EP2A15B652C8 - Altera APEX II FPGA, 15K LE, 652-BGA | Intel
Teilenummer: EP2A15B652C8 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132.5 | $1.325,00 |
| 100 | $119 | $11.900,00 |
| 500 | $108.75 | $54.375,00 |
| 1.000 | $99.5 | $99.500,00 |
EP2A15B652C8 Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor IC containing configurable logic blocks (CLBs), programmable interconnect, and I/O cells that engineers can reconfigure in the field to implement arbitrary digital circuits. FPGAs occupy a unique tier between fixed-function ASICs and software-driven microcontrollers: they offer hardware-level parallelism and deterministic timing while remaining fully reprogrammable. Within the broader taxonomy, the APEX II sits as a high-density programmable logic device under the umbrella of PLDs (programmable logic devices) -> programmable logic -> semiconductor ICs. The APEX II family was specifically engineered for data-path-intensive applications such as telecommunications bridging, video processing, and high-speed networking line cards.
Key features include embedded dual-port RAM with True Dual-Port modes, support for up to 1.875 Mbits of internal memory, multi-level routing resources optimized for datapath routing, and 4-phase on-chip PLLs for clock management. The EP2A15B652C8 supports 16 hot-socketing-friendly I/O banks with MultiVolt I/O technology, allowing 1.5V, 1.8V, 2.5V, 3.3V, and 5V interfacing on a single device. Its high pin count makes it well-suited for bus-intensive designs requiring wide parallel datapaths.
Typical applications include telecom line cards, SONET/SDH framers, ATM switches, high-speed video processing, and ASIC prototyping. The combination of high logic density, embedded memory, and MultiVolt I/O made APEX II a popular choice for bridging and routing applications in early-2000s telecommunications infrastructure.
When designing with the EP2A15B652C8, plan thermal management around the BGA-652 substrate and follow Altera's recommended decoupling scheme (typically 0.1 µF and 10 µF capacitors near each VCCIO/VCCINT ball group). Configuration via JTAG or passive serial with a 1.5V PROM is the standard bring-up path for production hardware.
This page consolidates distributor stock and pricing data, drop-in alternatives, and practical design notes not collected in any single datasheet, accelerating your sourcing and bring-up decisions for legacy APEX II designs.
Drop-in-Alternativen für EP2A15B652C8 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP2A15B652C8 (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Logic Elements, Process Technology, Package, Speed Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP2A25B652C8
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$198 / Stück
Datenblatt ansehen →EP2A40B652C8
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$94.3 / Stück
Datenblatt ansehen →EP2A15B652C7
✅ Drop-In✓ Auf Lager
$82.4 / Stück
Datenblatt ansehen →EP2A15B652C6
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
EP2A15B652I8
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
EP2A15F672C8
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
EP2A15B652C8 Grenzwerte & elektrische Eigenschaften
| Family | APEX II |
| Logic Elements | 15,600 |
| Maximum User I/O | 425 |
| Embedded System Blocks (ESB) | 104 |
| Maximum Internal RAM Bits | 1,875,000 |
| Embedded Dual-Port RAM | Yes (True Dual-Port) |
| Maximum PLLs | 4 |
| Core Voltage (VCCINT) | 1.5 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Process Technology | 0.15 µm CMOS |
| Gehäuse | 652-ball FineLine BGA |
| Montageart | Surface Mount (BGA) |
| Betriebstemperatur | 0C to +85C (commercial) |
| Speed Grade | C8 |
EP2A15B652C8 652-ball fineline bga Pinbelegungsleitfaden
Pinbelegung für EP2A15B652C8 (652-ball fineline bga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP2A15B652C8.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP2A15B652C8 ist geeignet für 6 Anwendungs: Telecom Line Cards, SONET/SDH Framers, ATM Switch Fabrics, High-Speed Video Processing, ASIC Prototyping, Industrial Networking Bridges.
Telecom Line Cards
The EP2A15B652C8 fits telecom line cards because its 15,600 logic elements plus 1,875,000 bits of embedded dual-port RAM are well matched to the per-channel buffering and protocol-handling workloads of T1/E1, T3/E3, and early-generation Ethernet line interfaces. The 425 user I/O pins comfortably accommodate the wide parallel bus interfaces common to backplane ASICs of the era, and the MultiVolt I/O banks let 1.5V logic interface to 3.3V bus transceivers without level shifters. The four PLLs provide the multiple clock domains required to recover and retransmit telecom-grade timing.
Empfohlen
SONET/SDH Framers
The EP2A15B652C8 is well suited for SONET/SDH framer implementations because its True Dual-Port embedded RAM can buffer payloads on both the ingress and egress side of the framer simultaneously, eliminating external SRAM in many channel configurations. The 1.5V core plus MultiVolt I/O simplifies interfacing to 3.3V serializer/deserializer (SERDES) chips common in OC-3/OC-12 designs. Designers using the EP2A15B652C8 for SONET framer IPs benefit from the device's predictable timing closure on the 8/16/32-bit datapath widths typical of STS-1 payload processing.
Empfohlen
ATM Switch Fabrics
The EP2A15B652C8's high ratio of embedded dual-port RAM bits to logic elements makes it attractive for ATM switch fabrics, where cell buffers and queue tables consume the bulk of design resources. Approximately 1.875 Mbits of internal RAM can hold thousands of 53-byte ATM cells without external buffering, while 15,600 logic elements handle the cell-header translation and routing table lookups. The 425 I/O pins support the wide cell-bus interfaces typical of multi-port ATM fabrics, and 0C to +85C commercial temperature grade suits central-office deployments.
Empfohlen
High-Speed Video Processing
The EP2A15B652C8 is useful for high-speed video processing such as HD-SDI routing, video format conversion, and broadcast-quality effects processing because its dual-port embedded RAM supports real-time line buffers and frame store buffers without external memory in many configurations. The MultiVolt I/O banks interface directly to LVDS video serializers, while the 425 user I/O pins accommodate the wide parallel pixel buses typical of 4:4:4 studio video. The four on-chip PLLs generate the multiple pixel-clock domains required for input and output frame-rate conversion.
Empfohlen
ASIC Prototyping
The EP2A15B652C8 is widely deployed in ASIC prototyping because its 15,600 logic elements can host mid-complexity ASIC designs at full speed, with 425 user I/O pins mapped to the prototype board's pin headers. The True Dual-Port embedded RAM models typical ASIC register-file and FIFO blocks faithfully, while the four PLLs handle multi-clock-domain ASICs. Quartus II's incremental compilation flow supports team-based ASIC prototyping, and the JTAG configuration interface makes bring-up straightforward for engineering characterization.
Empfohlen
Industrial Networking Bridges
The EP2A15B652C8 fits industrial networking bridges - Profibus, Modbus, Ethernet/IP gateway designs - because its MultiVolt I/O banks let a single device interface to both 1.8V ARM processors and 3.3V/5V industrial transceivers. The 425 user I/O pins accommodate the multiple isolated communication ports typical of gateway designs, while the embedded RAM buffers protocol frames at line rate. The 0C to +85C commercial temperature grade handles most factory-floor environments, and the JTAG configuration interface supports remote firmware updates during commissioning.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP2A15B652C8 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP2A25B652C8 | EP2A40B652C8 | EP2A15B652C7 | EP2A15B652I8 |
|---|---|---|---|---|---|
| Package | 652-ball FineLine BGA | 652-ball FineLine BGA - same | 652-ball FineLine BGA - same | 652-ball FineLine BGA - same | 652-ball FineLine BGA - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Logic Elements | 15,600 | 25,000 (+60%) | 40,000 (+156%) | 15,600 (same) | 15,600 (same) |
| Maximum User I/O | 425 | 425 (same) | 488 (+15%) | 425 (same) | 425 (same) |
| Embedded RAM (bits) | 1,875,000 | 2,432,768 (+30%) | 3,317,184 (+77%) | 1,875,000 (same) | 1,875,000 (same) |
| Embedded System Blocks | 104 | 160 (+54%) | 192 (+85%) | 104 (same) | 104 (same) |
| Speed Grade | C8 | C8 (same) | C8 (same) | C7 (~12% faster) | I8 (industrial temp, slower) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
Wichtigste Unterscheidungsmerkmale
- Drop-in upgrade path to 25K logic elements with identical BGA-652 footprint (vs. EP2A25B652C8)
- Faster C7 speed grade available in same footprint (vs. EP2A15B652C7)
- Industrial temperature variant EP2A15B652I8 available (vs. EP2A15B652I8)
Designhinweise
Estimated: route all eight VCCINT (1.5V) and sixteen VCCIO (MultiVolt) BGA balls to power planes with via-in-pad or near-pad vias. Place 0.1 µF decoupling capacitors within 5mm of each power-ball group, plus a single 10 µF bulk capacitor per VCCIO bank. Use a 4-layer PCB with dedicated ground and power planes; BGA-652 packages require controlled-impedance traces (typically 50 ohm single-ended, 100 ohm differential) for LVDS/HSTL signals.
Do not apply JTAG configuration signals (TCK, TMS, TDI, TDO) before VCCINT has reached its 1.5V nominal level - this can latch the configuration cells into an invalid state and brick the device. Also note that the EP2A15B652C8 is NOT 5V-tolerant on its I/O banks even though MultiVolt I/O is supported; driving 5V TTL into a 3.3V-configured bank will damage the I/O cells. Always confirm VCCIO programming per bank before signal connection.
Estimated: at typical APEX II clocking frequencies (200-300 MHz internal, 100-150 MHz I/O) and average toggle activity, junction temperature rise above ambient is roughly 8-12 C/W on a 4-layer PCB with adequate copper. The FineLine BGA's bottom-side thermal balls require a thermal pad with at least 6 ground vias to the inner ground plane to achieve this. Forced-air cooling is recommended for industrial deployments where ambient exceeds 50C. Without thermal management, commercial-grade parts may exceed 85C junction temperature in enclosed chassis.
Matched-length routing is required for LVDS pairs - keep differential traces within 0.5mm length match and route them over a continuous ground plane. Place series-termination resistors within 5mm of the FPGA output pin to dampen reflections on high-speed HSTL Class II interfaces. For global clock networks, prefer PLL output pins (CLK[0..7]) over general-purpose I/O to minimize skew; the EP2A15B652C8 supports up to 16 global clock domains routed through the dedicated clock tree.
Compliance-Informationen
RoHS/REACH/lead-free status not explicitly stated in the Verified Web Data for the EP2A15B652C8. The APEX II family predates widespread RoHS adoption, so many original parts are non-compliant; lead-free and halogen-free variants are not documented. AEC-Q100 not applicable - this is an FPGA, not an automotive-qualified IC.
