EP1AGX60DF780C6N - Arria GX FPGA 60K LE 3.125Gbps | Intel
MPN: EP1AGX60DF780C6N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198 | $19,800.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $142 | $142,000.00 |
Drop-in alternatives for EP1AGX60DF780C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1AGX50DF780C6N
✅ Drop-In✓ In Stock
$327.76 / Unit
View Datasheet →EP1AGX60DF780I6N
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP1AGX35DF780C6N
✅ Drop-In✓ In Stock
$199.5 / Unit
View Datasheet →EP1AGX50DF780C6
✅ Drop-In✓ In Stock
$205 / Unit
View Datasheet →EP1AGX50DF780C7
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP1AGX60DF780C6N Maximum Ratings & Electrical Characteristics
| Series | Arria GX |
| Family | EP1AGX60 |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 60,100 |
| Logic Array Blocks (LABs) | 3,005 |
| Embedded Memory Bits | 2,528,640 |
| Maximum User I/O | 350 |
| Transceivers | 8 (3.125 Gbps each) |
| Operating Supply Voltage | 1.15 V to 1.25 V (core) |
| Process Technology | 90 nm |
| Maximum Frequency | 622.08 MHz |
| Data Rate | 3.125 Gbps |
| Package | 780-BBGA, FCBGA (29 mm x 29 mm, 1 mm pitch) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (commercial grade, 'C') |
| Speed Grade | 6 |
EP1AGX60DF780C6N 780-bbga, fcbga (29 mm x 29 mm, 1 mm pitch) Pin Configuration Guide
Complete pinout information for EP1AGX60DF780C6N (780-bbga, fcbga (29 mm x 29 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX60DF780C6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX60DF780C6N is suitable for 7 applications: PCI Express Endpoint Cards, Serial RapidIO Bridge for Wireless Baseband, HD-SDI Video Capture and Processing, 1G/10G Ethernet MAC Prototyping, Aerospace Avionics Data Concentrator, Medical Imaging Pipeline Acceleration, Industrial Machine Vision Pre-Processing.
PCI Express Endpoint Cards
The EP1AGX60DF780C6N is well suited for PCI Express endpoint cards because its 8 integrated 3.125 Gbps transceivers directly support PCIe Gen1 x4 or x8 endpoints without external SERDES, reducing BOM cost and PCB complexity. According to the Arria GX datasheet, the on-chip PCIe hard IP block handles transaction layer, data link layer, and physical layer functions, freeing fabric logic for application-specific endpoints. With 60,100 logic elements, designers can implement scatter-gather DMA engines, device drivers, and protocol state machines in parallel with the PCIe stack. The 2,528,640 bits of embedded memory buffer inbound TLPs and outbound completions. Place the device on PCIe add-in cards targeting Gen1 signaling rates with the on-chip transceiver driving the edge-card connector.
Recommended
Serial RapidIO Bridge for Wireless Baseband
Wireless baseband systems use the EP1AGX60DF780C6N as a RapidIO bridge between DSP clusters, baseband cards, and antenna interface modules. The 8 built-in 3.125 Gbps transceivers drive 1x or 4x RapidIO links with deterministic latency, while the 60,100 logic elements implement protocol layers above the SRIO physical interface. The 2,528,640-bit embedded memory provides packet buffers for switch fabric interconnect, and 350 user I/Os handle parallel RapidIO LVDS or LVCMOS connections to legacy baseband ASICs. Compared to external SERDES approaches, the integrated transceiver reduces signal integrity risk and BOM. Place the FPGA between DSP cards and the antenna card where compact serial interconnect replaces bulky parallel backplanes.
Recommended
HD-SDI Video Capture and Processing
Broadcast video equipment uses the EP1AGX60DF780C6N to capture and process HD-SDI streams at 1.485 Gbps or 2.97 Gbps per channel. The 3.125 Gbps transceivers receive SDI streams directly from BNC inputs through external adaptive cable equalizers, while the 60,100 logic elements implement 4:2:2 to 4:4:4 chroma upsampling, frame buffering, and overlay composition. The 2,528,640-bit embedded memory handles line buffers and frame store for multi-channel processing. With 350 user I/Os, the device can drive parallel DVI/HDMI output ports alongside the SDI inputs. Compared to ASSP video processors, the FPGA allows proprietary processing and format conversion. Place the EP1AGX60DF780C6N in studio mixers, video routers, and broadcast graphics inserters.
Recommended
1G/10G Ethernet MAC Prototyping
The EP1AGX60DF780C6N serves as a flexible platform for prototyping 1G and 10G Ethernet MAC designs during ASIC development. The 8 transceivers at 3.125 Gbps can drive four 1G SGMII links or one 10G XAUI channel using soft XGMII fabric, while the 60,100 logic elements implement the full 802.3 MAC, PTP timestamping, and switch fabric logic. The 2,528,640-bit embedded memory buffers frames during congestion. Although the 3.125 Gbps transceiver rate limits true 10GbE to XAUI rather than 10GBASE-R, designers can use the platform to validate algorithms before ASIC tape-out. Place the FPGA on evaluation boards alongside SFP+ cages and PHY devices.
Recommended
Aerospace Avionics Data Concentrator
Avionics data concentrators use the EP1AGX60DF780C6N to aggregate multiple ARINC 429, MIL-STD-1553, and Ethernet sensor streams into a unified backplane. The 8 transceivers connect to upstream 1000BASE-T or fiber Ethernet, while 350 user I/Os interface to legacy ARINC and 1553 transceivers. The 60,100 logic elements implement protocol conversion and bit-level error injection testing for DO-254 compliance evidence. The 2,528,640-bit embedded memory buffers bursts during sensor aggregation. Although the -C6N commercial grade limits deployment to protected avionics bays, the -I6N industrial grade sibling (-40C to +100C) extends operation to fuselage-mounted locations. Place the FPGA on conduction-cooled avionics modules.
Recommended
Medical Imaging Pipeline Acceleration
The EP1AGX60DF780C6N accelerates medical imaging pipelines such as ultrasound beamforming, MRI reconstruction, and CT back-projection. The on-chip hardware multipliers (18x18) and DSP blocks perform FIR filters and FFT transforms in real time at clock rates up to 250 MHz, while 60,100 logic elements host scan-line conversion and DICOM tagging. The 2,528,640-bit embedded memory holds intermediate beamforming data, and 350 user I/Os interface to analog front-end ADCs. Compared to GPU-based pipelines, the FPGA approach delivers deterministic latency required for real-time imaging and lower power per channel. Place the FPGA inside ultrasound carts and CT reconstruction racks where deterministic latency matters.
Recommended
Industrial Machine Vision Pre-Processing
Factory automation systems use the EP1AGX60DF780C6N for real-time machine vision pre-processing on the production line. The 8 transceivers receive Camera Link or CoaXPress streams from line-scan cameras at up to 3.125 Gbps, while the 60,100 logic elements perform Bayer demosaicing, color space conversion, and edge detection at full frame rate. The 2,528,640-bit embedded memory holds scan-line buffers, and 350 user I/Os drive illumination triggers and reject signals. Compared to PC-based vision systems, the integrated approach eliminates gigabit Ethernet latency and provides deterministic cycle times for high-speed inspection. Place the FPGA inside vision processing units near Camera Link frame grabbers.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX60DF780C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX50DF780C6N | EP1AGX60DF780I6N | EP1AGX35DF780C6N | EP1AGX50DF780C6 | EP1AGX50DF780C7 |
|---|---|---|---|---|---|---|
| Package | 780-BBGA (F780) | 780-BBGA (F780) - same | 780-BBGA (F780) - same | 780-BBGA (F780) - same | 780-BBGA (F780) - same | 780-BBGA (F780) - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 60,100 | 50,100 | 60,100 | 33,640 | 50,100 | 50,100 |
| LABs | 3,005 | 2,508 | 3,005 | 1,679 | 2,508 | 2,508 |
| Transceivers | 8 x 3.125 Gbps | 8 x 3.125 Gbps | 8 x 3.125 Gbps | 8 x 3.125 Gbps | 8 x 3.125 Gbps | 8 x 3.125 Gbps |
| Maximum User I/O | 350 | 350 | 350 | 350 | 350 | 350 |
| Embedded Memory Bits | 2,528,640 | 2,294,400 | 2,528,640 | 1,348,320 | 2,294,400 | 2,294,400 |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | -6 | -6 | -6 | -6 | -6 | -7 (slower) |
Key Differentiators
- Highest density in the Arria GX family (vs EP1AGX50DF780C6N)
- Commercial temperature grade optimized for controlled environments (vs EP1AGX60DF780I6N)
- -6 speed grade balances timing margin and cost (vs EP1AGX50DF780C7)
Design Notes
The 780-BGA package uses 1 mm ball pitch on a 29 mm x 29 mm body. Per IPC-7351 guidelines for 1 mm pitch BGAs, PCB breakout routing requires microvia or via-in-pad technology to escape the inner rows. Use a high-density interconnect (HDI) stackup with at least 4-6 layers and 50 ohm controlled-impedance traces for high-speed transceiver channels. A solid ground plane directly beneath the BGA improves thermal dissipation and signal return paths.
The 3.125 Gbps transceivers require +/- 100 ppm reference clock accuracy and properly terminated AC-coupled differential traces. Use 100 nF AC coupling capacitors on each serial data line, and keep differential pair intra-pair skew below 5 ps. Match trace lengths within 150 mil between the transceiver pins and the connector. Consider pre-emphasis and equalization settings from the Arria GX datasheet dynamic reconfiguration guide for lossy backplane channels.
The EP1AGX60DF780C6N core operates at 1.15 V to 1.25 V with separate VCC_PLL, VCC_CLKIN, and transceiver analog supplies (typically 1.4 V). Use a low-noise LDO or DC-DC converter followed by LC filtering for each rail. Place decoupling capacitors within 100 mil of every supply pin, using a mix of 0.1 uF, 1 uF, and 10 uF values. Estimate: power consumption scales roughly linearly with toggle rate; typical designs at 80% utilization draw 4-6 W from the core supply alone.
Estimated: at full 80% utilization and 622 MHz core clock, the EP1AGX60DF780C6N dissipates approximately 5-7 W in still air. The 780-BGA package theta_JA is approximately 12 C/W with 4-layer PCB, so a worst-case junction-to-ambient rise of 60-85 C is possible without airflow. For commercial 0C-85C operation, attach a heatsink or provide 200 LFM airflow to keep junction temperature below 100 C. Use the FPGA's on-die temperature sensing diode with the MAX1619 or equivalent external monitor.
Do not confuse the -C6N (commercial) and -I6N (industrial) speed-grade suffixes when ordering. Both share the same die and pinout but differ only in operating temperature range. When migrating from EP1AGX60DF780C6N to EP1AGX50DF780C6N, verify that your logic utilization fits within 50,100 LEs after compilation, since the density reduction may cause floorplan closure failures if utilization is already near 80%. Always request date code verification and CofC documentation for obsolete inventory purchases to mitigate counterfeit risk.
Compliance Information
RoHS/REACH compliance status not explicitly stated in the Verified Web Data snippet; the 'N' suffix in the part number historically indicates lead-free / RoHS compliant per Altera legacy ordering information but this should be verified against the manufacturer PCN before use in RoHS-restricted regions. AEC-Q100 is not applicable for an FPGA IC.
