EP2AGX95EF29C3N - Arria II GX FPGA, 95K LE, FBGA-780 | Altera
Teilenummer: EP2AGX95EF29C3N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2.565,00 |
| 100 | $228 | $22.800,00 |
| 500 | $199.5 | $99.750,00 |
| 1.000 | $171 | $171.000,00 |
EP2AGX95EF29C3N Übersicht
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), interconnect, and I/O elements that can be electrically programmed after manufacture to implement arbitrary digital circuits. FPGAs sit at the same hierarchical level as ASICs and CPLDs in the broader category of programmable logic devices (PLDs), but offer higher logic density and finer-grained parallelism. Within Altera/Intel's portfolio, the Arria II GX family targets mid-cost transceiver-based designs, positioned between the low-cost Cyclone series and the high-end Stratix series, and optimized for protocols such as PCIe Gen2, Gigabit Ethernet, Serial RapidIO, and CPRI.
Key features of the EP2AGX95EF29C3N include 12 transceivers at up to 6.375 Gbps, embedded PCIe Gen2 hard IP blocks (x1, x2, x4), dedicated DSP blocks supporting 18x18 multipliers, and on-chip memory of approximately 5.7 Mbits distributed plus block RAM. The -C3 speed grade and industrial temperature variant position the device for cost-sensitive mid-performance designs.
Arria II GX uses a 40nm process node and features Adaptive Logic Module (ALM) architecture, where each ALM contains an 8-input fracturable look-up table combined with dedicated registers. Transceivers incorporate signal conditioning, equalization, and built-in PCIE PHY IP to ease protocol implementation.
Typical applications include wireless baseband processing, video broadcast and image processing pipelines, industrial control and test equipment, and PCIe Gen2 endpoint cards. The combination of transceivers, DSP blocks, and on-chip memory makes it well-suited for DSP-heavy designs with moderate serial I/O requirements.
When designing with this part, ensure proper power-rail sequencing between VCC, VCCAUX, and VCCP, as incorrect sequencing can damage the device. Transceiver channels require dedicated reference clocks with controlled jitter; use an FPGA-grade oscillator rather than a generic clock source.
This page synthesizes distributor pricing, drop-in alternatives from the same Altera Arria II GX family, and practical design notes not found in the manufacturer datasheet.
Drop-in-Alternativen für EP2AGX95EF29C3N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP2AGX95EF29C3N (gleiche Bauform und Footprint) – abweichend in Speed Grade, Package, Operating Temperature, Transceivers, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP2AGX95EF29I3N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1280 / Stück
Datenblatt ansehen →EP2AGX95EF29C4N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$855 / Stück
Datenblatt ansehen →EP2AGX95EF29C5N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$990 / Stück
Datenblatt ansehen →EP2AGX95EF29C6N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$555.1 / Stück
Datenblatt ansehen →EP2AGX125EF29C5G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1090 / Stück
Datenblatt ansehen →EP2AGX190EF29C5G
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$1071.99 / Stück
Datenblatt ansehen →EP2AGX95EF29C3N Grenzwerte & elektrische Eigenschaften
| Family | Arria II GX |
| Logic Elements | 95,000 LE |
| Gehäuse | 780-ball FBGA |
| Speed Grade | C3 |
| Transceivers | 12 channels |
| Max Transceiver Data Rate | 6.375 Gbps |
| Embedded PCIe Hard IP | PCIe Gen2 x1/x2/x4 |
| On-chip Memory | ~5.7 Mbits (M9K blocks) |
| Process Node | 40 nm |
| Betriebstemperatur | Commercial (0C to +85C) |
| Supply Voltage Core | 0.9 V (typical) |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
| Lead-Free | Yes |
EP2AGX95EF29C3N 780-ball fbga Pinbelegungsleitfaden
Pinbelegung für EP2AGX95EF29C3N (780-ball fbga-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP2AGX95EF29C3N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP2AGX95EF29C3N ist geeignet für 6 Anwendungs: Wireless Baseband Processing, PCIe Gen2 Endpoint Cards, Video Broadcast & Image Processing, Industrial Control & Test Equipment, Serial RapidIO Backplane Switches, Telecom Protocol Bridging.
Wireless Baseband Processing
The EP2AGX95EF29C3N fits wireless baseband designs because its 95K logic elements and DSP blocks handle channel estimation, FFT/iFFT, and modulation/demodulation in a single device. The 12 transceivers at 6.375 Gbps connect to CPRI or OBSAI fronthaul links to remote radio heads without external SerDes, removing BOM cost. With ~5.7 Mbits on-chip memory, designers can buffer antenna data streams without external SRAM, reducing latency and board area. The 780-ball FBGA supports the high I/O count needed for antenna interfaces, JTAG, and configuration.
Empfohlen
PCIe Gen2 Endpoint Cards
The EP2AGX95EF29C3N includes dedicated PCIe Gen2 hard IP supporting x1, x2, and x4 endpoint configurations, eliminating soft-IP development time and silicon area. Its 6.375 Gbps transceivers exceed the 5 Gbps PCIe Gen2 line rate with margin for PCB channel loss. The 95K logic elements implement protocol layers (transaction, data link, physical) plus application logic such as DMA engines. The 780-ball FBGA package provides sufficient I/O for endpoint signals and sideband interfaces (PERST, WAKE, REFCLK).
Empfohlen
Video Broadcast & Image Processing
The EP2AGX95EF29C3N is well-suited for video broadcast and image processing pipelines because its 95K logic elements and DSP blocks deliver real-time pixel processing at HD and 4K resolutions. The transceiver channels support SDI, HDMI, and DisplayPort serialization at standard broadcast rates. On-chip M9K block RAM provides line buffers and frame buffers for scaling, deinterlacing, and color-space conversion without external memory. The 780-ball FBGA offers the I/O density required for multi-stream video capture and output.
Empfohlen
Industrial Control & Test Equipment
The EP2AGX95EF29C3N serves industrial control and test equipment where deterministic DSP and high-speed serial I/O converge. Its 95K logic elements handle real-time control loops and signal processing, while the transceivers connect to high-speed ADCs, DACs, and backplane fabrics such as Serial RapidIO. The 780-ball FBGA package withstands industrial shock and vibration when PCB-mounted with proper underfill. On-chip DSP blocks accelerate FFT-based spectrum analysis commonly used in automated test equipment (ATE).
Empfohlen
Serial RapidIO Backplane Switches
The EP2AGX95EF29C3N enables Serial RapidIO switch implementations through its 12 transceivers at up to 6.375 Gbps, providing the multi-port connectivity required for backplane fabrics. The 95K logic elements implement switch fabric logic, packet buffers, and routing tables, while the on-chip M9K blocks queue packets across ports. The 780-ball FBGA package supports the high pin count needed for multiple SRIO lanes plus management interfaces. Designers can pair the FPGA with an external RapidIO endpoint for full switch functionality.
Empfohlen
Telecom Protocol Bridging
The EP2AGX95EF29C3N bridges telecom protocols such as CPRI, OBSAI, and Ethernet in a single device. Its transceivers handle multiple protocol rates simultaneously, while the 95K logic elements implement protocol adaptation, packetization, and timing recovery. The 780-ball FBGA provides enough I/O for multi-protocol front-panel connectors. On-chip PLL blocks generate the precise clocks required for telecom synchronization, removing the need for external timing chips and reducing BOM complexity.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP2AGX95EF29C3N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP2AGX95EF29I3N | EP2AGX95EF29C4N | EP2AGX95EF29C5N | EP2AGX95EF29C6N | EP2AGX125EF29C5G |
|---|---|---|---|---|---|---|
| Package | 780-ball FBGA (EF29) | 780-ball FBGA (EF29) - same | 780-ball FBGA (EF29) - same | 780-ball FBGA (EF29) - same | 780-ball FBGA (EF29) - same | 780-ball FBGA (EF29) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 95,000 LE | 95,000 LE | 95,000 LE | 95,000 LE | 95,000 LE | 125,000 LE |
| Speed Grade | C3 | I3 (industrial temp) | C4 | C5 | C6 | C5 |
| Operating Temperature | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
| Transceivers | 12 ch up to 6.375 Gbps | 12 ch up to 6.375 Gbps | 12 ch up to 6.375 Gbps | 12 ch up to 6.375 Gbps | 12 ch up to 6.375 Gbps | 12 ch up to 6.375 Gbps |
| Embedded PCIe Hard IP | PCIe Gen2 x1/x2/x4 | PCIe Gen2 x1/x2/x4 | PCIe Gen2 x1/x2/x4 | PCIe Gen2 x1/x2/x4 | PCIe Gen2 x1/x2/x4 | PCIe Gen2 x1/x2/x4 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Wichtigste Unterscheidungsmerkmale
- Industrial-temperature drop-in variant available in same package (vs. EP2AGX95EF29I3N)
- Higher-density migration path within same package family (vs. EP2AGX125EF29C5G)
- Faster C3 speed grade than other C-speed variants (vs. EP2AGX95EF29C6N)
Designhinweise
The EP2AGX95EF29C3N requires strict power-on sequencing between VCC (core), VCCAUX, and VCCP. Per the Arria II Device Handbook, VCC must reach its nominal 0.9 V before VCCAUX is applied, and VCCP must come up last after VCCAUX. Reverse sequencing can cause permanent device damage. Use a multi-rail power supervisor such as the Altera/Intel Enpirion EN6362QI to enforce sequencing.
Estimated: at typical transceiver utilization (8 of 12 channels active, 50% logic toggle rate), the EP2AGX95EF29C3N dissipates approximately 5-8 W. The 780-ball FBGA package requires thermal vias under the central die region and a copper spreader pour on the top layer. For sealed enclosures, ensure ambient stays below 70C to keep junction temperature within the 85C commercial limit.
Design the PCB with controlled-impedance 100-ohm differential traces for transceiver pairs. Maintain length matching within 5 mils within a transceiver pair. Use 0.1 uF decoupling capacitors placed within 1-2 mm of every supply pin, plus bulk 47 uF polymer capacitors near the package. Reference clock traces must be isolated from switching signals and routed over continuous ground planes.
Do not confuse the EP2AGX95EF29C3N with the EP2AGX95DF25 series - the EF29 and DF25 packages have different ball maps and pin counts (780 vs 572 balls). Configuration via JTAG requires the Altera USB-Blaster or compatible programmer; AS mode requires an Altera-compatible EPCS configuration flash. The device cannot be re-configured without a valid configuration source.
Compliance-Informationen
RoHS and lead-free compliance per Altera/Intel FPGA product declarations; AEC-Q100 not applicable (industrial/commercial FPGA, not automotive-qualified); halogen-free status not stated in available web data - set to unknown.