EPF6016AFC256-3 - 16K Gates FLEX 6000 FPGA, 171 I/O | Intel
Teilenummer: EPF6016AFC256-3 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $29.85 | $2.985,00 |
| 500 | $25.4 | $12.700,00 |
| 1.000 | $22.1 | $22.100,00 |
EPF6016AFC256-3 Übersicht
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing an array of programmable logic blocks, interconnect, and I/O cells that can be customized after manufacturing via a configuration bitstream. The FLEX 6000 belongs to the older Altera/Intel hierarchy: FPGA -> programmable logic -> SRAM-based PLD -> integrated circuit. It sits below the APEX and Stratix families in capacity but offers low-cost, fast prototyping for designs that would otherwise require a masked gate array.
Key features include 1320 logic elements distributed across 132 LABs, embedded SRAM distributed throughout the fabric, multi-voltage I/O support, and in-system programmability through the IEEE 1149.1 JTAG interface. The 256-ball FineLine BGA package enables dense board placement and provides 171 usable I/O pins for high pin-count glue-logic designs. Power consumption is governed by CMOS static current, making the part suitable for power-sensitive embedded platforms.
The FLEX 6000 architecture uses a continuous interconnect backbone with row-and-column routing channels feeding each LAB, which contains ten LEs with carry-chain and cascade support. Configuration is loaded from an external serial or parallel PROM into on-chip SRAM; this SRAM-based approach makes the device volatile and requires reconfiguration on every power-up. The part is fabricated on a 0.42 µm four-layer-metal CMOS process tuned for predictable timing closure.
Typical applications include industrial control glue-logic, telecommunications interface bridging, ASIC prototyping and emulation, low-cost DSP co-processing, and legacy system replacement where existing PCBs require a drop-in FLEX 6000 footprint. The device is also widely used in educational platforms and FPGA design training kits.
When designing with this part, plan the configuration PROM selection carefully: the EPF6016 will not retain its bitstream without external memory. Use the Quartus II (or MAX+PLUS II) toolchain for design entry, and verify I/O bank voltage compatibility when interfacing with 5 V logic.
This page synthesizes Intel/Altera datasheet specifications, current distributor inventory, and engineering design notes that go beyond the manufacturer datasheet to support sourcing, replacement, and lifecycle decisions.
Drop-in-Alternativen für EPF6016AFC256-3 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EPF6016AFC256-3 (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, Operating Temperature, Speed Grade, Device Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EPF6016AFC256-3N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EPF6016AFC256-2
✅ Drop-In✓ Auf Lager
$33.05 / Stück
Datenblatt ansehen →EPF6010ATC100-3
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$18.9 / Stück
Datenblatt ansehen →EPF6010ATC144-3
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$9.75 / Stück
Datenblatt ansehen →EPF10K30EFC256-3
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$24.6 / Stück
Datenblatt ansehen →EPF6016AFC256-3 Grenzwerte & elektrische Eigenschaften
| Family | FLEX 6000 |
| Device Type | FPGA (Field Programmable Gate Array) |
| Equivalent Gates | 16K |
| Logic Elements (LEs) | 1320 |
| Logic Array Blocks (LABs) | 132 |
| User I/Os | 171 |
| Maximum Internal Frequency | 142.86 MHz |
| Edge Rate | 172 MHz |
| Process Technology | 0.42 µm CMOS |
| Core Supply Voltage | 3.3 V |
| Gehäuse | 256-ball FineLine BGA (FBGA) |
| Pin-Anzahl | 256 |
| Speed Grade | -3 |
| Configuration Method | SRAM (volatile, requires external PROM) |
| Programming Interface | JTAG (IEEE 1149.1) |
| Betriebstemperatur | 0 °C to +85 °C (commercial) |
| Montageart | Surface Mount (BGA) |
EPF6016AFC256-3 256-ball fineline bga (fbga) Pinbelegungsleitfaden
Pinbelegung für EPF6016AFC256-3 (256-ball fineline bga (fbga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EPF6016AFC256-3.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EPF6016AFC256-3 ist geeignet für 6 Anwendungs: Industrial Glue-Logic and Protocol Bridging, ASIC Prototyping and Emulation, Telecommunications Interface Bridging, Legacy System Replacement and Field Upgrades, FPGA Education and Design Training, Low-Cost DSP Co-Processing.
Industrial Glue-Logic and Protocol Bridging
The EPF6016AFC256-3 is well suited for industrial glue-logic, protocol bridging, and machine-control signal conditioning with its 171 user I/Os and 16K gates of programmable logic. The 256-ball FineLine BGA delivers high pin density for designs that aggregate multiple asynchronous interfaces (UART, SPI, parallel bus) into a unified control plane. Its 142.86 MHz fMAX handles real-time control loops at typical industrial cycle rates of 1-10 kHz without timing closure issues, while 1320 LEs provide headroom for state-machine decoding. Engineers should note the 0 °C to +85 °C commercial temperature range and obsolete lifecycle when planning long-term industrial deployments.
Empfohlen
ASIC Prototyping and Emulation
With 1320 LEs and 132 LABs, the EPF6016AFC256-3 enables ASIC prototyping and emulation of medium-complexity designs before committing to mask tooling. The SRAM-based architecture supports rapid design iteration: a new bitstream can be loaded in milliseconds via JTAG, allowing design teams to validate register-transfer logic, bus arbitration, and peripheral interfaces. Quartus II timing analysis provides realistic performance estimates for the target ASIC. The 171 I/Os expose enough signal pins to emulate multi-peripheral SoC blocks while staying within the device's 142.86 MHz timing envelope.
Empfohlen
Telecommunications Interface Bridging
Telecommunications interface bridging between legacy and modern buses benefits from the EPF6016AFC256-3's 171 I/Os and configurable I/O voltage standards. The FLEX 6000 family supports LVTTL, LVCMOS, PCI, and other standards, enabling direct bridging between 3.3 V and 5 V domains without external transceivers for many signal classes. At 142.86 MHz internal fMAX, the part handles T1/E1 framing logic, HDLC controllers, and parallel telecom backplanes comfortably. SRAM volatility means telecom equipment using this part must include a reliable configuration PROM in the boot path.
Empfohlen
Legacy System Replacement and Field Upgrades
The EPF6016AFC256-3 is the canonical drop-in choice for legacy system replacement when original FLEX 6000 parts fail or are unobtainable. With the same 256-ball FineLine BGA footprint and pinout as the original EPF6016AFC256 family, this part installs directly onto existing PCBs without rework. Its -3 speed grade is the slowest of the family, matching the timing of the most widely deployed legacy designs and avoiding timing-margin surprises. Long-term field support planning should account for the obsolete lifecycle status and limited authorized stock.
Empfohlen
FPGA Education and Design Training
Educational institutions and training labs favor the EPF6016AFC256-3 for teaching FPGA fundamentals because of its mature toolchain (MAX+PLUS II and Quartus II), abundant tutorial materials, and forgiving timing characteristics at -3 speed grade. The 1320 LEs provide enough complexity for meaningful coursework on state machines, pipelining, and bus architectures without overwhelming beginners. The 171 user I/Os expose students to real-world pin-count and bank-voltage constraints. Its obsolete status means labs should procure multiple units while stock remains.
Empfohlen
Low-Cost DSP Co-Processing
Low-cost DSP co-processing tasks such as FIR filtering, FFT preprocessing, and custom peripheral control are well within the EPF6016AFC256-3's envelope. The 132 LABs and dedicated carry-chain support enable efficient multiply-accumulate structures for parallel DSP arithmetic. At 142.86 MHz fMAX, the device performs 16-tap FIR filters at sample rates exceeding 5 MHz across parallel channel arrays. The SRAM-based fabric lets designers update coefficients in real time via JTAG or parallel peripheral writes, supporting adaptive filter applications.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EPF6016AFC256-3 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EPF6016AFC256-3N | EPF6016AFC256-2 | EPF10K30EFC256-3 | EPF6010ATC100-3 | EPF6010ATC144-3 |
|---|---|---|---|---|---|---|
| Package | 256-ball FineLine BGA (FBGA-256) | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 100-pin TQFP - different | 144-pin TQFP - different |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Family | FLEX 6000 | FLEX 6000 - same | FLEX 6000 - same | FLEX 10K - upgrade | FLEX 6010 - upgrade | FLEX 6010 - upgrade |
| Equivalent Gates | 16K | 16K | 16K | 30K | 10K | 10K |
| Logic Elements | 1320 | 1320 | 1320 | 2460 | 880 | 880 |
| User I/Os | 171 | 171 | 171 | 246 | 71 | 102 |
| Speed Grade | -3 | -3 | -2 (faster) | -3 | -3 | -3 |
| Process | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS | 0.42 µm CMOS |
| Core Voltage | 3.3 V | 3.3 V | 3.3 V | 5.0 V | 3.3 V | 3.3 V |
Wichtigste Unterscheidungsmerkmale
- Pin-compatible lead-free upgrade path (vs. EPF6016AFC256-3N)
- Faster speed-grade option in same footprint (vs. EPF6016AFC256-2)
- Higher logic capacity in same footprint (vs. EPF10K30EFC256-3)
Designhinweise
The EPF6016AFC256-3 is SRAM-based and volatile; it cannot retain its bitstream without power and must be reconfigured on every power-up. Provide a stable 3.3 V core supply and a configuration PROM (such as EPC2 or EPC16) wired in passive-serial, passive-parallel, or JTAG mode. The configuration interface must complete bitstream load before any user I/O becomes active; budget 100-200 ms for typical 16K-gate designs. Add a reset supervisor to delay system release until CONF_DONE asserts.
Use a multi-layer PCB with dedicated ground and power planes for the 256-ball FineLine BGA footprint. The BGA ball pitch (typically 1.0 mm for FineLine BGA) requires laser-drilled microvias or via-in-pad for breakout. Place 0.1 µF decoupling capacitors on each VCCIO and VCCINT pin within 5 mm of the ball. Add 10 µF bulk capacitors near the device. Match trace lengths on high-speed clock and JTAG signals to avoid skew across the array.
Do not assume the EPF6016AFC256-3 is in active production: it is obsolete as of 2026-09-11. Stock is limited and pricing volatile; place orders with multiple qualified distributors to mitigate supply risk. Avoid mixing speed grades -3 and -2 on the same PCB bus: timing analysis must be redone for the new grade. I/O bank voltages must match the peripheral supply; mixing 3.3 V and 5 V on the same bank violates absolute maximum ratings.
Estimated: at 142.86 MHz internal fMAX with 100% logic utilization, the EPF6016AFC256-3 dissipates approximately 0.5-1.0 W dynamic power, plus a static component of typically 50-100 mW. With FineLine BGA theta_JA of approximately 25-30 °C/W on a 4-layer JEDEC test board, junction temperature rise above ambient is 15-30 °C. Commercial temperature range is 0 °C to +85 °C; the junction must remain below 125 °C absolute maximum. Adequate PCB copper area (at least 1 sq inch of unbroken ground plane under the BGA) provides sufficient cooling without a heatsink.
Compliance-Informationen
Original EPF6016AFC256-3 uses lead-bearing finish (non-RoHS). The '-3N' suffix variant is lead-free RoHS compliant. AEC-Q100 not applicable for legacy FPGAs. Reach and conflict-mineral data not available in verified sources.
