX or Arria V GX equivalents for any new-build or major refurbishment program to avoid future stock-outs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1AGX35CF484I6N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1AGX35CF484I6 | EP1AGX35CF484C6N | EP1AGX35CF484C6 | EP1AGX35CF484C4N | EP1AGX20CF484I6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (FC-FBGA) | 484-FBGA (FC-FBGA) - same | 484-FBGA (FC-FBGA) - same | 484-FBGA (FC-FBGA) - same | 484-FBGA (FC-FBGA) - same | 484-FBGA (FC-FBGA) - same |
| Family | Arria GX | Arria GX | Arria GX | Arria GX | Arria GX | Arria GX |
| Logic Elements | 33,520 | 33,520 | 33,520 | 33,520 | 33,520 | ~20,000 (-40%) |
| Temperature Grade | Industrial (-40 C to +100 C) | Industrial (-40 C to +100 C) | Commercial (0 C to +85 C) | Commercial (0 C to +85 C) | Commercial (0 C to +85 C) | Industrial (-40 C to +100 C) |
| Speed Grade | 6 | 6 | 6 | 6 | 4 (slower) | 6 |
| Lead-Free (RoHS) | Yes | No (leaded) | Yes | No (leaded) | Yes | Yes |
| Transceivers | 4 ch x 3.125 Gbps | 4 ch x 3.125 Gbps | 4 ch x 3.125 Gbps | 4 ch x 3.125 Gbps | 4 ch x 3.125 Gbps | 4 ch x 3.125 Gbps (fewer channels may be bonded) |
| User I/Os | 230 | 230 | 230 | 230 | 230 | 230 |
| Lifecycle Status | Obsolete / Last Time Buy | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature grade (-40 C to +100 C) at the same logic density (vs. EP1AGX35CF484C6N)
- Lead-free / RoHS-compliant terminal finish (vs. EP1AGX35CF484I6)
- 33,520 logic elements versus ~20,000 in the EP1AGX20 series (vs. EP1AGX20CF484I6N)
Designhinweise
The 484-ball FineLine BGA requires a minimum 4-layer PCB with continuous ground and power planes directly beneath the package to control the return-current paths for the 3.125 Gbps SERDES lanes. Use 100-ohm differential routing for each transceiver pair, with intra-pair length matching under 150 mil (3.8 mm) to keep deterministic jitter within mask. Reference-clock traces must be length-matched to their associated data lanes and routed on the same layer to avoid layer-transition discontinuities. Per the Altera Arria GX handbook, the decoupling network should include 0.1 uF X7R capacitors within 100 mil of every power pin, plus bulk decoupling at the regulator outputs.
Estimated: at a 90nm process, the EP1AGX35CF484I6N's core and SERDES power consumption can approach 5-8 W in a fully utilized 33.5K-LE design with all four transceivers active. The 484-ball FBGA dissipates heat primarily through the internal ball grid and PCB copper planes; designers should provide at least 4 thermal vias per power/ground ball cluster and a solid inner ground plane under the package. A small heat-spreader or top-side heatsink is recommended for industrial-temperature deployments where ambient approaches +85 C and SERDES utilization is high. Always validate with the device's PowerPlay early-power-estimator before committing to the thermal solution.
Do not assume the EP1AGX35CF484I6N's transceiver channels are identical to those of Arria II GX, Cyclone IV GX, or Cyclone V GX - the ball map, reference-clock scheme, and PLL configuration differ. When migrating firmware, recompile the design in the matching Quartus II version (10.0 to 13.1 for Arria GX) because newer Quartus versions do not support the legacy silicon. Also note that the 'N' suffix denotes lead-free terminal finish, while the suffix-less 'EP1AGX35CF484I6' is leaded - confirm your assembly process matches the variant on the BOM. Finally, because the part is obsolete, plan obsolescence management: qualify a Cyclone V GX or Arria V GX successor before stock depletes.
Compliance-Informationen
RoHS compliance confirmed by the 'N' suffix in the MPN per Altera/Intel part-numbering convention. REACH compliance per manufacturer product page (no SVHCs declared above threshold). AEC-Q100 not applicable - this is an FPGA, not an automotive-qualified IC. Lead-free terminal finish confirmed.
