EP2A40F1020C7ES - APEX II 1.5M Gates FPGA, 1020-FBGA | Intel
Teilenummer: EP2A40F1020C7ES ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $260 | $2.600,00 |
| 100 | $232 | $23.200,00 |
| 500 | $205 | $102.500,00 |
| 1.000 | $185 | $185.000,00 |
EP2A40F1020C7ES Übersicht
What is an APEX II FPGA? APEX II (Advanced Logic Element Matrix, second generation) is a programmable logic device family from Altera that combines look-up table (LUT) based logic, embedded system blocks (ESBs) for memory and arithmetic, and high-speed I/O on a single die. APEX II devices sit in the FPGA hierarchy above CPLDs and below ASICs, between simple programmable logic devices (SPLDs/CPLDs) and structured ASICs. They belong to the broader class of programmable logic devices (PLDs) and are typically deployed when design flexibility, high gate count, and parallel signal processing are required before committing to an ASIC tape-out.
Key features include up to 1.5 million typical gates, 38,400 logic elements (LEs), 655,360 bits of embedded RAM, and 1 Gbps True-LVDS, LVPECL, PCML, and HyperTransport interface support. The 1020-pin FC-FBGA package exposes 735 user I/Os, enabling wide parallel buses and high-pin-count data acquisition. MultiVolt I/O allows interfacing to 1.5 V, 1.8 V, 2.5 V, and 3.3 V logic levels without external level shifters.
The device uses a hierarchical routing architecture with embedded array blocks (EABs) and logic array blocks (LABs), allowing efficient implementation of large multipliers, FIFOs, and dual-port RAM. True-LVDS support at 1 Gbps makes the part suitable for high-speed serial links and parallel chip-to-chip interconnect. Internal Phase-Locked Loops (PLLs) provide clock multiplication, division, and phase shifting across up to eight clock domains.
Typical applications include high-performance data acquisition, ASIC prototyping, telecommunications infrastructure, parallel DSP pipelines, and high-speed image or video processing. The high I/O count makes it well-suited for bus-intensive bridging and protocol conversion designs.
When designing with EP2A40F1020C7ES, follow Altera's power and thermal decoupling guidance carefully; a 1020-pin FC-FBGA demands multi-layer PCB with continuous power planes and a controlled-impedance stack-up. The 'ES' suffix indicates an enhanced speed grade, so verify timing closure with the Altera Quartus II design tool before tape-out.
This page synthesizes distributor pricing, drop-in alternatives from the same APEX II family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für EP2A40F1020C7ES – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP2A40F1020C7ES (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, System Gates, Operating Temperature, Speed Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP2A40F1020C7
✅ Drop-In✓ Auf Lager
$138 / Stück
Datenblatt ansehen →EP2A40F1020C6
✅ Drop-In✓ Auf Lager
$149 / Stück
Datenblatt ansehen →EP2A40F1020C6N
✅ Drop-In✓ Auf Lager
$198 / Stück
Datenblatt ansehen →EP2A40B724C7ES
✅ Drop-In✓ Auf Lager
$155 / Stück
Datenblatt ansehen →EP2A40B724C7
✅ Drop-In✓ Auf Lager
$650 / Stück
Datenblatt ansehen →EP2A40B652C7ES
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP2A40F1020C7ES Grenzwerte & elektrische Eigenschaften
| Family | APEX II |
| Logic Elements | 38,400 |
| Typical Gates | 1,500,000 |
| Embedded Memory | 655,360 bits |
| Maximum User I/O | 735 |
| Maximum Frequency | 562 MHz |
| Process Technology | 0.15 µm CMOS, all-layer copper, up to 8 metal layers |
| Core Voltage | 1.5 V |
| Gehäuse | 1020-pin FC-FBGA |
| Speed Grade | C7 (with ES enhanced speed suffix) |
| High-Speed Interface | 1 Gbps True-LVDS, LVPECL, PCML, HyperTransport |
| I/O Standards | LVTTL, LVCMOS, LVDS, LVPECL, PCML, HyperTransport, 1.5/1.8/2.5/3.3 V |
| PLLs | Up to 8 (per datasheet family feature) |
| Programming Interface | JTAG (IEEE 1149.1), passive serial |
| Montageart | Surface Mount (FC-FBGA) |
EP2A40F1020C7ES 1020-pin fc-fbga Pinbelegungsleitfaden
Pinbelegung für EP2A40F1020C7ES (1020-pin fc-fbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP2A40F1020C7ES.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP2A40F1020C7ES ist geeignet für 7 Anwendungs: ASIC Prototyping and Emulation, Telecommunications Infrastructure, High-Speed Data Acquisition Systems, Parallel DSP Pipeline Processing, Industrial Automation and Control, Medical Imaging and Diagnostics, Aerospace and Defense Signal Processing.
ASIC Prototyping and Emulation
The EP2A40F1020C7ES is well suited for ASIC prototyping with its 1.5 million system gates and 38,400 logic elements providing sufficient capacity to emulate mid-complexity ASICs at functional level. The 735 user I/Os in the 1020-pin FC-FBGA package expose wide parallel buses, enabling direct mapping of ASIC pinout for pre-silicon validation. Designers using Quartus II can iterate RTL quickly and validate system behavior before committing to silicon.
Empfohlen
Telecommunications Infrastructure
In telecom equipment, the EP2A40F1020C7ES provides parallel DSP and packet processing capability with its 1 Gbps True-LVDS interface support, enabling high-speed chip-to-chip links to line card ASICs and network processors. The 655,360 bits of embedded memory allow implementation of large lookup tables, packet buffers, and queuing structures directly in the FPGA. MultiVolt I/O at 1.5/1.8/2.5/3.3 V enables direct interface to legacy and modern telecom ASICs without external level shifting.
Empfohlen
High-Speed Data Acquisition Systems
The EP2A40F1020C7ES supports multi-channel data acquisition with its 735 user I/Os and 1 Gbps LVDS interface, allowing direct parallel sampling from multiple high-speed ADCs and digital sensors. The 655,360 bits of embedded RAM provide local buffering for incoming sample streams, while the 38,400 LEs handle real-time DSP preprocessing. The 562 MHz maximum operating frequency supports complex FIR/FFT preprocessing on multi-channel input data.
Empfohlen
Parallel DSP Pipeline Processing
The EP2A40F1020C7ES implements parallel DSP pipelines using its MultiVolt I/O and embedded arithmetic blocks, supporting sample rates up to 562 MHz for FIR filters, FFT engines, and correlation processors. With 38,400 LEs, designers can instantiate multiple parallel multiply-accumulate channels simultaneously. The 655,360-bit embedded memory serves as coefficient storage and sample delay lines for adaptive filtering and beamforming.
Empfohlen
Industrial Automation and Control
The EP2A40F1020C7ES provides deterministic parallel I/O for industrial control systems, with 735 user I/Os supporting multi-axis motor control, encoder feedback, and high-speed deterministic response to sensor inputs. The 1.5 V core and multi-voltage I/O integrate with industrial 3.3 V and 5 V logic families. APEX II's MultiVolt feature simplifies interface to legacy PLC and factory automation equipment without external level translators.
Empfohlen
Medical Imaging and Diagnostics
The EP2A40F1020C7ES suits medical imaging front-end processing where its 735 user I/Os capture parallel data streams from ultrasound transducer arrays, CT detectors, or MRI digitizers. The 1 Gbps LVDS interface supports chip-to-chip links to high-speed ADCs used in medical imaging front-ends. Embedded memory of 655,360 bits allows line buffer storage for image reconstruction, while 38,400 LEs handle real-time beamforming and image preprocessing pipelines.
Empfohlen
Aerospace and Defense Signal Processing
The EP2A40F1020C7ES is deployed in aerospace signal processing applications including radar data pre-processing, electronic warfare front-ends, and secure communications links. The 1 Gbps True-LVDS interface connects to high-speed converters and downconverters, while 735 user I/Os support wide parallel data paths. The 1020-pin FC-FBGA package is suitable for ruggedized PCB assemblies with thermal management provisions for high-altitude operation.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP2A40F1020C7ES – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP2A40F1020C7 | EP2A40F1020C6 | EP2A40F1020C6N | EP2A40B724C7ES | EP2A40B724C7 | EP2A40B652C7ES |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1020-pin FC-FBGA | 1020-pin FC-FBGA (same) | 1020-pin FC-FBGA (same) | 1020-pin FC-FBGA (same) | 724-pin BGA (different) | 724-pin BGA (different) | 652-pin BGA (different) |
| Logic Elements | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 | 38,400 |
| Typical Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500000 | 1,500,000 |
| User I/O | 735 | 735 | 735 | 735 | 455 (lower) | 455 (lower) | 406 (lower) |
| Speed Grade | C7 ES | C7 | C6 (slower) | C6 (slower) | C7 ES | C7 | C7 ES |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Embedded Memory (bits) | 655,360 | 655,360 | 655,360 | 655,360 | 655,360 | 655,360 | 655,360 |
| True-LVDS Speed | 1 Gbps | 1 Gbps | 1 Gbps | 1 Gbps | 1 Gbps | 1 Gbps | 1 Gbps |
| Approx. Unit Price (qty 1, USD) | 285.00 | 275.00 | 220.00 | 230.00 | 210.00 | 200.00 | 190.00 |
Wichtigste Unterscheidungsmerkmale
- Highest pin-count option in APEX II family with 735 user I/Os (vs. EP2A40B724C7ES)
- Enhanced speed grade for tighter timing margin (vs. EP2A40F1020C7)
- Same silicon die across all EP2A40F1020 variants (vs. EP2A40B652C7ES)
- C7 speed grade offers balance of speed and availability (vs. EP2A40F1020C6)
Designhinweise
The 1020-pin FC-FBGA package demands a multi-layer PCB with at least 6 to 8 layers, dedicated ground and 1.5 V power planes, and a controlled-impedance stack-up for LVDS/LVPECL signal integrity. Per Altera's APEX II hardware design guide, route all power pins directly to the planes through short vias, place 0.1 µF decoupling capacitors every 5 to 10 power pins, and provide bulk decoupling with 220 µF tantalum capacitors at the PCB edge connector. Use microvia or stacked-via technology for fan-out from the 1.0 mm pitch BGA pads.
Estimated: at 562 MHz with 100% logic utilization, the EP2A40F1020C7ES may dissipate 4 to 6 W in the FC-FBGA package. With θJA of approximately 12 to 15 °C/W for a 1020-pin FC-FBGA on a JEDEC test board, this translates to a 48 to 90 °C junction-temperature rise above ambient. For reliable operation in industrial temperature range (-40 °C to +85 °C ambient), ensure continuous top-side airflow or attach a heatsink with thermal interface material. Compute exact values using Quartus II PowerPlay power analyzer output for your specific design utilization.
Common pitfalls when designing with EP2A40F1020C7ES: (1) conflate 'ES' suffix with environmental compliance - it denotes enhanced speed, not RoHS or halogen-free status; (2) ignore the C7 speed grade's lower timing margins when migrating from C6 designs - re-run Quartus II timing analysis to confirm closure; (3) assume the device supports 5 V I/O - it requires 1.5/1.8/2.5/3.3 V via MultiVolt I/O only; (4) over-constrain pin assignments without checking the device's pin-out file for 1020-FBGA bank assignments; (5) fail to provide JTAG chain termination - the device requires 4.7 kΩ pull-up on TCK per IEEE 1149.1.
For 1 Gbps True-LVDS interfaces on EP2A40F1020C7ES, match differential pair impedance to 100 Ω ±10%, keep intra-pair skew below 5 ps, and maintain length matching between P and N traces within 0.13 mm. Per the APEX II datasheet, route LVDS pairs on inner stripline layers adjacent to a continuous ground plane; avoid routing over plane splits. Use LVDS point-to-point topology when possible; for multi-drop configurations, keep stubs below 2.5 mm and validate with IBIS-AMI simulation.
Compliance-Informationen
Compliance status not explicitly documented in verified web data for the ES speed-grade suffix variant; the base EP2A40 family is from Altera's pre-Intel obsolescence era (early 2000s). Confirm RoHS/lead-free status with specific distributor at time of quote. AEC-Q100 not applicable for FPGAs in this context.