EP1M350F780I7N - Altera Mercury PLD, 780-pin FBGA | Intel FPGA
Teilenummer: EP1M350F780I7N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $245 | $245,00 |
| 10 | $225.5 | $2.255,00 |
| 100 | $198.75 | $19.875,00 |
| 500 | $175 | $87.500,00 |
| 1.000 | $152.25 | $152.250,00 |
EP1M350F780I7N Übersicht
An enhanced configuration device is a non-volatile memory plus state-machine IC designed to configure SRAM-based FPGAs at power-up, replacing legacy PROM-based boot solutions. Mercury PLD devices sit at the top of the configuration-device hierarchy: configuration PROM -> enhanced configuration device -> Mercury PLD family -> FPGA configuration memory. They are an essential part of the broader programmable logic ecosystem (PLD -> programmable logic -> FPGA configuration subsystem -> digital IC).
Key features of the EP1M350 include on-chip flash storage with parallel interface support, JTAG-compliant in-system programmability through IEEE 1149.1 boundary-scan, and dedicated configuration-control logic that handles FPGAs from multiple vendors. The 780-pin FineLine BGA package exposes the full parallel data bus, address bus, and JTAG signals required for high-density multi-Mbit configuration streams, while keeping board area compact relative to legacy DIP/PLCC PROMs.
At the architectural level, the Mercury PLD separates the configuration controller from the flash array so that re-programming does not stall the host system. It supports serial and parallel configuration modes, CRC-based stream validation, and compression-compatible bitstream formats, allowing engineers to use larger designs without external storage. This makes it the configuration counterpart to high-density FPGAs such as Stratix and similar LUT-based architectures.
Typical applications include configuring Altera Stratix-series and other high-density SRAM FPGAs in telecommunications line cards, industrial vision systems, military/aerospace signal processing, and networking infrastructure. It is also widely used in lab prototypes where engineers need rapid, repeatable FPGA boot without an external PROM.
When designing with this part, ensure the JTAG chain ordering and TMS/TCK pull-up resistors match IEEE 1149.1 recommendations, and verify the supported bitstream density against your target FPGA configuration file size. The 780-ball BGA requires controlled-impedance PCB routing and X-ray inspection during assembly.
This page consolidates distributor pricing, Mercury PLD family alternatives, and PCB-level design notes that complement the manufacturer datasheet and help sourcing engineers qualify second-source options.
Drop-in-Alternativen für EP1M350F780I7N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1M350F780I7N (gleiche Bauform und Footprint) – abweichend in Family, Operating Temperature, Package, Speed Grade, Architecture.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1M350F780C7N
✅ Drop-In✓ Auf Lager
$168 / Stück
Datenblatt ansehen →EP1M350F780I6N
✅ Drop-In✓ Auf Lager
$165 / Stück
Datenblatt ansehen →EP1M350F780C6N
✅ Drop-In✓ Auf Lager
$219.4 / Stück
Datenblatt ansehen →EP1M350F780C7
✅ Drop-In✓ Auf Lager
$162 / Stück
Datenblatt ansehen →EP1M350F780I7
✅ Drop-In✓ Auf Lager
$165.2 / Stück
Datenblatt ansehen →EP1M350F780I7N Grenzwerte & elektrische Eigenschaften
| Device Family | Mercury PLD (Enhanced Configuration Device) |
| Funktion | Configuration device for SRAM-based LUT FPGAs |
| Gehäuse | 780-ball FineLine BGA |
| Speed Grade | 7 |
| Betriebstemperaturbereich | -40C to +100C (Industrial, I suffix) |
| Configuration Modes | Serial and parallel FPGA configuration |
| Programming Interface | JTAG (IEEE 1149.1) boundary-scan |
| On-chip Memory | Flash memory array |
| Configuration Controller | Integrated state-machine controller |
| Bitstream Support | CRC-validated, compression-compatible |
| Montageart | Surface Mount (BGA) |
| Configuration Compatibility | High-density SRAM-based LUT FPGAs (Stratix and equivalent) |
EP1M350F780I7N 780-ball fineline bga Pinbelegungsleitfaden
Pinbelegung für EP1M350F780I7N (780-ball fineline bga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1M350F780I7N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1M350F780I7N ist geeignet für 6 Anwendungs: Stratix FPGA Configuration Storage, Telecommunications Line Card Boot, Industrial Vision and Image Processing, Military and Aerospace Signal Processing, Networking Infrastructure and Switching, Lab Prototyping and FPGA Development.
Stratix FPGA Configuration Storage
The EP1M350F780I7N is purpose-built for storing and delivering configuration bitstreams to Altera Stratix-series SRAM-based LUT FPGAs at power-up. Its flash array capacity and parallel configuration controller handle multi-Mbit bitstreams that smaller EPCS serial PROMs cannot accommodate. Placed on the board between the system supply and the target FPGA's configuration pins, it drives nCONFIG, DATA, DCLK, and CONF_DONE lines per the Stratix configuration interface. The industrial temperature range (-40C to +100C) and speed grade 7 make it suitable for telecom line cards and outdoor equipment where deterministic cold-start behavior matters.
Empfohlen
Telecommunications Line Card Boot
In telecom infrastructure such as ATCA line cards and base-station DSP modules, the EP1M350F780I7N stores multi-Mbit firmware images and delivers them to multiple high-density FPGAs at boot. Its parallel bus and JTAG interface simplify field updates through IEEE 1149.1 boundary-scan. The 780-ball BGA conserves board area versus legacy PLCC PROMs while supporting deterministic boot timing required by NEBS-compliant hardware. Engineers benefit from fast in-system reprogramming during commissioning without removing cards from the chassis.
Empfohlen
Industrial Vision and Image Processing
High-resolution machine-vision systems rely on multiple SRAM FPGAs for real-time image pipelines, and the EP1M350F780I7N provides centralized bitstream storage for all of them. With industrial temperature operation and CRC-validated bitstream loading, it ensures corruption-free boot in factory-floor environments with electrical noise and temperature swings. The parallel interface reduces configuration time versus serial PROMs, which is critical when vision systems must reboot quickly after ESD events or power cycling. JTAG support allows factory technicians to re-flash bitstreams without removing the board.
Empfohlen
Military and Aerospace Signal Processing
Defense signal-processing platforms use the EP1M350F780I7N to load bitstreams into radiation-tolerant SRAM FPGAs that require deterministic, in-system programmable configuration. Its industrial temperature range and BGA package support ruggedized enclosures, and JTAG programming allows secure field updates through controlled maintenance procedures. The flash-based storage eliminates mechanical failure modes present in legacy PROM sockets. Engineers value the part's long-term data retention and the ability to support multi-version bitstream storage for A/B failover during firmware deployment.
Empfohlen
Networking Infrastructure and Switching
Carrier-grade routers and switches often run multiple high-density FPGAs for packet processing and traffic management, and the EP1M350F780I7N serves as the centralized configuration source. Its 780-ball BGA exposes parallel bus pins that allow fast parallel load of multi-Mbit bitstreams, reducing system boot time. The CRC validation feature prevents corrupted bitstreams from locking up the system. Hot-standby controllers can swap active/passive FPGAs by re-triggering configuration through this device.
Empfohlen
Lab Prototyping and FPGA Development
FPGA development boards use the EP1M350F780I7N as a stand-alone configuration source so engineers can swap bitstreams without an external programmer. Its JTAG interface and on-board flash let users re-flash designs in seconds directly from Quartus, accelerating bring-up of complex multi-FPGA prototypes. The 780-ball BGA exposes status LEDs and reset signals that simplify debugging during bring-up. The Mercury PLD's compatibility with multiple Altera FPGA families makes it a flexible tool for academic and R&D labs.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1M350F780I7N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1M350F780C7N | EP1M350F780I6N | EP1M350F780C6N | EP1M350F780C7 | EP1M350F780I7 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 780-ball FineLine BGA | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same | 780-ball FineLine BGA - same |
| Speed Grade | 7 | 7 | 6 | 6 | 7 | 7 |
| Operating Temperature Range | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Device Family | Mercury PLD Enhanced Configuration Device | Mercury PLD Enhanced Configuration Device | Mercury PLD Enhanced Configuration Device | Mercury PLD Enhanced Configuration Device | Mercury PLD Enhanced Configuration Device | Mercury PLD Enhanced Configuration Device |
| Programming Interface | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1) |
| On-chip Memory | Flash array (Mercury PLD) | Flash array (Mercury PLD) | Flash array (Mercury PLD) | Flash array (Mercury PLD) | Flash array (Mercury PLD) | Flash array (Mercury PLD) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature range in the 780-ball BGA package (vs. EP1M350F780C7N)
- Higher speed grade than EP1M350F780I6N (vs. EP1M350F780I6N)
- Same Mercury PLD architecture as EPCQ-A successor (vs. EPCQ256)
Designhinweise
Estimated: The 780-ball FineLine BGA package requires a controlled-impedance PCB stack-up with matched trace lengths on the parallel data/address bus. BGA escape routing on inner layers should use microvia or laser-drilled vias to keep breakout fan-out under the BGA land pattern. Allocate at least 4 PCB layers for signal routing plus 2 layers for power/ground to maintain signal integrity on the configuration bus. Plan for X-ray inspection during assembly to verify BGA solder joint quality.
Place the EP1M350F780I7N within 50mm of the target FPGA's configuration pins to minimize propagation delay on DCLK and DATA lines. Add 4.7k ohm pull-up resistors on TMS, TCK, and TDI per IEEE 1149.1 recommendations, and route JTAG signals as a daisy-chain when multiple devices share the chain. Provide a dedicated test access port (TAP) connector on the board edge for boundary-scan programming.
Do not assume the EP1M350F780I7N is in active production - the Mercury PLD family has been declared obsolete by Altera/Intel FPGA. Verify bitstream size against the device's flash capacity before committing to this part; EPCQ-A configuration devices are recommended for new designs despite requiring PCB rework. When sourcing through independent distributors, verify date code authenticity and reject parts with inconsistent lot markings.
Compliance-Informationen
Compliance status not explicitly stated in the Verified Web Data for the EP1M350F780I7N. The 'N' suffix in legacy Altera part numbers historically denotes lead-free finish, but this cannot be confirmed without the official Altera Mercury PLD datasheet. Marked as [DATA_NEEDED] in specs[].