EP1K30FC256-2N - ACEX 1K FPGA, 1728 LEs, 171 I/O | Altera
MPN: EP1K30FC256-2N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.43 | $38.43 |
| 10 | $34.59 | $345.90 |
| 100 | $30.74 | $3,074.00 |
| 500 | $26.11 | $13,055.00 |
| 1,000 | $21.45 | $21,450.00 |
Drop-in alternatives for EP1K30FC256-2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K30FC256-2
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View Datasheet →EP1K30FC256-1N
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View Datasheet →EP1K30FC256-1
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View Datasheet →EP1K30FI256-2N
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View Datasheet →EP1K30FC256-3
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View Datasheet →EP1K30FC256-2N Maximum Ratings & Electrical Characteristics
| FPGA Family | ACEX 1K |
| Number of Logic Elements | 1728 |
| Typical Gate Count | 30,000 gates |
| Logic Array Blocks (LABs) | 216 |
| Total RAM Bits | 24,576 bits |
| Maximum User I/O Pins | 171 |
| Core Supply Voltage | 2.5 V |
| Maximum Internal Operating Frequency | 200 MHz |
| Process Technology | 0.22 um |
| Speed Grade | -2 |
| Package Type | 256-ball FineLine BGA (FBGA) |
| Pin/Ball Count | 256 |
| Mounting Type | Surface Mount |
| Temperature Grade | Commercial (C suffix) |
| Device Configuration | SRAM-based, in-system programmable |
| Terminal Finish | Lead-free (-N suffix) |
EP1K30FC256-2N 256-ball fineline bga (fbga) Pin Configuration Guide
Complete pinout information for EP1K30FC256-2N (256-ball fineline bga (fbga) package) with 171 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1K30FC256-2N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 171 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K30FC256-2N is suitable for 6 applications: Network Line Card and Switching Logic, Industrial Automation and PLC I/O, Test and Measurement Instruments, Consumer Audio/Video Bridging, IoT Gateway and Sensor Aggregation, Server and Storage Sideband Management.
Network Line Card and Switching Logic
The EP1K30FC256-2N fits line-card glue logic, packet counting, and switch fabric control because its 1728 logic elements and 24,576 RAM bits are enough for FIFOs, register banks, and simple state machines. The 171 user I/O pins provide multiple parallel connections to PHYs, framers, and backplane transceivers. In a networking application, the FPGA can implement a custom DMA interface or protocol bridge without the cost of a larger FPGA. The 2.5 V core and commercial temperature grade are suited to indoor data-communication equipment. Place the device close to the interface ICs and assign I/O banks carefully to minimize signal skew. According to the ACEX 1K family architecture, each embedded array block can act as memory, enabling packet buffers without an external SRAM in many low-to-medium rate systems.
Recommended
Industrial Automation and PLC I/O
For industrial control, the EP1K30FC256-2N can be used as a flexible I/O controller, implementing parallel bus decoding, quadrature encoder logic, and simple motion-control state machines. The 171 I/O pins enable direct connection to optocoupler arrays, pushbuttons, and multi-channel ADC/DAC interfaces. The industrial-grade alternative EP1K30FI256-2N is often preferred when the PCB must withstand a wider ambient-temperature range on a factory floor. The ACEX 1K architecture supports deterministic combinational logic with low latency, which is important in PLC input sampling. Use the FPGA to preprocess sensor data before communicating with a host MCU, reducing interrupt loading. The part's moderate gate count makes it cheaper than high-end FPGAs for typical discrete-manufacturing control boards. Configuration storage through an EPC-series device simplifies field updates if the design includes an in-system programming header.
Recommended
Test and Measurement Instruments
The EP1K30FC256-2N is suitable for test equipment that needs custom timing generators, data-acquisition sequencers, and trigger logic. Its 24,576 RAM bits can implement acquisition buffers and capture FIFOs, while the logic elements perform address decoding and state control. The -2 speed grade supports clock rates up to 200 MHz in family summaries, which is practical for many mid-range instruments. The large I/O count allows connection to ADCs, DACs, front-panel displays, and host controllers through parallel or serial interfaces. Because measurement applications often requalify firmware, the FPGA's reprogrammability is valuable. Designers should add test points on configuration pins and provide a robust 2.5 V core supply with low noise. The commercial temperature grade covers benchtop equipment that is used in conditioned laboratory or production environments.
Recommended
Consumer Audio/Video Bridging
In consumer electronics, the EP1K30FC256-2N can bridge audio/video control signals, scaler engines, and legacy interfaces. The RAM bits are useful for line buffers, I2S FIFOs, and audio format conversion state machines. Its 3.3 V/2.5 V I/O flexibility allows connection to codecs, HDMI receiver controllers, and host application processors. The device is especially appropriate for low-volume or rapidly evolving consumer products where ASIC development cannot be justified. Designers must verify the actual I/O standard support from the datasheet and ensure the FPGA is configured before external processors attempt to communicate. Because consumer products require RoHS-compliant assembly, the -N lead-free finish is an advantage. Power consumption should be estimated from logic utilization and clock rate, and the 2.5 V rail should be well regulated to avoid configuration corruption.
Recommended
IoT Gateway and Sensor Aggregation
The EP1K30FC256-2N can act as a low-cost aggregation FPGA in IoT gateways, reading multiple sensor channels through parallel or serial buses and formatting data for an external MCU or network processor. Its 1728 logic elements are enough for simple bus translators, time-stamping logic, and CRC calculation blocks. The 24,576 RAM bits provide small packet queues without tying up host memory. The compact 256-ball FBGA package is appropriate for space-limited gateway boards. For production IoT devices, confirm that the ACEX 1K family availability meets long-term requirements, since the family is older and may be constrained. If a design is expected to ship for many years, consider a newer FPGA family. For existing ACEX 1K boards, the EP1K30FC256-2N or its drop-in variants can keep a gateway product in service.
Recommended
Server and Storage Sideband Management
In server and storage boards, the EP1K30FC256-2N can implement sideband bus glue logic, LED management, FRU EEPROM address decoding, and simple hot-swap sequencing. The FPGA's many I/O pins allow it to interface with BMCs, CPLDs, and multiple I2C or SMBus segments. Its 30K typical gates are modest but sufficient for control-plane functions that do not require high-speed SerDes. The 2.5 V core supply and commercial temperature grade fit standard rack-mount server environments. Because server designs require high reliability, make sure the ACEX 1K configuration PROM is programmed with a checksum and consider adding a configuration-done monitoring signal. For new servers, the older ACEX family is usually not the first choice, but this part remains useful for legacy board repair and low-speed management logic.
Recommended
Recommended Products Summary
Engineering reference data for EP1K30FC256-2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K30FC256-2 | EP1K30FC256-1N | EP1K30FC256-1 | EP1K30FI256-2N | EP1K30FC256-3 |
|---|---|---|---|---|---|---|
| Package | 256-BGA (FBGA) | 256-BGA (FBGA) | 256-BGA (FBGA) | 256-BGA (FBGA) | 256-BGA (FBGA) | 256-BGA (FBGA) |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 1728 | 1728 | 1728 | 1728 | 1728 | 1728 |
| Typical Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 |
| RAM Bits | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 | 24,576 |
| Max User I/O | 171 | 171 | 171 | 171 | 171 | 171 |
| Core Supply Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Speed Grade | -2 | -2 | -1 | -1 | -2 | -3 |
| Temperature Grade | Commercial (C) | Commercial (C) | Commercial (C) | Commercial (C) | Industrial (I) | Commercial (C) |
| Lead-Free Finish | Yes (-N suffix) | No -N suffix | Yes (-N suffix) | No -N suffix | Yes (-N suffix) | No -N suffix |
Key Differentiators
- Lead-free -N finish simplifies RoHS-compliant assembly (vs EP1K30FC256-2)
- Faster -2 speed grade than the -3 variant (vs EP1K30FC256-3)
- Commercial grade permits lower-cost procurement than industrial grade (vs EP1K30FI256-2N)
Design Notes
The EP1K30FC256-2N is SRAM-based and its configuration is lost at power-down. A working design must include a configuration source such as an EPC-series PROM, a download cable header, or an external controller that writes the bitstream. During board bring-up, monitor CONF_DONE, nCONFIG, and DCLK signals. Do not rely on the FPGA outputs being valid until configuration has completed. This is critical for systems where downstream devices could misinterpret floating I/O pins.
Estimated: the 2.5 V core supply should be clean and well decoupled at the FPGA input balls. Use multiple 0.1 uF ceramic capacitors placed close to the BGA power balls and one to four bulk capacitors depending on design density. Actual current depends on logic utilization, clock frequency, and I/O loading; calculate power by using a power estimation spreadsheet supplied by Altera. For legacy boards, verify that the existing 2.5 V regulator can still supply the I/O configuration circuits during power-up because the FPGA current can spike while loading configuration data.
The 256-ball FineLine BGA requires careful fanout. Estimate the ball pitch from the ACEX 1K package drawing before creating the board. Use blind/via or microvia technology if the PCB stackup cannot route all 256 balls with traditional through-hole vias. Keep series termination resistors close to the FPGA outputs for high-speed I/O. Add test pads for configuration pins so a factory programmer can program the external configuration PROM without manually holding the FPGA in reset.
Compliance Information
The -N suffix indicates a lead-free terminal finish. Formal RoHS/REACH statements were not included in the verified web data snippets, so they remain unconfirmed.