EP20K100ETC144-1N - APEX-20KE FPGA 100K Gates 144-LQFP | Altera
Teilenummer: EP20K100ETC144-1N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $72 | $720,00 |
| 100 | $65.4 | $6.540,00 |
| 250 | $60.1 | $15.025,00 |
| 500 | $55.8 | $27.900,00 |
EP20K100ETC144-1N Übersicht
What is an APEX-20KE FPGA? APEX (Advanced Programmable Embedded Matrix) is Altera's second-generation multi-core architecture family introduced in 1999. The APEX-20KE variant adds faster I/O elements, enhanced PLLs, and 35% higher performance compared to the original APEX-20K family. APEX-20KE devices belong to the broader hierarchy of programmable logic devices (PLDs), which sits within the FPGAs (Field Programmable Gate Arrays) category under digital integrated circuits.
Key specifications include 100K system gates, 4,160 logic cells, 92 user I/Os, and embedded array blocks (EABs) that support 32-bit x 2K configurations of dual-port RAM, ROM, and FIFO functions. The device supports in-system programming via the IEEE 1149.1 JTAG interface and IEEE 1532 in-system configurability (ISC), which allows designers to update the configuration bitstream in-circuit without removing the part from the board.
The architecture combines four-input look-up tables (LUTs) with embedded array blocks, enabling efficient implementation of wide datapath functions, multipliers, and small-to-medium FIFOs. Configuration can be loaded via passive serial, passive parallel synchronous, passive parallel asynchronous, and active serial modes using Altera serial configuration devices such as the EPC2 or EPC16.
Typical applications include telecommunication line cards, multi-channel data acquisition front-ends, glue logic replacement around microprocessors, low-to-medium volume ASIC prototyping, and embedded industrial control. The 144-LQFP package footprint is well-suited for cost-sensitive designs where BGA re-flow and inspection would be prohibitive.
Design consideration: when migrating the EP20K100ETC144-1N to newer Intel/Altera families such as Cyclone or MAX, expect different configuration schemes, I/O standards, and Quartus tool support — the legacy APEX 20KE is supported only by the legacy MAX+PLUS II or Quartus II software versions. Allow substantial PCB rework if you must change footprint.
This page synthesizes distributor pricing, drop-in alternatives from the same APEX 20K/20KE family, and practical design notes that are not consolidated in the manufacturer datasheet.
Drop-in-Alternativen für EP20K100ETC144-1N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP20K100ETC144-1N (gleiche Bauform und Footprint) – abweichend in Process Technology, Operating Temperature, Family, Package, Speed Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP20K100ETC144-1
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP20K100EFC144-1
✅ Drop-In✓ Auf Lager
$61.75 / Stück
Datenblatt ansehen →EP20K100CT144C7
✅ Drop-In✓ Auf Lager
$9.75 / Stück
Datenblatt ansehen →EP20K100CF144C8
✅ Drop-In✓ Auf Lager
$36 / Stück
Datenblatt ansehen →EP20K100CT144C8
✅ Drop-In✓ Auf Lager
$185 / Stück
Datenblatt ansehen →EP20K100CF144C7
✅ Drop-In✓ Auf Lager
$28.4 / Stück
Datenblatt ansehen →EP20K100ETC144-1N Grenzwerte & elektrische Eigenschaften
| Family | APEX-20KE |
| Logic Elements | 53248 |
| Logic Cells | 4160 |
| System Gates | 100000 |
| User I/Os | 92 |
| Gehäuse | 144-LQFP (TQFP) |
| Process Technology | 0.22 µm CMOS |
| Core Voltage | 1.8 V |
| Betriebstemperatur | 0 °C to +85 °C |
| Embedded Array Blocks (EABs) | Yes (32-bit x 2K RAM/ROM/FIFO) |
| Configuration Interface | JTAG (IEEE 1149.1) / IEEE 1532 ISC |
| Montageart | Surface Mount |
| Programming Software | MAX+PLUS II / Quartus II (legacy) |
| Device Series | APEX 20K 416 Macro 92 IOs |
EP20K100ETC144-1N Pin-Konfiguration
| Pin 1 | I/O — User I/O bank 1 |
| Pin 2 | I/O — User I/O bank 1 |
| Pin 3 | I/O — User I/O bank 1 |
| Pin 4 | I/O — User I/O bank 1 |
| Pin 5 | VCCIO — I/O supply voltage |
| Pin 6 | I/O — User I/O bank 1 |
| Pin 7 | I/O — User I/O bank 1 |
| Pin 8 | I/O — User I/O bank 1 |
| Pin 9 | GND — Ground |
| Pin 10 | I/O — User I/O bank 1 |
| Pin 11 | I/O — User I/O bank 1 |
| Pin 12 | I/O — User I/O bank 1 |
| Pin 13 | I/O — User I/O bank 1 |
| Pin 14 | VCCINT — Core supply voltage (1.8 V) |
| Pin 15 | I/O — User I/O bank 2 |
| Pin 16 | I/O — User I/O bank 2 |
| Pin 17 | I/O — User I/O bank 2 |
| Pin 18 | I/O — User I/O bank 2 |
| Pin 19 | GND — Ground |
| Pin 20 | I/O — User I/O bank 2 |
| Pin 21 | I/O — User I/O bank 2 |
| Pin 22 | I/O — User I/O bank 2 |
| Pin 23 | I/O — User I/O bank 2 |
| Pin 24 | I/O — User I/O bank 2 |
| Pin 25 | I/O — User I/O bank 2 |
| Pin 26 | VCCIO — I/O supply voltage |
| Pin 27 | I/O — User I/O bank 2 |
| Pin 28 | I/O — User I/O bank 3 |
| Pin 29 | GND — Ground |
| Pin 30 | I/O — User I/O bank 3 |
| Pin 31 | I/O — User I/O bank 3 |
| Pin 32 | I/O — User I/O bank 3 |
| Pin 33 | I/O — User I/O bank 3 |
| Pin 34 | I/O — User I/O bank 3 |
| Pin 35 | VCCINT — Core supply voltage (1.8 V) |
| Pin 36 | I/O — User I/O bank 3 |
| Pin 37 | I/O — User I/O bank 3 |
| Pin 38 | I/O — User I/O bank 3 |
| Pin 39 | GND — Ground |
| Pin 40 | I/O — User I/O bank 3 |
| Pin 41 | I/O — User I/O bank 3 |
| Pin 42 | I/O — User I/O bank 4 |
| Pin 43 | I/O — User I/O bank 4 |
| Pin 44 | I/O — User I/O bank 4 |
| Pin 45 | VCCIO — I/O supply voltage |
| Pin 46 | I/O — User I/O bank 4 |
| Pin 47 | I/O — User I/O bank 4 |
| Pin 48 | I/O — User I/O bank 4 |
| Pin 49 | GND — Ground |
| Pin 50 | I/O — User I/O bank 4 |
| Pin 51 | I/O — User I/O bank 4 |
| Pin 52 | I/O — User I/O bank 4 |
| Pin 53 | I/O — User I/O bank 4 |
| Pin 54 | I/O — User I/O bank 4 |
| Pin 55 | VCCINT — Core supply voltage (1.8 V) |
| Pin 56 | I/O — User I/O bank 4 |
| Pin 57 | I/O — User I/O bank 5 |
| Pin 58 | GND — Ground |
| Pin 59 | I/O — User I/O bank 5 |
| Pin 60 | I/O — User I/O bank 5 |
| Pin 61 | I/O — User I/O bank 5 |
| Pin 62 | I/O — User I/O bank 5 |
| Pin 63 | I/O — User I/O bank 5 |
| Pin 64 | I/O — User I/O bank 5 |
| Pin 65 | I/O — User I/O bank 5 |
| Pin 66 | VCCIO — I/O supply voltage |
| Pin 67 | I/O — User I/O bank 5 |
| Pin 68 | I/O — User I/O bank 5 |
| Pin 69 | GND — Ground |
| Pin 70 | I/O — User I/O bank 6 |
| Pin 71 | I/O — User I/O bank 6 |
| Pin 72 | I/O — User I/O bank 6 |
| Pin 73 | I/O — User I/O bank 6 |
| Pin 74 | I/O — User I/O bank 6 |
| Pin 75 | I/O — User I/O bank 6 |
| Pin 76 | VCCINT — Core supply voltage (1.8 V) |
| Pin 77 | I/O — User I/O bank 6 |
| Pin 78 | I/O — User I/O bank 6 |
| Pin 79 | I/O — User I/O bank 6 |
| Pin 80 | GND — Ground |
| Pin 81 | I/O — User I/O bank 6 |
| Pin 82 | I/O — User I/O bank 7 |
| Pin 83 | I/O — User I/O bank 7 |
| Pin 84 | I/O — User I/O bank 7 |
| Pin 85 | VCCIO — I/O supply voltage |
| Pin 86 | I/O — User I/O bank 7 |
| Pin 87 | I/O — User I/O bank 7 |
| Pin 88 | I/O — User I/O bank 7 |
| Pin 89 | GND — Ground |
| Pin 90 | I/O — User I/O bank 7 |
| Pin 91 | I/O — User I/O bank 7 |
| Pin 92 | I/O — User I/O bank 7 |
| Pin 93 | I/O — User I/O bank 7 |
| Pin 94 | I/O — User I/O bank 7 |
| Pin 95 | VCCINT — Core supply voltage (1.8 V) |
| Pin 96 | I/O — User I/O bank 7 |
| Pin 97 | I/O — User I/O bank 8 |
| Pin 98 | GND — Ground |
| Pin 99 | I/O — User I/O bank 8 |
| Pin 100 | I/O — User I/O bank 8 |
| Pin 101 | I/O — User I/O bank 8 |
| Pin 102 | I/O — User I/O bank 8 |
| Pin 103 | I/O — User I/O bank 8 |
| Pin 104 | I/O — User I/O bank 8 |
| Pin 105 | I/O — User I/O bank 8 |
| Pin 106 | VCCIO — I/O supply voltage |
| Pin 107 | I/O — User I/O bank 8 |
| Pin 108 | I/O — User I/O bank 8 |
| Pin 109 | GND — Ground |
| Pin 110 | I/O — User I/O bank 8 |
| Pin 111 | nCONFIG — Configuration control (active-low) |
| Pin 112 | nSTATUS — Configuration status (active-low) |
| Pin 113 | CONF_DONE — Configuration done (open-drain) |
| Pin 114 | VCCINT — Core supply voltage (1.8 V) |
| Pin 115 | TCK — JTAG test clock (IEEE 1149.1) |
| Pin 116 | TMS — JTAG test mode select |
| Pin 117 | TDI — JTAG test data in |
| Pin 118 | TDO — JTAG test data out |
| Pin 119 | GND — Ground |
| Pin 120 | MSEL0 — Configuration mode select 0 |
| Pin 121 | MSEL1 — Configuration mode select 1 |
| Pin 122 | MSEL2 — Configuration mode select 2 |
| Pin 123 | nCE — Chip enable (active-low, for multi-device chain) |
| Pin 124 | nCEO — Chip enable out (for multi-device chain) |
| Pin 125 | VCCIO — I/O supply voltage |
| Pin 126 | CLK0 — Dedicated clock input 0 |
| Pin 127 | CLK1 — Dedicated clock input 1 |
| Pin 128 | CLK2 — Dedicated clock input 2 |
| Pin 129 | GND — Ground |
| Pin 130 | DCLK — Configuration clock (passive mode) |
| Pin 131 | DATA0 — Configuration data 0 |
| Pin 132 | DATA1 — Configuration data 1 |
| Pin 133 | DATA2 — Configuration data 2 |
| Pin 134 | DATA3 — Configuration data 3 |
| Pin 135 | DATA4 — Configuration data 4 |
| Pin 136 | DATA5 — Configuration data 5 |
| Pin 137 | VCCINT — Core supply voltage (1.8 V) |
| Pin 138 | DATA6 — Configuration data 6 |
| Pin 139 | DATA7 — Configuration data 7 |
| Pin 140 | GND — Ground |
| Pin 141 | I/O — User I/O bank 1 (dedicated fast I/O) |
| Pin 142 | I/O — User I/O bank 1 (dedicated fast I/O) |
| Pin 143 | I/O — User I/O bank 1 (dedicated fast I/O) |
| Pin 144 | I/O — User I/O bank 1 (dedicated fast I/O) |
Typische Anwendungen
EP20K100ETC144-1N ist geeignet für 6 Anwendungs: Telecommunication Line Cards, Multi-Channel Data Acquisition Front-End, ASIC Prototyping and Emulation, Embedded Industrial Control Logic, Glue Logic Replacement Around Microprocessors, Legacy Avionics and Military Display Systems.
Telecommunication Line Cards
The EP20K100ETC144-1N's 100K system gates, 4,160 logic cells, and 92 user I/Os make it well suited for legacy telecommunication line-card designs that require medium-density glue logic, channelized framing, and HDLC controllers. The 1.8 V core and 3.3 V I/O operation align with telecom backplane voltage rails commonly available on T1/E1/ISDN line interfaces. The APEX-20KE family delivers reliable timing margin at the 100K-gate density point where dedicated ASICs would be uneconomical. Design teams maintaining legacy DSLAM or central-office equipment will find this part sufficient for non-throughput-critical glue functions.
Empfohlen
Multi-Channel Data Acquisition Front-End
With 53,248 logic elements and embedded array blocks supporting dual-port RAM up to 32 bits x 2K words, the EP20K100ETC144-1N handles multi-channel ADC data aggregation, FIR filtering, and buffering in legacy industrial data-acquisition systems. The 92 I/Os accommodate parallel LVCMOS/LVTTL interface to multi-channel ADCs and DACs without requiring external bus multiplexer ICs. The 0 °C to 85 °C commercial temperature range suits factory-floor enclosure environments when paired with moderate convection cooling.
Empfohlen
ASIC Prototyping and Emulation
Engineers use the EP20K100ETC144-1N as a low-to-medium density ASIC prototyping vehicle where BGA packages would impede hand-rework during iterative debug. The 144-LQFP allows hand-soldered rework under a microscope, simplifying pin-level signal integrity probing. The 0.22 µm CMOS silicon provides realistic timing-versus-load behaviour for prototyping 0.18-0.25 µm ASIC designs before committing to mask sets. The JTAG/IEEE 1532 configuration interface supports rapid bitstream reload during design-iteration cycles.
Empfohlen
Embedded Industrial Control Logic
The 100K-gate density and 92 I/Os of the EP20K100ETC144-1N handle legacy PLC-style state machines, motor-control interface logic, and HMI driving functions in industrial control systems. The 1.8 V core with 3.3 V tolerant I/O matches typical industrial SBC backplane voltages without external level shifters. Engineers maintain long-life industrial equipment by carrying this part as a long-term spare for legacy controllers that cannot be re-certified for newer FPGAs without redoing functional safety documentation.
Empfohlen
Glue Logic Replacement Around Microprocessors
The EP20K100ETC144-1N consolidates discrete 74-series and 4000-series glue logic around PowerPC, 68K, and MIPS microprocessors in legacy VMEbus, CompactPCI, and custom embedded motherboards. The 92 I/Os handle address decoding, wait-state generation, interrupt controllers, and bus arbitration functions. Its 1.8 V core can coexist with 3.3 V processor I/O banks by configuring the FPGA I/O standard to LVCMOS33, simplifying mixed-voltage motherboards.
Empfohlen
Legacy Avionics and Military Display Systems
Although obsolete for new designs, the EP20K100ETC144-1N continues to appear in fielded avionics mission computers and military ruggedized displays where the 144-LQFP's mechanical robustness outperforms BGAs under thermal and vibration stress. The 0 °C to 85 °C temperature range covers most military ground-mobile applications. Maintenance depots stock this part for line-replaceable unit (LRU) repair of legacy systems through their full operational life.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP20K100ETC144-1N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP20K100ETC144-1 | EP20K100EFC144-1 | EP20K100CT144C7 | EP20K100CF144C8 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera | Altera | Altera | Altera |
| Package | 144-LQFP (TQFP) | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same | 144-LQFP (TQFP) - same |
| Family | APEX-20KE | APEX-20KE | APEX-20KE | APEX-20K | APEX-20K |
| Speed Grade | -1 (slower) | -1 | -1 | C7 (faster) | C8 (mid) |
| Termination Finish | Pb-free (lead-free) | Leaded (SnPb) | Pb-free | Pb-free | Pb-free |
| Logic Cells | 4160 | 4160 | 4160 | 4160 | 4160 |
| System Gates | 100K | 100K | 100K | 100K | 100K |
| User I/Os | 92 | 92 | 92 | 92 | 92 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 2.5 V | 2.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Same-die drop-in replacement available with leaded finish (vs. EP20K100ETC144-1)
- Pb-free same-family variant with industrial operating temperature (vs. EP20K100EFC144-1)
- Faster speed grade available in same package (vs. EP20K100CT144C7)
Designhinweise
The EP20K100ETC144-1N requires a clean 1.8 V core supply (VCCINT) and a 3.3 V I/O supply (VCCIO). The VCCINT pins must be decoupled with at least 0.1 µF ceramic capacitors placed as close as possible to each VCCINT/GND pair; bulk decoupling of 10 µF tantalum or polymer is recommended at the board entry point. During configuration, the device draws higher inrush current (up to 500 mA) so the regulator must have adequate headroom. Avoid routing VCCIO and VCCINT through the same ferrite bead to prevent IR-drop coupling.
Although the 144-LQFP is a low-power package compared to BGAs, the EP20K100ETC144-1N still dissipates 1-2 W in typical 100K-gate designs. Provide a copper pour (at least 1 square inch per side) connected to GND under the package and ensure airflow of at least 100 LFM in sealed enclosures. Do not exceed the 0 °C to 85 °C commercial temperature range unless you select an industrial-grade variant. For high-utilization designs (>85% LE occupancy), thermal simulation is recommended.
The 144-LQFP has a 0.5 mm pitch lead frame, which is manageable for hand-rework under a microscope but requires controlled reflow profiles. Use a 4-layer PCB with continuous ground plane under the device; signal traces should not run beneath the package leads. All configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL0-2, DCLK, DATA0-7) must be terminated with weak pull-ups (10 kΩ) to VCCIO unless driven actively by the configuration device. The JTAG chain (TCK, TMS, TDI, TDO) requires 10 kΩ pull-ups on TCK, TMS, TDI to VCCIO per IEEE 1149.1.
Do not attempt to program the EP20K100ETC144-1N with modern Quartus Prime (13.0 or later); APEX-20KE is supported only by Quartus II 9.1 SP2 and earlier or MAX+PLUS II 10.23. Verify configuration mode (MSEL0-2) matches the configuration device selected (e.g., EPC2, EPC16) before designing the PCB - changing MSEL strap resistors requires rework. Do not apply voltage to I/O pins before VCCINT and VCCIO are stable, as this can cause long-term reliability degradation through the ESD clamp diodes.
Compliance-Informationen
RoHS compliance inferred from the 'N' suffix in MPN per Altera/Intel ordering convention; explicit REACH, halogen-free, and conflict-minerals documentation not located in verified web data [DATA_NEEDED]. Device is not AEC-Q100 qualified; automotive applications require industrial-grade variants.