EP1K30FC256-2N - ACEX 1K FPGA, 1728 LEs, 171 I/O | Altera
Teilenummer: EP1K30FC256-2N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $38.43 | $38,43 |
| 10 | $34.59 | $345,90 |
| 100 | $30.74 | $3.074,00 |
| 500 | $26.11 | $13.055,00 |
| 1.000 | $21.45 | $21.450,00 |
EP1K30FC256-2N Übersicht
A field-programmable gate array (FPGA) is an integrated circuit whose digital logic can be configured after manufacturing rather than being fixed at the factory. The FPGA sits inside the programmable logic device family, above it are programmable logic devices (PLDs), then integrated circuits, then semiconductors. In a typical system, an FPGA provides flexible glue logic, custom state machines, protocol bridging, and parallel compute structures that standard microcontrollers cannot easily implement, while retaining the ability to be reprogrammed during prototyping or production.
Key features of the EP1K30FC256-2N include 216 logic array blocks, 24,576 RAM bits for on-chip FIFOs and buffers, and 171 user I/O pins. According to distributor and family datasheet summaries, the device can operate at internal clock frequencies up to 200 MHz and uses a 0.22 um process. The 2.5 V core supply permits low-power operation compared with earlier 5 V PLDs, while the 256-ball FBGA package provides a compact footprint for densely populated boards.
From a technical standpoint, the ACEX 1K architecture combines logic elements with embedded array blocks that can implement memory and specialized functions. This makes the device suitable for datapath applications that require both distributed control logic and local data storage. The SRAM-based configuration is in-system programmable and typically loads from an external configuration device such as an EPC-series PROM at power-up.
Typical applications include networking and communications equipment, industrial control panels, test and measurement systems, consumer audio/video bridging, and IoT sensor aggregation. The device is chosen when an engineer needs a moderate amount of programmable logic, many general-purpose I/O pins, and predictable low-cost performance on a 2.5 V design.
A key design consideration is that the FPGA configuration is volatile: the bitstream must be loaded from external memory or a download cable after every power-up. Designers must also add adequate power-supply decoupling and carefully manage the FPGA configuration pins such as DCLK and CONF_DONE during board bring-up.
This page synthesizes distributor pricing, ACEX 1K drop-in alternatives, practical design notes, and procurement guidance that are not normally listed together on a single manufacturer datasheet page. It is intended for engineers evaluating the EP1K30FC256-2N for legacy maintenance, replacement, or cost-sensitive programmable logic designs.
Drop-in-Alternativen für EP1K30FC256-2N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1K30FC256-2N (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Process Technology, Logic Elements, Core Supply Voltage.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1K30FC256-2
✅ Drop-In✓ Auf Lager
$22.95 / Stück
Datenblatt ansehen →EP1K30FC256-1N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$13.95 / Stück
Datenblatt ansehen →EP1K30FC256-1
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$17.85 / Stück
Datenblatt ansehen →EP1K30FI256-2N
✅ Drop-In✓ Auf Lager
$18.4 / Stück
Datenblatt ansehen →EP1K30FC256-3
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$11.1 / Stück
Datenblatt ansehen →EP1K30FC256-2N Grenzwerte & elektrische Eigenschaften
| FPGA Family | ACEX 1K |
| Number of Logic Elements | 1728 |
| Typical Gate Count | 30,000 gates |
| Logic Array Blocks (LABs) | 216 |
| Total RAM Bits | 24,576 bits |
| Maximum User I/O Pins | 171 |
| Core Supply Voltage | 2.5 V |
| Maximum Internal Operating Frequency | 200 MHz |
| Process Technology | 0.22 um |
| Speed Grade | -2 |
| Package Type | 256-ball FineLine BGA (FBGA) |
| Pin/Ball Count | 256 |
| Montageart | Surface Mount |
| Temperature Grade | Commercial (C suffix) |
| Device Configuration | SRAM-based, in-system programmable |
| Terminal Finish | Lead-free (-N suffix) |
EP1K30FC256-2N 256-ball fineline bga (fbga) Pinbelegungsleitfaden
Pinbelegung für EP1K30FC256-2N (256-ball fineline bga (fbga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1K30FC256-2N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1K30FC256-2N ist geeignet für 6 Anwendungs: Network Line Card and Switching Logic, Industrial Automation and PLC I/O, Test and Measurement Instruments, Consumer Audio/Video Bridging, IoT Gateway and Sensor Aggregation, Server and Storage Sideband Management.
Network Line Card and Switching Logic
The EP1K30FC256-2N fits line-card glue logic, packet counting, and switch fabric control because its 1728 logic elements and 24,576 RAM bits are enough for FIFOs, register banks, and simple state machines. The 171 user I/O pins provide multiple parallel connections to PHYs, framers, and backplane transceivers. In a networking application, the FPGA can implement a custom DMA interface or protocol bridge without the cost of a larger FPGA. The 2.5 V core and commercial temperature grade are suited to indoor data-communication equipment. Place the device close to the interface ICs and assign I/O banks carefully to minimize signal skew. According to the ACEX 1K family architecture, each embedded array block can act as memory, enabling packet buffers without an external SRAM in many low-to-medium rate systems.
Empfohlen
Industrial Automation and PLC I/O
For industrial control, the EP1K30FC256-2N can be used as a flexible I/O controller, implementing parallel bus decoding, quadrature encoder logic, and simple motion-control state machines. The 171 I/O pins enable direct connection to optocoupler arrays, pushbuttons, and multi-channel ADC/DAC interfaces. The industrial-grade alternative EP1K30FI256-2N is often preferred when the PCB must withstand a wider ambient-temperature range on a factory floor. The ACEX 1K architecture supports deterministic combinational logic with low latency, which is important in PLC input sampling. Use the FPGA to preprocess sensor data before communicating with a host MCU, reducing interrupt loading. The part's moderate gate count makes it cheaper than high-end FPGAs for typical discrete-manufacturing control boards. Configuration storage through an EPC-series device simplifies field updates if the design includes an in-system programming header.
Empfohlen
Test and Measurement Instruments
The EP1K30FC256-2N is suitable for test equipment that needs custom timing generators, data-acquisition sequencers, and trigger logic. Its 24,576 RAM bits can implement acquisition buffers and capture FIFOs, while the logic elements perform address decoding and state control. The -2 speed grade supports clock rates up to 200 MHz in family summaries, which is practical for many mid-range instruments. The large I/O count allows connection to ADCs, DACs, front-panel displays, and host controllers through parallel or serial interfaces. Because measurement applications often requalify firmware, the FPGA's reprogrammability is valuable. Designers should add test points on configuration pins and provide a robust 2.5 V core supply with low noise. The commercial temperature grade covers benchtop equipment that is used in conditioned laboratory or production environments.
Empfohlen
Consumer Audio/Video Bridging
In consumer electronics, the EP1K30FC256-2N can bridge audio/video control signals, scaler engines, and legacy interfaces. The RAM bits are useful for line buffers, I2S FIFOs, and audio format conversion state machines. Its 3.3 V/2.5 V I/O flexibility allows connection to codecs, HDMI receiver controllers, and host application processors. The device is especially appropriate for low-volume or rapidly evolving consumer products where ASIC development cannot be justified. Designers must verify the actual I/O standard support from the datasheet and ensure the FPGA is configured before external processors attempt to communicate. Because consumer products require RoHS-compliant assembly, the -N lead-free finish is an advantage. Power consumption should be estimated from logic utilization and clock rate, and the 2.5 V rail should be well regulated to avoid configuration corruption.
Empfohlen
IoT Gateway and Sensor Aggregation
The EP1K30FC256-2N can act as a low-cost aggregation FPGA in IoT gateways, reading multiple sensor channels through parallel or serial buses and formatting data for an external MCU or network processor. Its 1728 logic elements are enough for simple bus translators, time-stamping logic, and CRC calculation blocks. The 24,576 RAM bits provide small packet queues without tying up host memory. The compact 256-ball FBGA package is appropriate for space-limited gateway boards. For production IoT devices, confirm that the ACEX 1K family availability meets long-term requirements, since the family is older and may be constrained. If a design is expected to ship for many years, consider a newer FPGA family. For existing ACEX 1K boards, the EP1K30FC256-2N or its drop-in variants can keep a gateway product in service.
Empfohlen
Server and Storage Sideband Management
In server and storage boards, the EP1K30FC256-2N can implement sideband bus glue logic, LED management, FRU EEPROM address decoding, and simple hot-swap sequencing. The FPGA's many I/O pins allow it to interface with BMCs, CPLDs, and multiple I2C or SMBus segments. Its 30K typical gates are modest but sufficient for control-plane functions that do not require high-speed SerDes. The 2.5 V core supply and commercial temperature grade fit standard rack-mount server environments. Because server designs require high reliability, make sure the ACEX 1K configuration PROM is programmed with a checksum and consider adding a configuration-done monitoring signal. For new servers, the older ACEX family is usually not the first choice, but this part remains useful for legacy board repair and low-speed management logic.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1K30FC256-2N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1K30FC256-2 | EP1K30FC256-1N | EP1K30FC256-1 | EP1K30FI256-2N | EP1K30FC256-3 |
|---|---|---|---|---|---|---|
| Package | 256-BGA (FBGA) | 256-BGA (FBGA) | 256-BGA (FBGA) | 256-BGA (FBGA) | 256-BGA (FBGA) | 256-BGA (FBGA) |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 1728 | 1728 | 1728 | 1728 | 1728 | 1728 |
| Typical Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 |
| RAM Bits | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 |
| Max User I/O | 171 | 171 | 171 | 171 | 171 | 171 |
| Core Supply Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Speed Grade | -2 | -2 | -1 | -1 | -2 | -3 |
| Temperature Grade | Commercial (C) | Commercial (C) | Commercial (C) | Commercial (C) | Industrial (I) | Commercial (C) |
| Lead-Free Finish | Yes (-N suffix) | No -N suffix | Yes (-N suffix) | No -N suffix | Yes (-N suffix) | No -N suffix |
Wichtigste Unterscheidungsmerkmale
- Lead-free -N finish simplifies RoHS-compliant assembly (vs. EP1K30FC256-2)
- Faster -2 speed grade than the -3 variant (vs. EP1K30FC256-3)
- Commercial grade permits lower-cost procurement than industrial grade (vs. EP1K30FI256-2N)
Designhinweise
The EP1K30FC256-2N is SRAM-based and its configuration is lost at power-down. A working design must include a configuration source such as an EPC-series PROM, a download cable header, or an external controller that writes the bitstream. During board bring-up, monitor CONF_DONE, nCONFIG, and DCLK signals. Do not rely on the FPGA outputs being valid until configuration has completed. This is critical for systems where downstream devices could misinterpret floating I/O pins.
Estimated: the 2.5 V core supply should be clean and well decoupled at the FPGA input balls. Use multiple 0.1 uF ceramic capacitors placed close to the BGA power balls and one to four bulk capacitors depending on design density. Actual current depends on logic utilization, clock frequency, and I/O loading; calculate power by using a power estimation spreadsheet supplied by Altera. For legacy boards, verify that the existing 2.5 V regulator can still supply the I/O configuration circuits during power-up because the FPGA current can spike while loading configuration data.
The 256-ball FineLine BGA requires careful fanout. Estimate the ball pitch from the ACEX 1K package drawing before creating the board. Use blind/via or microvia technology if the PCB stackup cannot route all 256 balls with traditional through-hole vias. Keep series termination resistors close to the FPGA outputs for high-speed I/O. Add test pads for configuration pins so a factory programmer can program the external configuration PROM without manually holding the FPGA in reset.
Compliance-Informationen
The -N suffix indicates a lead-free terminal finish. Formal RoHS/REACH statements were not included in the verified web data snippets, so they remain unconfirmed.
