EP20K400BC652-1XV - 400K APEX-20K FPGA, 502 I/O, 652-BGA | Intel / Altera
Teilenummer: EP20K400BC652-1XV ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $165 | $1.650,00 |
| 100 | $142 | $14.200,00 |
| 500 | $128 | $64.000,00 |
| 1.000 | $115 | $115.000,00 |
EP20K400BC652-1XV Übersicht
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a type of integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can reconfigure after manufacturing. FPGAs sit above CPLDs and ASICs in the programmable logic hierarchy, offering higher density, finer timing control, and embedded memory blocks. The APEX-20K family specifically introduced MultiCore architecture, combining look-up-table (LUT) logic with embedded product-term blocks and dual-port RAM in a single fabric - a precursor to modern heterogeneous SoC FPGAs.
Key features of the EP20K400BC652-1XV include MultiCore architecture with embedded memory, FastTrack interconnect for predictable timing, 2.5 V core supply, propagation delay of approximately 2.5 ns, and an operating junction temperature range of 0°C to 85°C. The device supports in-system programmability via the IEEE 1149.1 JTAG interface and IEEE 1532 configuration, allowing rapid prototyping and field upgrades.
Technically, the EP20K400BC652-1XV uses a 0.22 µm CMOS process and is positioned in the mid-density tier of the APEX-20K series, between the EP20K200 and EP20K600 variants. The 'BC' package code denotes a LBGA-652 footprint, the '1' suffix indicates speed grade -1, and the 'XV' suffix denotes industrial commercial temperature range with lead-free / RoHS-compliant ball finish.
Typical applications include telecommunications infrastructure, high-speed data acquisition, ASIC prototyping, and embedded computing platforms requiring mid-range logic density. The 502 I/O count supports wide parallel buses, multiple memory interfaces, and multi-channel datapaths in a single device.
When designing with the EP20K400BC652-1XV, ensure your power delivery network provides clean 2.5 V with adequate bulk decoupling. Note that this part is now classified as mature/legacy by Intel; consult PCN/PDN notices before committing to long-life-cycle designs.
This page synthesizes distributor pricing, drop-in APEX-20K family alternatives, and practical design notes not found in the standalone datasheet.
Drop-in-Alternativen für EP20K400BC652-1XV – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP20K400BC652-1XV (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, Speed Grade, Series, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP20K400BC652-1X
✅ Drop-In✓ Auf Lager
$140 / Stück
Datenblatt ansehen →EP20K400BC652-1V
✅ Drop-In✓ Auf Lager
$47.95 / Stück
Datenblatt ansehen →EP20K400BC652-1
✅ Drop-In✓ Auf Lager
$108 / Stück
Datenblatt ansehen →EP20K400BC652-2V
✅ Drop-In✓ Auf Lager
$260 / Stück
Datenblatt ansehen →EP20K400BC652-1XV Grenzwerte & elektrische Eigenschaften
| Series | APEX-20K |
| Family | APEX-20K Field Programmable Gate Array |
| Number of Logic Elements / Cells | 16640 |
| Number of LABs / CLBs | 1664 |
| Total RAM Bits | 212992 |
| Number of Gates | 1052000 |
| Number of User I/O | 502 |
| Propagation Delay | 2.5 ns |
| Betriebsversorgungsspannung | 2.375 V to 2.625 V (nominal 2.5 V) |
| Logic Family | CMOS |
| Technology Node | 0.22 µm |
| Betriebstemperaturbereich | 0°C to 85°C (TJ) |
| Gehäuse | 652-LBGA (BGA-652) |
| Montageart | Surface Mount |
| Package Code | LBGA, square, ball terminals |
EP20K400BC652-1XV lbga, square, ball terminals Pinbelegungsleitfaden
Pinbelegung für EP20K400BC652-1XV (lbga, square, ball terminals-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP20K400BC652-1XV.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP20K400BC652-1XV ist geeignet für 6 Anwendungs: Telecommunications Infrastructure, ASIC Prototyping and Emulation, High-Speed Data Acquisition Systems, Industrial Control and Factory Automation, Embedded Computing Platforms, Legacy System Sustainment and MRO.
Telecommunications Infrastructure
The EP20K400BC652-1XV's 1,052,000 system gates and 502 user I/Os make it well-suited for telecom line-card and backplane applications. Its MultiCore architecture combines LUT logic with embedded product-term blocks, enabling designers to implement complex glue logic, ATM/SONET framers, and protocol converters in a single device. The 212,992 bits of embedded RAM provide packet buffers and lookup tables without consuming logic resources. The 2.5 ns propagation delay supports moderate-speed datapaths typical of T1/E1, Fast Ethernet, and HDLC controllers. Note: for new designs, consider the Cyclone series as the modern Intel FPGA replacement.
Empfohlen
ASIC Prototyping and Emulation
Engineers historically used the EP20K400BC652-1XV to prototype and emulate mid-complexity ASIC designs before tape-out. With 16,640 logic elements and 502 I/Os, the device maps to large RTL blocks while preserving timing visibility. The JTAG (IEEE 1149.1) interface supports boundary-scan and real-time in-circuit emulation. The 652-BGA package exposes enough I/O for parallel multi-bus ASIC prototyping, including memory interfaces, processor buses, and peripheral controllers. Designers should budget 2-3× the final ASIC gate count when sizing the FPGA.
Empfohlen
High-Speed Data Acquisition Systems
The EP20K400BC652-1XV suits multi-channel data acquisition front-ends where 502 user I/Os support parallel ADC interfaces, timing controls, and downstream DSP links. The embedded RAM (212,992 bits) functions as a FIFO or sample buffer, reducing the need for external SRAM. The 0.22 µm CMOS fabric delivers deterministic timing via the FastTrack interconnect, critical when synchronizing multiple ADC channels. For designs requiring >50 MSPS per channel, pair the FPGA with dedicated ADC front-ends and use the 502 I/Os to fan out LVDS data streams.
Empfohlen
Industrial Control and Factory Automation
Industrial PLCs, motion controllers, and machine-vision pre-processors benefit from the EP20K400BC652-1XV's high I/O count and embedded memory. The device can host multiple soft processor cores (NIOS-equivalent) alongside custom glue logic in a MultiCore partition. Its 502 I/Os handle quadrature encoders, PWM outputs, isolated digital inputs, and fieldbus interfaces (Profibus, DeviceNet, CAN) in parallel. The 0-85°C commercial temperature range covers most factory-floor enclosures; for outdoor or sub-zero deployments, an industrial-grade variant would be required.
Empfohlen
Embedded Computing Platforms
Embedded systems integrating custom I/O, memory controllers, and peripheral logic can leverage the EP20K400BC652-1XV's combination of 16,640 logic elements and 212,992 bits of embedded RAM. Designers implement SDRAM controllers, PCI bridges, and DMA engines in the LUT fabric while reserving embedded RAM for descriptor tables and small FIFOs. The 652-BGA package supports compact board layouts and exposes 502 I/Os for external buses, GPIO banks, and high-speed serial bit-banging. The 'XV' suffix indicates lead-free RoHS-compliant ball finish.
Empfohlen
Legacy System Sustainment and MRO
Maintenance, Repair, and Operations (MRO) organizations sustain long-life industrial, military, and aerospace systems originally designed around the EP20K400BC652-1XV. Because the APEX-20K family has been discontinued, franchised distributors like Rochester Electronics and Micro-Semiconductor hold factory-traceable stock for repair purposes. Engineers performing field replacements should verify lot/date codes and ball-finish compatibility with the original board. The 652-BGA footprint is also produced under related APEX-20K speed-grade and temperature suffixes, easing obsolescence management.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP20K400BC652-1XV – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP20K400BC652-1X | EP20K400BC652-1V | EP20K400BC652-1 | EP20K400BC652-2V |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 652-LBGA | 652-LBGA (same) | 652-LBGA (same) | 652-LBGA (same) | 652-LBGA (same) |
| Number of Gates | 1,052,000 | 1,052,000 | 1,052,000 | 1,052,000 | 1,052,000 |
| Logic Elements / Cells | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 |
| Number of User I/O | 502 | 502 | 502 | 502 | 502 |
| Total RAM Bits | 212,992 | 212,992 | 212,992 | 212,992 | 212,992 |
| Speed Grade | -1 (slower) | -1 | -1 | -1 | -2 (faster) |
| Operating Temperature | 0°C to 85°C (TJ) | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C |
| Lifecycle Status | Obsolete / Last-time-buy | Obsolete | Obsolete | Obsolete | Obsolete |
Wichtigste Unterscheidungsmerkmale
- Speed-grade flexibility within the same footprint (vs. EP20K400BC652-2V)
- Industrial temperature option in identical footprint (vs. EP20K400BC652-1X)
- Highest I/O count in the APEX-20K 400K series (vs. EP20K400FC672-1X)
Designhinweise
The EP20K400BC652-1XV requires a clean 2.5 V core supply (2.375 V to 2.625 V) plus an auxiliary 1.8 V rail for configuration and JTAG logic. Place 10 µF bulk tantalum and 0.1 µF ceramic decoupling capacitors near each power pin; the 652-BGA package has multiple VCCINT/VCCIO pin groups that must all be energized. Inrush current during configuration can peak at several hundred milliamps - size the regulator with adequate headroom.
Estimated: at maximum toggle activity (~80% of logic elements switching at 100 MHz), the EP20K400BC652-1XV dissipates approximately 3-5 W. The 652-LBGA package has limited heat dissipation; provide a thermal pad or copper pour on the PCB top layer connected to the central ball grid. For enclosed industrial enclosures, derate by 30% above 70°C ambient. Forced-air cooling is recommended above 4 W dissipation.
The 652-ball LBGA has a fine 1.27 mm pitch - use NSMD (non-solder mask defined) pads with via-in-pad or microvia technology for reliable assembly. Per IPC-7351, follow the Altera/Intel APEX-20K package footprint guidelines for ball diameter and mask openings. Signal traces on inner layers should escape at 45° angles between BGA rows; outer-layer escape uses 4-mil trace-and-space where possible.
Do not confuse the EP20K400BC652-1XV (652-BGA) with the EP20K400FC672-1X (672-BGA) - they are functionally similar but NOT pin-compatible. Verify the exact package suffix before PCB layout; a swapped footprint will require a full respin. Also note that the APEX-20K family uses a legacy configuration scheme; modern Intel FPGAs (Cyclone, Stratix) require the Quartus Prime toolchain, not the older MAX+PLUS II software.
Compliance-Informationen
RoHS compliance inferred from 'XV' suffix designation (lead-free ball finish) per Altera/Intel product naming conventions; halogen-free status not explicitly confirmed in verified web data.
