EP1C12F324C6N vs EP1C12F324C8L Vergleich
Detaillierter Direktvergleich von EP1C12F324C6N von Intel und EP1C12F324C8L von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1C12F324C6N | EP1C12F324C8L |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $22,10 | $23,40 |
| Series | Cyclone® | — |
| Logic Elements (LE) | 12,060 | — |
| Logic Array Blocks (LAB) | 1,206 | — |
| Total RAM Bits | 239,616 | — |
| Embedded Multipliers (9-bit) | 52 | — |
| Phase-Locked Loops (PLL) | 2 | — |
| Maximum User I/Os | 249 | — |
| Process Technology | 130 nm SRAM | CMOS, 130 nm |
| Core Voltage (VCCINT) | 1.5 V | 1.5 V |
| Gehäuse | 324-ball FineLine BGA | FBGA-324 |
| Speed Grade | 6 | 8 |
| Betriebstemperatur | 0°C to 85°C (commercial; C6N suffix) | 0C to +85C (commercial) |
| Configuration Method | SRAM, serial/parallel via EPCS flash or JTAG | — |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, PCI, SSTL | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS-Status | Compliant (lead-free) | Compliant |
| Family | — | Cyclone |
| Logic Elements | — | 12,060 |
| Embedded RAM Bits | — | 239,616 |
| M4K RAM Blocks | — | 52 |
| User I/O Pins | — | 249 |
| PLLs | — | 2 |
| Package Body Size | — | 19 x 19 mm |
| Ball Pitch | — | 1.0 mm |
| I/O Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Power Variant | — | Low-power (L suffix) |
| MSL-Level | — | [DATA_NEEDED: MSL level] |