EP1C12F324C6N - Cyclone 12,060 LEs FPGA, 324-BGA | Intel
Teilenummer: EP1C12F324C6N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $33.2 | $332,00 |
| 100 | $28.75 | $2.875,00 |
| 500 | $25.4 | $12.700,00 |
| 1.000 | $22.1 | $22.100,00 |
EP1C12F324C6N Übersicht
A Field-Programmable Gate Array (FPGA) is a class of programmable logic device that allows hardware designers to configure digital circuits after manufacturing. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) between simple Complex PLDs (CPLDs) and high-end Application-Specific Integrated Circuits (ASICs). The Cyclone family specifically targets cost-sensitive applications that still require meaningful logic density and embedded memory. FPGAs are programmed using hardware description languages such as Verilog or VHDL via vendor tools (Quartus II for Cyclone), and the configuration is loaded into SRAM cells at power-up.
Key features include 12,060 logic elements distributed across 1,206 logic array blocks (LABs), 239,616 bits of embedded RAM (M4K blocks), two Phase-Locked Loops (PLLs) for clock management, and support for LVDS, LVTTL, LVCMOS, PCI, and SSTL I/O standards. The device includes up to 52 embedded 9-bit multipliers suited for DSP pipelines such as FIR filters and FFT butterflies. Differential signaling and dedicated global clock networks support high-speed source-synchronous interfaces common in video, communications, and industrial imaging.
Typical applications include industrial motor control, video processing and display controllers, low-cost software-defined radio front ends, USB and Ethernet bridging logic, and glue-logic consolidation in telecom equipment. The 130 nm SRAM-based fabric requires a configuration flash or download cable on every board, and the 324-ball BGA footprint targets designs with sufficient PCB layer count (typically 6+ layers) for power plane and signal escape.
When designing with this part, plan the configuration source (EPCS serial flash is the most common companion) and provide a clean JTAG header for Quartus II programming. Decouple VCCINT (1.5 V) and VCCIO banks with 100 nF ceramic capacitors placed within 5 mm of each BGA ball cluster, and route all clocks through the dedicated global clock network for minimal skew. The C6N suffix indicates a -40°C to 0°C commercial temperature range and speed grade 6; choose C7N or C8N only when timing closure requires the faster device.
This page synthesizes distributor pricing, drop-in and speed-grade alternatives, application guidance, and practical design notes beyond the datasheet, helping procurement, design, and validation engineers evaluate the EP1C12F324C6N in one view.
Drop-in-Alternativen für EP1C12F324C6N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1C12F324C6N (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Speed Grade, Process Technology, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1C12F324C8N
✅ Drop-In✓ Auf Lager
$51.75 / Stück
Datenblatt ansehen →EP1C12F324C7N
✅ Drop-In✓ Auf Lager
$37.2 / Stück
Datenblatt ansehen →EP1C12F324I7N
✅ Drop-In✓ Auf Lager
$52.1 / Stück
Datenblatt ansehen →EP1C12F324C6AA
✅ Drop-In✓ Auf Lager
$36.9 / Stück
Datenblatt ansehen →EP1C12F324C6AA
✅ Drop-In✓ Auf Lager
$36.9 / Stück
Datenblatt ansehen →EP1C12F324C6N Grenzwerte & elektrische Eigenschaften
| Series | Cyclone® |
| Logic Elements (LE) | 12,060 |
| Logic Array Blocks (LAB) | 1,206 |
| Total RAM Bits | 239,616 |
| Embedded Multipliers (9-bit) | 52 |
| Phase-Locked Loops (PLL) | 2 |
| Maximum User I/Os | 249 |
| Process Technology | 130 nm SRAM |
| Core Voltage (VCCINT) | 1.5 V |
| Gehäuse | 324-ball FineLine BGA |
| Speed Grade | 6 |
| Betriebstemperatur | 0°C to 85°C (commercial; C6N suffix) |
| Configuration Method | SRAM, serial/parallel via EPCS flash or JTAG |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, PCI, SSTL |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant (lead-free) |
EP1C12F324C6N 324-ball fineline bga Pinbelegungsleitfaden
Pinbelegung für EP1C12F324C6N (324-ball fineline bga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1C12F324C6N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1C12F324C6N ist geeignet für 7 Anwendungs: Industrial Motor Control, Video Processing and Display Controller, Software-Defined Radio Front-End, USB and Ethernet Bridging Logic, Telecom Equipment Glue Logic, Test and Measurement Instrumentation, Automotive Infotainment Pre-processing.
Industrial Motor Control
The EP1C12F324C6N fits industrial motor control designs because its 12,060 logic elements and 52 embedded 9-bit multipliers provide ample headroom for implementing field-oriented control (FOC) and space-vector PWM (SVPWM) IP cores, while the 249 user I/Os of the 324-ball FineLine BGA expose enough pins for parallel quadrature encoder interfaces, Hall-sensor inputs, and three-phase PWM outputs. The two on-chip PLLs allow precise synthesis of the high-frequency carrier waveform (typically 10-20 kHz) from a low-frequency crystal reference, and the LVDS-capable I/O banks simplify connection to industrial differential line drivers. Unlike microcontrollers, the FPGA can execute the entire current-loop calculation in a single 10 kHz cycle with deterministic latency, which is critical for torque ripple minimization in servo drives.
Empfohlen
Video Processing and Display Controller
In video pipelines such as multi-format HDMI/DVI input expanders, LCD scalers, and industrial camera preprocessing, the EP1C12F324C6N provides the parallel pixel bandwidth that microcontrollers cannot match. The 249 I/Os of the 324-BGA comfortably accommodate 24-bit RGB plus control signals, while the 52 multipliers accelerate 2D convolution and color-space conversion (YUV to RGB) in real time. The two PLLs derive independent pixel clocks for input capture and output display, and the M4K memory blocks serve as line buffers for scaling operations. Designers commonly pair the EP1C12 with an external DDR SDRAM controller IP to handle full-HD frame buffers.
Empfohlen
Software-Defined Radio Front-End
Software-defined radio (SDR) baseband processing requires hundreds of multipliers running in parallel for FIR filtering, channelization, and FFT butterfly operations - exactly the workload the EP1C12F324C6N's 52 embedded 9-bit multipliers and 12,060 LEs are designed for. The LVDS I/O banks connect directly to high-speed ADC/DAC pairs such as the AD9235 or AD9772a, with the two on-chip PLLs generating the ADC sampling clock and FPGA internal logic clock from a single reference. The 239,616 bits of M4K RAM hold filter coefficients and circular sample buffers. Compared to a DSP processor, the Cyclone implementation achieves deterministic latency and 5-10x throughput per MHz on parallel FIR structures.
Empfohlen
USB and Ethernet Bridging Logic
Designers building USB-to-Ethernet, USB-to-SPI, or Ethernet-to-parallel bridges often implement the protocol engines in an FPGA rather than buying a costly ASIC. The EP1C12F324C6N's 12,060 LEs hold a soft USB 2.0 device or 10/100 Ethernet MAC core alongside state machines, FIFOs, and DMA controllers, while the 52 multipliers accelerate CRC-32 and hash computations. The 249 I/Os of the 324-BGA package expose enough buses for parallel UTMI/ULPI PHY interfacing and RGMII Ethernet connections simultaneously. Industrial temperature variants (I7N suffix) make the device viable for outdoor networking equipment.
Empfohlen
Telecom Equipment Glue Logic
Telecom line cards often need to consolidate protocol adaptation, framing, alarm scanning, and backplane interfacing in a single low-cost programmable device. The EP1C12F324C6N with 12,060 LEs and 324-BGA is widely deployed for glue-logic consolidation on legacy TDM/ATM backplanes, replacing multiple 74-series TTL parts with one programmable device. The two PLLs regenerate clock trees for downstream framers and SERDES devices, and the LVDS-capable I/Os connect to neighbouring FPGAs across the backplane with minimal external components. Cyclone remains a cost-effective glue-logic solution when the BOM cannot justify a newer Cyclone V or Cyclone 10 device.
Empfohlen
Test and Measurement Instrumentation
Bench-top logic analyzers, protocol exercisers, and arbitrary waveform generators use FPGAs to capture, time-stamp, and process high-speed parallel data streams. The EP1C12F324C6N fits these instruments because its 249 I/Os accept wide parallel probe buses, its 52 multipliers perform on-the-fly CRC and encoding, and its M4K RAM blocks hold deep capture buffers. The two PLLs derive multiple phase-aligned sampling clocks from a single TCXO reference, and Quartus II's SignalTap embedded logic analyzer uses the device's internal JTAG for in-system debug without external probing. Industrial users select the I7N suffix variant for equipment that must operate across -40°C to 100°C.
Empfohlen
Automotive Infotainment Pre-processing
In cost-sensitive automotive head units and rear-seat entertainment modules, the EP1C12F324C6N's 12,060 LEs and 52 multipliers handle video scaling, de-interlacing, and graphics overlay ahead of the main application processor. The 324-BGA exposes 249 I/Os for digital RGB or LVDS display panels and for parallel camera inputs, and the two PLLs synthesize independent pixel clocks for capture and display. The C6N suffix supports 0°C to 85°C commercial operation; designers requiring -40°C to 100°C automotive temperature range select the I7N variant or the C6AA suffix variant. Cyclone is preferred over an ASIC for low-volume infotainment programs where NRE costs must be minimized.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1C12F324C6N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1C12F324C8N | EP1C12F324C7N | EP1C12F324I7N | EP1C12F324C6 | EP1C12F324C6AA |
|---|---|---|---|---|---|---|
| Package | 324-ball FineLine BGA | 324-ball FineLine BGA - same | 324-ball FineLine BGA - same | 324-ball FineLine BGA - same | 324-ball FineLine BGA - same | 324-ball FineLine BGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Speed Grade | 6 (C6N) | 8 (faster) | 7 | 7 (industrial temp) | 6 (non-RoHS variant) | 6 (automotive temp) |
| Operating Temperature | 0°C to 85°C (commercial) | 0°C to 85°C | 0°C to 85°C | -40°C to 100°C | 0°C to 85°C | Automotive grade |
| Logic Elements | 12,060 | 12,060 - same | 12,060 - same | 12,060 - same | 12,060 - same | 12,060 - same |
| RAM Bits | 239,616 | 239,616 - same | 239,616 - same | 239,616 - same | 239,616 - same | 239,616 - same |
| Embedded Multipliers | 52 (9-bit) | 52 - same | 52 - same | 52 - same | 52 - same | 52 - same |
| Maximum User I/Os | 249 | 249 - same | 249 - same | 249 - same | 249 - same | 249 - same |
| PLLs | 2 | 2 - same | 2 - same | 2 - same | 2 - same | 2 - same |
| RoHS Compliant | Yes (N suffix) | Yes | Yes | Yes | Verify - non-N suffix may be non-RoHS | Yes |
Wichtigste Unterscheidungsmerkmale
- Best price-performance balance in the Cyclone EP1C12 family (vs. EP1C12F324C8N)
- Industrial temperature option available in identical 324-BGA footprint (vs. EP1C12F324I7N)
- RoHS lead-free finish confirmed by N suffix (vs. EP1C12F324C6)
Designhinweise
Estimated: Cyclone EP1C12 core current at 50% LE utilization, 100 MHz operation typically draws 200-400 mA from VCCINT (1.5 V). Decouple every VCCINT ball with a 100 nF X7R ceramic capacitor placed within 5 mm of the BGA, plus a 10 µF bulk capacitor near the regulator. Each VCCIO bank should have its own 100 nF + 10 µF decoupling pair to limit switching-noise coupling into adjacent I/O banks. Power sequencing: VCCINT must reach 1.0 V before VCCIO banks ramp, per Cyclone datasheet.
The 324-ball FineLine BGA requires a 6-layer or 8-layer PCB with dedicated VCCINT, VCCIO, and GND planes. Use 0.20 mm via-in-pad with epoxy-filled capping for clean BGA escape; signal layers should be microstrip or stripline with controlled impedance (50 Ω single-ended, 100 Ω differential) on all clock and LVDS traces. Match trace lengths within 150 mils (3.8 mm) for DDR-style source-synchronous interfaces to keep setup/hold margins positive.
Do not leave MSEL[3:0] floating - the four strap pins select the configuration mode (AS, PS, JTAG, Fast Passive Parallel) and an undefined state can lock the FPGA in an unsupported mode. Always include a JTAG header (10-pin 0.05" Samtec FTSH or equivalent) for Quartus II programming and SignalTap debug. Configure unused I/O pins as input tri-stated with weak pull-up to avoid unnecessary current draw, and never use the JTAG TCK pin as a general-purpose I/O when JTAG is required for production programming.
Estimated: at 50% LE utilization, 100 MHz, the EP1C12F324C6N dissipates roughly 0.5-0.8 W (VCCINT current × 1.5 V). With a 324-BGA thermal resistance around 15-20 °C/W on a 6-layer PCB with internal copper planes, junction temperature rise above ambient stays under 15°C. Designs pushing 80%+ utilization or sustained heavy multiplier activity should size copper pours under the BGA to at least 1 cm² connected to GND for additional heat spreading.
Compliance-Informationen
RoHS compliant per the Intel/Altera product page. The N suffix denotes lead-free BGA finish. AEC-Q100 automotive qualification is NOT available on the C6N commercial variant; select the C6AA suffix for automotive temperature grade. REACH SVHC reporting compliant per manufacturer declaration.
