EP20K200BC484-2X - APEX-20K FPGA 8320 LE, 382 I/O, 484-BBGA | Intel
Teilenummer: EP20K200BC484-2X ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132.5 | $1.325,00 |
| 100 | $118 | $11.800,00 |
| 500 | $105 | $52.500,00 |
| 1.000 | $95 | $95.000,00 |
EP20K200BC484-2X Übersicht
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines the high density of gate-array ASICs with the design flexibility of programmable logic. FPGAs occupy the upper end of the programmable-logic hierarchy: PLD -> CPLD -> FPGA -> SoC FPGA, sitting between simple glue-logic chips and full system-on-chip devices. APEX-20K devices were Altera's first multi-core, embedded-block FPGA architecture, embedding memory and I/O blocks alongside the logic fabric to deliver higher integration than earlier families.
Key features of the EP20K200BC484-2X include the APEX-20K MultiCore™ architecture combining Look-Up Table (LUT) logic with embedded memory blocks, in-system programmability via SRAM configuration cells, and 382 dedicated I/O pins supporting multiple I/O standards. The device operates from a 2.5 V core supply (2.375 V – 2.625 V) with separate VCCIO banks for I/O standard compatibility. The 484-ball BGA package provides high pin density for I/O-rich designs and supports 4 dedicated global clock / control inputs in addition to the 382 user I/Os.
The EP20K200BC484-2X uses a SRAM-based configuration cell architecture, meaning the device must be configured on every power-up from an external configuration memory (typically an EPC configuration device or a microcontroller). Its MultiCore fabric combines embedded system blocks (ESBs) for memory and arithmetic with LABs for general logic, giving designers a balance of register-rich and memory-rich resources in a single die.
Typical applications include telecommunications line cards, video and image processing pipelines, industrial control logic, high-speed glue logic between microprocessors and peripherals, and prototyping for ASIC development. The wide I/O count (382 pins) makes it well suited to bus-intensive designs where many parallel interfaces must be terminated on-chip.
When designing with this device, note that the APEX-20K family is mature legacy silicon; production status varies by speed grade and package, and a confirmed lifecycle check via Intel's Product Discontinuance notifications is recommended for new designs. Designers should verify configuration memory compatibility and supply ramp sequencing to avoid partial-configuration failures on cold start.
Drop-in-Alternativen für EP20K200BC484-2X – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP20K200BC484-2X (gleiche Bauform und Footprint) – abweichend in Speed Grade, Series, Family, Operating Temperature, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP20K200BC484-1X
✅ Drop-In✓ Auf Lager
$75.1 / Stück
Datenblatt ansehen →EP20K200BC484-2
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
EP20K200BC484-3
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
EP20K200EBC484-2X
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
EP20K200BC484-2X Grenzwerte & elektrische Eigenschaften
| Family | APEX-20K |
| Series | EP20K200 |
| Logic Elements | 8,320 |
| LABs/CLBs | 832 |
| Embedded RAM | 106,496 bits |
| User I/O Pins | 382 |
| Dedicated Inputs | 4 |
| Supply Voltage (VCCINT) | 2.375 V to 2.625 V |
| Betriebs-Sperrschichttemperatur | 0 °C to 85 °C |
| Gehäuse | 484-ball PBGA (BBGA-484) |
| Montageart | Surface Mount |
| Architecture | MultiCore™ (LUT + Embedded System Blocks) |
| Configuration | SRAM-based (requires external configuration memory) |
| Speed Grade | -2X |
| RoHS-Status | Compliant (per supplier listings) |
| Maximum Clock Frequency (reference) | 178.57 MHz (per Altera datasheet for family) |
EP20K200BC484-2X 484-ball pbga (bbga-484) Pinbelegungsleitfaden
Pinbelegung für EP20K200BC484-2X (484-ball pbga (bbga-484)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP20K200BC484-2X.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP20K200BC484-2X ist geeignet für 6 Anwendungs: Telecommunications Line Cards, Video and Image Processing Pipelines, Industrial Control Logic and Machine Interfaces, ASIC Prototyping and Emulation, High-Speed Glue Logic Between Microprocessors and Peripherals, Legacy Military and Avionics Retrofit Systems.
Telecommunications Line Cards
The EP20K200BC484-2X's 382 user I/O pins and 106,496-bit embedded RAM make it well-suited for legacy telecom line-card designs. The APEX-20K MultiCore fabric supports high-fanout bus aggregation across TDM backplanes, and 8,320 LEs allow protocol-conversion glue logic. Designers route LVTTL/LVCMOS I/O through VCCIO banks at 3.3 V to interface legacy bus transceivers; the 484-ball PBGA's 27x27 mm footprint delivers high pin density for 32+ channel serial backplane designs.
Empfohlen
Video and Image Processing Pipelines
The EP20K200BC484-2X's 106,496-bit embedded RAM (distributed across ESB/MegaLAB memory blocks) provides line-buffer and pixel-history storage for video processing pipelines. Its 8,320 LEs handle real-time pixel arithmetic at moderate resolutions. The 382 I/Os connect to external SDRAM controllers and parallel video DACs; the 484-ball BGA simplifies break-out of 16-32-bit wide video buses, and the 2.5 V core supply allows compatibility with 3.3 V video ADC/DAC devices through dedicated VCCIO banks.
Empfohlen
Industrial Control Logic and Machine Interfaces
The EP20K200BC484-2X fits mid-complexity industrial PLC and machine-control logic where deterministic parallel I/O handling matters. Its 382 I/O pins aggregate multi-axis motor-control signals, encoder feedback, and sensor arrays; the 8,320 LEs execute state machines and PID controllers. The 0 °C to 85 °C operating junction range covers factory-floor enclosures. Designers leverage the 484-ball PBGA's high pin density to consolidate what would otherwise require two or three CPLDs onto a single FPGA.
Empfohlen
ASIC Prototyping and Emulation
The EP20K200BC484-2X is widely used for ASIC prototyping and architectural emulation because its 8,320 LEs and 832 LABs map cleanly to gate-level netlists of moderate-complexity ASICs. The 106,496-bit embedded RAM allows designers to emulate SRAM blocks within the FPGA fabric, and 382 I/Os support prototype-break-out to external ASIC pin pads. The -2X speed grade provides adequate timing margin for synchronous ASIC emulation at sub-100 MHz. Configuration time is seconds via JTAG or passive serial.
Empfohlen
High-Speed Glue Logic Between Microprocessors and Peripherals
The EP20K200BC484-2X bridges microprocessors/microcontrollers with high-bandwidth peripherals such as DDR memory controllers, custom DMA engines, and parallel DSP clusters. Its 8,320 LEs deliver register-rich custom-bus protocols and FIFOs, while the 106,496-bit embedded RAM implements dual-clock FIFO buffers between async processor and peripheral domains. The 382 I/O pins comfortably route 32-bit wide data buses plus address, control, and status signals on a single FPGA, eliminating multiple CPLDs.
Empfohlen
Legacy Military and Avionics Retrofit Systems
The EP20K200BC484-2X supports long-life-cycle military and avionics retrofit systems where fielded equipment must be supported for decades. Although Intel lists the part NRND for new designs, the APEX-20K family continues to ship through authorized distributors for ongoing defense and aerospace maintenance programs. The 484-ball PBGA's robust mechanical construction withstands vibration environments, and the 8,320 LEs allow functional replacement of multiple obsolete ASICs with a single modern-equivalent FPGA design.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP20K200BC484-2X – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP20K200BC484-1X | EP20K200BC484-2 | EP20K200BC484-3 | EP20K200EBC484-2X |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 484-ball PBGA (BBGA-484) | 484-ball PBGA (BBGA-484) - same | 484-ball PBGA (BBGA-484) - same | 484-ball PBGA (BBGA-484) - same | 484-ball PBGA (BBGA-484) - same |
| Logic Elements | 8,320 | 8,320 | 8,320 | 8,320 | 8,320 |
| LABs/CLBs | 832 | 832 | 832 | 832 | 832 |
| Embedded RAM | 106,496 bits | 106,496 bits | 106,496 bits | 106,496 bits | 106,496 bits |
| User I/O Pins | 382 | 382 | 382 | 382 | 382 |
| Speed Grade | -2X | -1X (one bin slower) | -2 (one step slower than -2X) | -3 (slowest bin) | -2X (matched) |
| Supply Voltage | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V | 2.375 V to 2.625 V |
| Operating Temperature | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C |
| Drop-In Compatible | Reference part | Yes (slower speed grade) | Yes (slower speed grade) | Yes (slowest speed grade) | Yes (enhanced feature set) |
Wichtigste Unterscheidungsmerkmale
- Highest available logic capacity in the APEX-20K family in 484-ball BGA (vs. EP20K100FC484-3)
- Highest speed grade in 484-ball BGA at this logic density (vs. EP20K200BC484-1X)
- Maximum I/O density for bus-intensive applications (vs. EP20K200BC356-3)
Designhinweise
The EP20K200BC484-2X requires a tightly regulated 2.5 V core supply within 2.375 V to 2.625 V; design the regulator with at least 10% headroom above worst-case ICC. VCCINT and VCCIO banks must ramp together within the datasheet-specified sequence to avoid partial-configuration latch-up. Use bulk decoupling (47 µF to 100 µF tantalum or polymer) near the BGA plus 0.1 µF and 1 µF ceramic capacitors distributed under the package footprint.
Estimated: at maximum toggle rate and 100% I/O switching, the EP20K200 in 484-ball PBGA dissipates ~2-3 W steady-state. The 27x27 mm BGA's thermal resistance (theta_JA) is approximately 15 C/W with a 4-layer JEDEC board, so junction rise above ambient is 30-45 C. Provide a thermal pad array under the BGA's center ground balls and stitch vias on the inner layers to keep the die below 85 °C at the upper end of the commercial temperature range.
The 484-ball PBGA requires a 4-layer minimum PCB with microvia-in-pad or laser-drilled vias on inner pads. Route the 382 user I/Os through at least two breakout layers; critical high-speed buses should escape directly under the BGA on the top layer with the remaining I/Os breaking out on layer 3. Match clock-pair lengths within ±50 mils and isolate global clock traces from asynchronous I/O to avoid crosstalk. Reserve one inner ground plane adjacent to the signal layers for return-path integrity.
Configuration failure is the most common APEX-20K board-bring-up issue. Ensure nSTATUS, CONF_DONE, and nCONFIG pull-ups are correctly sized (typically 10 kΩ) and verify configuration clock frequency stays within the 10-66 MHz range for passive-serial mode. A missing or mis-programmed EPC configuration device will leave all I/Os tri-stated; always validate the bitstream CRC before declaring the device functional. For JTAG programming, ensure TDI/TDO chain integrity on the board before connecting the USB-Blaster.
Compliance-Informationen
RoHS compliance per supplier listings (MicrochipUSA, DigiKey, Alibaba). AEC-Q100 is not applicable — FPGAs are not automotive-qualified logic ICs in this legacy family. Halogen-free status and conflict-minerals reporting not stated explicitly in the verified supplier data.
