EP2C35F484C6N - Cyclone II FPGA 33K LE 484-BGA | Altera / Intel
Teilenummer: EP2C35F484C6N ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $162.21 | $162,21 |
| 10 | $152.4 | $1.524,00 |
| 100 | $138.95 | $13.895,00 |
| 250 | $128.5 | $32.125,00 |
| 500 | $118.2 | $59.100,00 |
EP2C35F484C6N Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory and DSP resources that the user defines via a hardware description language. FPGAs sit at the top of the programmable-logic hierarchy alongside CPLDs and are widely used for parallel signal processing, custom interfacing, glue logic, and prototyping ASICs before mask production. Cyclone II devices use SRAM configuration cells that must be loaded at power-up from a serial configuration flash.
The Cyclone II family uses a 1.2V core, 4-input LUT-based logic, and dedicated 18x18 multipliers for DSP. Embedded M4K RAM blocks (4 kbit each) provide true dual-port memory up to 36-bit wide, and four PLLs support clock multiplication, phase shifting, and frequency synthesis. The 484-FBGA package exposes 322 user I/Os supporting LVDS, LVTTL, LVCMOS, SSTL, and PCI I/O standards, plus dedicated clock inputs and global clock networks.
Typical applications for the EP2C35F484C6N include industrial motor control boards, factory automation controllers, university digital-logic teaching labs, communications glue logic, video processing pre-processors, and legacy telecom base-band interfaces. The 33,216 logic-element count comfortably supports soft-core processors such as Nios II, custom state machines, and mid-density DSP pipelines.
When designing with this part, ensure the configuration flash (EPCS) is sized for the 33K-LE bitstream and that JTAG pin mapping matches the 484-BGA pinout. Decoupling follows the standard 1.2V core / 3.3V I/O split, and unused user I/Os should be left floating or driven to a defined logic level per Cyclone II guidelines.
This page synthesizes distributor pricing, same-brand Cyclone II drop-in variants, and Cyclone II-specific design notes not consolidated in any single manufacturer document.
Drop-in-Alternativen für EP2C35F484C6N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP2C35F484C6N (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Process Technology, RoHS Status, Speed Grade.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP2C35F484C7N
✅ Drop-In✓ Auf Lager
$85.2 / Stück
Datenblatt ansehen →EP2C35F484C8N
✅ Drop-In✓ Auf Lager
$65 / Stück
Datenblatt ansehen →EP2C35F484C6
✅ Drop-In✓ Auf Lager
$57.2 / Stück
Datenblatt ansehen →EP2C35F484I8N
✅ Drop-In✓ Auf Lager
$56.01 / Stück
Datenblatt ansehen →EP2C35U484C7
✅ Drop-In✓ Auf Lager
$108.5 / Stück
Datenblatt ansehen →EP2C35F484I8
✅ Drop-In✓ Auf Lager
$163.7027 / Stück
Datenblatt ansehen →EP2C35F484C6N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone II |
| Logic Elements | 33,216 |
| Total RAM Bits | 483,840 |
| Number of M4K RAM Blocks | 105 |
| Embedded 18x18 Multipliers | 35 |
| Number of PLLs | 4 |
| User I/O Count | 322 |
| Gehäuse | 484-FBGA (F484) 1.0 mm pitch |
| Core Voltage | 1.2 V |
| I/O Voltage | 3.3 V |
| Process Technology | 90 nm CMOS |
| Speed Grade | C6 (commercial, -6) |
| Betriebstemperatur | 0 C to 85 C |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant (lead-free) |
| Configuration Modes | Passive Serial / Active Serial / JTAG |
| Manufacturer | Altera (now Intel FPGA) |
EP2C35F484C6N 484-fbga (f484) 1.0 mm pitch Pinbelegungsleitfaden
Pinbelegung für EP2C35F484C6N (484-fbga (f484) 1.0 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP2C35F484C6N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP2C35F484C6N ist geeignet für 6 Anwendungs: Industrial Motor Control, Factory Automation Controllers, University Digital-Logic Teaching Labs, Communications Glue Logic, Video Processing Pre-Processor, Legacy Telecom Base-band Interface.
Industrial Motor Control
The EP2C35F484C6N delivers 33,216 logic elements and 35 18x18 multipliers, which makes it well-suited to multi-axis industrial motor controllers where field-oriented control (FOC) loops and PWM generation run in parallel. Its 322 user I/Os accept encoder quadrature signals, Hall-effect feedback, and isolated gate-driver outputs without external muxing. The 4 PLLs provide jitter-cleaned clocks for ADC sampling and switching-frequency synchronization, while 105 M4K RAM blocks buffer fast current-loop variables. Lower-density Cyclone II parts cannot host full three-axis FOC; the EP2C35 strikes the right balance for cost-sensitive industrial drives.
Empfohlen
Factory Automation Controllers
Factory PLC and HMI front-end controllers benefit from the EP2C35F484C6N's high I/O count and 1.2V/3.3V dual-rail design, which simplifies integration with 24V opto-isolated sensor inputs and 3.3V MPU busses. The 33K logic elements comfortably host soft-CPU cores such as Nios II/e, custom Modbus/Profibus protocol stacks, and deterministic state machines for conveyor sequencing. The 484-BGA package's 1.0 mm pitch fits inside fanless industrial enclosures, and the commercial 0-85C range covers most factory-floor temperatures without derating. End-of-life risk is mitigated by Cyclone II's mature Quartus II tool support.
Empfohlen
University Digital-Logic Teaching Labs
Universities continue to use Cyclone II devices including EP2C35F484C6N on Terasic DE2 development boards because the F484 package exposes enough I/Os to drive VGA, audio CODEC, SDRAM, and GPIO headers simultaneously for student projects. The 33,216 LEs host lab exercises ranging from simple 7-segment decoders through full RISC CPU implementations, while 35 hardware multipliers allow introductory DSP demonstrations. Quartus II Web Edition is free for Cyclone II, keeping per-student tooling cost at zero. The 'N6' speed grade balances compile time and student project Fmax headroom for educational workloads.
Empfohlen
Communications Glue Logic
Telecom and industrial-networking equipment often uses Cyclone II FPGAs as protocol-bridging glue between legacy parallel buses, SPI/I2C peripherals, and modern high-speed SERDES links. The EP2C35F484C6N's 322 user I/Os handle multiple bus widths in parallel, and the LVDS I/O standard enables short-distance backplane communication without external transceivers. Four PLLs synthesize clean Ethernet, SDH, or PCI clocks from a single board reference oscillator. The 483,840 RAM bits cache frame headers and statistical counters at line rate, which is more than enough for low-port-count managed switches.
Empfohlen
Video Processing Pre-Processor
Mid-resolution video pre-processors (camera pipelines, image preprocessing, format conversion) fit naturally into the EP2C35F484C6N's 33,216 logic elements plus 35 18x18 multipliers. The 322 user I/Os accept parallel ITU-R BT.656 / DVI pixel buses plus 16-bit-wide SRAM/SDRAM data paths, while 105 M4K blocks (483,840 RAM bits) implement line buffers and small frame buffers at NTSC/PAL and modest VGA resolutions. Quartus II MegaWizard video IP runs on Cyclone II unchanged, protecting legacy IP investments. Active serial configuration from EPCS flash enables fast boot for live video applications.
Empfohlen
Legacy Telecom Base-band Interface
Long-life telecom base-station interface cards and legacy line cards continue to use Cyclone II EP2C35F484C6N because the part has been qualified by major OEMs for over a decade. The 33K logic-element budget is sufficient to implement T1/E1 framers, HDLC controllers, and ATM adaptation layer functions in a single chip, reducing board area versus multi-CPLD implementations. Four PLLs synthesize multiple E1/T1 clock domains from a single board reference. The 484-BGA package and commercial 0-85C range meet indoor controlled-environment telecom-shelf thermal envelopes without active cooling.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP2C35F484C6N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP2C35F484C7N | EP2C35F484C8N | EP2C35F484C6 | EP2C35F484I8N |
|---|---|---|---|---|---|
| Package | 484-FBGA (F484) 1.0 mm pitch | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same | 484-FBGA (F484) - same |
| Brand | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) |
| Logic Elements | 33,216 | 33,216 | 33,216 | 33,216 | 33,216 |
| Speed Grade | -6 (C6) | -7 (faster Fmax) | -8 (slower, lower cost) | -6 (same) | -8 industrial |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | -40 C to 100 C (industrial) |
| User I/O Count | 322 | 322 | 322 | 322 | 322 |
| Embedded 18x18 Multipliers | 35 | 35 | 35 | 35 | 35 |
| Total RAM Bits | 483,840 | 483,840 | 483,840 | 483,840 | 483,840 |
| RoHS Compliance | Yes (lead-free 'N') | Yes | Yes | No (legacy lead finish) | Yes |
Wichtigste Unterscheidungsmerkmale
- Highest-I/O Cyclone II variant for high-density designs (vs. EP2C20F484C6N)
- Balanced -6 speed grade for cost/performance (vs. EP2C35F484C7N)
- Lead-free RoHS-compliant variant of legacy F484 part (vs. EP2C35F484C6 (no N suffix))
Designhinweise
The EP2C35F484C6N requires a 1.2V core supply and a 3.3V I/O supply with separate power planes on the PCB. Place 100 nF X7R decoupling capacitors within 5 mm of each VCCINT and VCCIO ball group, plus 10 uF bulk tantalum or ceramic at each supply rail input. Power-on sequencing: VCCINT must reach 1.0V before VCCIO rises above 1.0V, otherwise I/O pins may back-power the core through ESD diodes and latch up. Use a power-good supervisor (e.g. TPS3808) to gate configuration flash VCC until VCCINT stabilizes. Estimated worst-case IDD is approximately 0.5-1.0 A on VCCINT at full utilization, so verify regulator current rating with thermal margin.
Use a 1.0 mm-pitch 484-ball BGA land pattern per JEDEC MS-034. Each ball pad should be non-solder-mask-defined (NSMD) with a diameter of 0.5 mm and a solder-mask opening of 0.55 mm to improve BGA rework yield. Fanout uses 0.1 mm / 0.125 mm microvia stacks on top layers down to inner plane layers; escape routing must keep all eight BGA rows accessible. Place configuration flash (EPCS4) within 50 mm of the FPGA DATA0/DCLK/nCS pin group and keep the JTAG chain TAP distance under 100 mm to avoid signal-integrity issues at the 30 MHz TCK rate.
Do not reuse an EP2C20F484 design's configuration flash for the EP2C35F484C6N without rechecking the bitstream size - the 33,216-LE design typically exceeds 1.6 Mbits, requiring at least an EPCS4 (4 Mbit) and often EPCS16 (16 Mbit). Verify unused I/O bank supply pins are tied to a defined voltage; floating VCCIO pins cause indeterminate JTAG IDCODE reads. After reflow, always X-ray the BGA before applying power to confirm coplanarity, especially with 1.0 mm pitch where head-in-pillow defects are difficult to detect visually.
Cyclone II has four dedicated clock input pins (CLK[3:0]) on each I/O bank; route clock traces as 50-ohm microstrip with ground stitching vias every 2 mm. Use one PLL per high-speed clock domain to clean jitter, and avoid sharing PLLs between unrelated clocks. The four PLL outputs (two per PLL) support multiple frequency synthesis modes; consult Cyclone II handbook chapter 7 for PLL configuration register settings. Differential clock pairs (LVDS) must be length-matched to within 150 mils to avoid sampling errors at 300+ MHz.
Compliance-Informationen
Lead-free / RoHS compliant per the 'N' suffix in the MPN. AEC-Q100 not applicable - FPGAs are not AEC-Q100 qualified parts. Cyclone II is in NRND status as of 2026-09-08; refer to Intel Product Discontinuance notices for the official end-of-life timeline.
