EP1SGX25DF1020I5 - 25K LEs Stratix GX FPGA 1020-BGA | Altera
Teilenummer: EP1SGX25DF1020I5 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
EP1SGX25DF1020I5 Übersicht
An FPGA (Field Programmable Gate Array) is a reconfigurable semiconductor device containing an array of programmable logic blocks, configurable interconnect, and I/O cells that can be customized after manufacturing. FPGAs sit in the programmable-logic hierarchy above CPLDs and below fixed-function ASICs, and within Stratix GX they integrate high-speed transceivers alongside general-purpose logic, making them well suited for data-pipeline and protocol-bridging designs.
Key features include 2,566 configurable logic blocks (CLBs), approximately 607 user I/O pins, dedicated high-speed serial transceivers supporting multi-gigabit interfaces, embedded multiplier blocks, and on-chip TriMatrix memory. The 'I5' speed/temperature grade denotes the industrial temperature range, while the 'DF1020' suffix identifies the 1020-ball FC-FBGA package. The 'GX' suffix denotes the Stratix GX transceiver-enhanced sub-family.
The architecture combines 130 nm process technology with built-in transceiver circuitry, allowing engineers to implement protocol PHYs, packet processing, and DSP pipelines on a single die. Embedded RAM and DSP blocks accelerate common arithmetic and buffering operations used in communications infrastructure.
Typical applications include high-speed serial interface bridging, telecommunications backplane equipment, video broadcast and image processing, test and measurement instrumentation, and military/aerospace signal-processing systems where the industrial temperature grade and high logic density provide headroom for complex state machines and data paths.
When designing with this part, plan FPGA configuration memory carefully: the Stratix GX family requires specific configuration schemes (e.g., passive serial, fast passive parallel, JTAG). PCB designers must allocate 1020 balls with controlled-impedance escape routing, provide robust power-rail decoupling, and ensure thermal relief for industrial-temperature operation.
This page synthesizes distributor pricing, drop-in equivalents, and practical design notes for the EP1SGX25DF1020I5 - information not consolidated on any single manufacturer or distributor page.
Drop-in-Alternativen für EP1SGX25DF1020I5 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1SGX25DF1020I5 (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, Package Type, Speed Grade, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1SGX25DF1020C7N
✅ Drop-In✓ Auf Lager
$171 / Stück
Datenblatt ansehen →EP1SGX25DF1020C7
✅ Drop-In✓ Auf Lager
$145 / Stück
Datenblatt ansehen →EP1SGX25DF1020C7ES
✅ Drop-In✓ Auf Lager
$1950 / Stück
Datenblatt ansehen →EP1SGX25DF1020C6N
✅ Drop-In✓ Auf Lager
$195 / Stück
Datenblatt ansehen →EP1SGX25DF1020C5N
✅ Drop-In✓ Auf Lager
$650 / Stück
Datenblatt ansehen →EP1SGX25DF1020C4
✅ Drop-In✓ Auf Lager
$1180 / Stück
Datenblatt ansehen →EP1SGX25DF1020I5 Grenzwerte & elektrische Eigenschaften
| Family | Stratix GX |
| Logic Elements (LEs) | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 |
| Maximum Internal Frequency | 5000 MHz |
| Combinatorial Delay (CLB max) | 7.49 ns |
| User I/O Pins | 607 |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Gehäuse | 1020-pin FC-FBGA |
| Package Code | BGA (Flip-Chip) |
| Terminal Pitch | 1.00 mm |
| Terminal Form | Ball |
| Temperature Grade | Industrial (I5) |
| Montageart | Surface Mount |
EP1SGX25DF1020I5 bga (flip-chip) Pinbelegungsleitfaden
Pinbelegung für EP1SGX25DF1020I5 (bga (flip-chip)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1SGX25DF1020I5.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1SGX25DF1020I5 ist geeignet für 6 Anwendungs: Telecommunications Backplane Equipment, High-Speed Serial Protocol Bridging, Video Broadcast and Image Processing, Test and Measurement Instrumentation, Military and Aerospace Signal Processing, Industrial Automation and Process Control.
Telecommunications Backplane Equipment
The EP1SGX25DF1020I5's 25,660 logic elements and integrated multi-gigabit transceivers make it a strong fit for telecom backplane line cards that aggregate multiple serial links. Its industrial temperature grade ensures reliable operation in central-office and outdoor-cabinet environments. Compared with smaller FPGAs, the 607 user I/Os allow direct interfacing to many parallel buses and SFP/SFP+ cages, while 130 nm CMOS technology and embedded transceivers simplify board layout by eliminating external PHY chips. Designers can implement framing, encryption, and link-training logic alongside the PHY on a single die, reducing BOM cost and improving reliability. The 1020-ball FC-FBGA footprint accommodates dense escape routing for high-speed serializer/deserializer channels. This consolidation of logic and SERDES is the key reason Stratix GX parts became reference platforms for legacy telecom infrastructure.
Empfohlen
High-Speed Serial Protocol Bridging
Bridging between RapidIO, PCI Express, Gigabit Ethernet, and custom serial protocols is a canonical Stratix GX use case where the EP1SGX25DF1020I5 excels. The integrated transceivers support multiple data rates from hundreds of Mbps to multi-Gbps, while the 25,660 logic elements provide the headroom needed for protocol state machines, CRC engines, and packet buffering. Industrial temperature operation enables deployment in factory and outdoor systems where cooling is limited. The 1020-ball FC-FBGA package provides the high pin density required for many simultaneous serial channels. Designers typically instantiate PHY PCS, MAC, and application-layer logic all on-chip, removing discrete bridge chips from the BOM. This single-chip integration lowers latency and power compared with multi-chip bridge designs based on older 90 nm or 130 nm ASSP parts.
Empfohlen
Video Broadcast and Image Processing
The EP1SGX25DF1020I5 is a credible platform for video broadcast routers, format converters, and image-processing pipelines because it combines 25,660 logic elements with embedded multiplier blocks and TriMatrix memory well suited to FIR filters and DCT-style transforms. Industrial temperature operation lets the part serve outdoor broadcast trucks and stadium installations where thermal stress is significant. The 607 user I/Os accept many parallel video data lanes without external buffers, simplifying PCB integration. Compared with smaller Cyclone or Spartan parts, the Stratix GX silicon provides higher throughput at the cost of larger FC-FBGA packaging. The transceiver channels also handle SDI and HD-SDI serial video transport at standard broadcast rates. This combination of logic, memory, DSP, and SERDES in one device streamlines broadcast-engineering workflows.
Empfohlen
Test and Measurement Instrumentation
Bench-top instruments such as protocol analyzers, logic analyzers, and arbitrary waveform generators benefit from the EP1SGX25DF1020I5's blend of high logic density and integrated transceivers. The 25,660 LEs host deep acquisition memory, trigger state machines, and DSP-style signal-conditioning logic, while the SERDES channels capture high-speed serial data without external PHYs. The 1020-ball FC-FBGA package enables compact instrument front-end layouts where channel density is critical. The industrial temperature grade supports lab and field-deployed instruments that may experience varying ambient conditions. Compared with mid-range CPLDs, the Stratix GX architecture accelerates real-time processing for high sample rates. Long product lifecycles in test equipment made the original 130 nm Stratix GX a long-running platform choice.
Empfohlen
Military and Aerospace Signal Processing
Ruggedized communications, electronic-warfare, and radar signal-processing subsystems historically rely on Altera Stratix GX parts like the EP1SGX25DF1020I5 because the industrial temperature grade supports harsh thermal envelopes and the 25,660 logic elements implement real-time FFT, channelization, and beamforming pipelines. The integrated transceivers handle high-speed ADC/DAC data links without external PHYs, reducing SWaP-C in space-constrained enclosures. The 1020-ball FC-FBGA accommodates many parallel sensor interfaces and high-speed serial links on one die. Compared with newer Stratix V or Stratix 10 parts, the original 130 nm Stratix GX has a longer pedigree in fielded military platforms. Designers pair it with external SRAM/DDR memories and high-speed ADCs to build complete sensor-processing units.
Empfohlen
Industrial Automation and Process Control
Programmable Logic Controllers, motor-control front-ends, and deterministic EtherCAT/CAN-FD gateways leverage the EP1SGX25DF1020I5's industrial temperature grade and SERDES channels for high-speed backplane fabrics. The 607 user I/Os connect to many sensors, actuators, and parallel industrial buses without external bus drivers, while the 25,660 logic elements implement motion-control state machines and safety logic on one chip. Compared with smaller FPGAs, the part consolidates industrial-Ethernet MACs, protocol translation, and signal conditioning in a single device, simplifying long-life industrial designs. The 1020-ball FC-FBGA supports long-term manufacturing continuity through industrial channels. This integration of logic, memory, and transceivers remains a key reason legacy factory-automation platforms continue to specify this part.
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Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1SGX25DF1020I5 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1SGX25DF1020C7N | EP1SGX25DF1020C7 | EP1SGX25DF1020C7ES | EP1SGX25DF1020C6N | EP1SGX25DF1020C5N | EP1SGX25DF1020C4 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-pin FC-FBGA | 1020-pin FC-FBGA - same | 1020-pin FC-FBGA - same | 1020-pin FC-FBGA - same | 1020-pin FC-FBGA - same | 1020-pin FC-FBGA - same | 1020-pin FC-FBGA - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Configurable Logic Blocks | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 |
| Temperature Grade | Industrial (I5) | Commercial (C7) | Commercial (C7) | Commercial (C7, ES) | Commercial (C6) | Commercial (C5) | Commercial (C4) |
| Speed Grade | I5 | C7 (faster than I5) | C7 (faster than I5) | C7 (faster than I5) | C6 (faster than I5) | C5 | C4 (slower) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| User I/O Pins | 607 | 607 | 607 | 607 | 607 | 607 | 607 |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature grade for harsh-environment deployments (vs. EP1SGX25DF1020C7N)
- Balanced density for mid-complexity Stratix GX designs (vs. EP1SGX10DF672I6N)
- 1020-ball FC-FBGA supports maximum transceiver and I/O density (vs. EP1S25F1020C6N)
Designhinweise
The EP1SGX25DF1020I5 requires multiple supply rails (1.5 V core, separate VCCIO bank voltages, PLL analog supply, and transceiver analog supplies) per the Stratix GX datasheet. Estimated core current at full utilization reaches several amps, so allocate bulk decoupling capacitors (typically 220 uF low-ESR polymer or tantalum plus 0.1 uF/10 nF ceramics per supply pin group). Power-rail sequencing between VCCINT, VCCPD, and VCCA must follow Altera's recommended sequence to avoid latch-up during FPGA configuration.
In the industrial-grade FC-FBGA package, thermal performance relies primarily on PCB thermal vias under the die-flag and copper pours on outer/inner layers. Estimated junction-to-ambient thermal resistance (theta_JA) for the 1020-ball FC-FBGA on a standard 8-layer PCB is approximately 15-20 C/W without airflow. For full-die utilization at industrial temperatures, designers should target at least 200 LFM airflow or a heat-spreader lid to keep the die below 100 C junction at +85 C ambient.
The 1020-ball FC-FBGA at 1.00 mm pitch requires 4-6 layer PCB stack-up with microvia-in-pad or via-on-pad technology for reliable assembly. Escape routing for transceiver balls must maintain 90 ohm differential impedance and length matching within the budgets specified in the Stratix GX handbook. Keep high-speed serial traces on the top layers with continuous reference planes; avoid routing signal traces across plane splits. Ground-bounce mitigation requires stitching vias near BGA perimeter rows.
Common pitfalls include: (1) forgetting to strap MSEL pins correctly for the chosen configuration mode, (2) leaving unused transceiver channels powered down via software rather than hardware, (3) omitting pull-ups on JTAG TCK/TMS/TDI to avoid floating-config issues, and (4) underestimating IO bank VCCIO requirements when mixing LVDS and single-ended I/O standards. Always validate configuration with Quartus II programmer and the JTAG ID code 0x02xxxxxx before committing to volume production.
Compliance-Informationen
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status not stated in the verified web data for this legacy Altera FPGA; refer to the original Stratix GX datasheet and the manufacturer's material declaration documents for definitive compliance information.