EP2C5F256C7 - Cyclone II FPGA, 4.6K LEs, 256-FBGA | Intel
Teilenummer: EP2C5F256C7 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.95 | $249,50 |
| 100 | $21.4 | $2.140,00 |
| 500 | $18.25 | $9.125,00 |
| 1.000 | $16.1 | $16.100,00 |
EP2C5F256C7 Übersicht
A Field Programmable Gate Array (FPGA) is a semiconductor device containing programmable logic blocks, configurable interconnects, and programmable I/O that engineers can reconfigure after manufacture to implement custom digital logic, glue logic, or full processor cores. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) -> FPGAs -> low-cost SRAM-based FPGAs -> Cyclone II family, and they are widely used as flexible alternatives to ASICs and microcontrollers for parallel processing, high-speed interfacing, and digital signal processing.
Key features of the EP2C5F256C7 include 4,608 logic elements organized into 288 logic array blocks (LABs), 119,808 bits of embedded SRAM distributed across M4K memory blocks, 158 maximum user I/O pins supporting LVDS, LVTTL, PCI, and other single-ended and differential I/O standards, and 13 dedicated 18x18 hardware multipliers that deliver up to approximately 35 GMACs of DSP throughput at 250 MHz. Two PLLs provide zero-delay clock buffering, frequency synthesis, and phase shifting for system clock trees.
The architecture is built around 4-input look-up tables (LUTs) feeding into per-LAB carry chains and register chains, with MultiTrack interconnect minimizing routing congestion. The 90nm process keeps typical static current around 35 mA and dynamic power scales with toggle rate, allowing designers to take advantage of Cyclone II's power-aware compiler to gate unused logic and reduce dissipation.
Typical applications include industrial motor control and PLC interface boards, video processing pipelines, automotive infotainment prototyping, low-cost software-defined radio front-end signal conditioning, and education/DSP development kits. The 158 I/O also make it a strong fit for parallel bus bridging between legacy microcontrollers and high-speed peripherals.
When designing with this part, allocate at least 8 layers in the PCB stack-up for the 256-FBGA breakout, follow Altera's recommended decoupling scheme (100 nF plus 10 uF bulk at each VCCINT/VCCIO region), and use the Quartus II design software for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, verified same-brand drop-in alternatives from the Cyclone II family, and practical design notes not aggregated in any single manufacturer datasheet.
Drop-in-Alternativen für EP2C5F256C7 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP2C5F256C7 (gleiche Bauform und Footprint) – abweichend in Speed Grade, Package, Process Technology, Operating Temperature, Family.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP2C5F256C8N
✅ Drop-In✓ Auf Lager
$11.84 / Stück
Datenblatt ansehen →EP2C5F256I8
✅ Drop-In✓ Auf Lager
$19.95 / Stück
Datenblatt ansehen →EP2C5F256C7N
✅ Drop-In✓ Auf Lager
$23.4 / Stück
Datenblatt ansehen →EP2C5F256C8
✅ Drop-In✓ Auf Lager
$23.9 / Stück
Datenblatt ansehen →EP2C5F256C6
✅ Drop-In✓ Auf Lager
$19.4 / Stück
Datenblatt ansehen →EP2C5F256I7
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
EP2C5F256C7 Grenzwerte & elektrische Eigenschaften
| Family | Cyclone II |
| Series | EP2C5 |
| Logic Elements | 4,608 |
| Number of LABs/CLBs | 288 |
| Total RAM Bits | 119,808 |
| Number of I/O | 158 |
| Number of Embedded Multipliers | 13 (18x18) |
| Number of PLLs | 2 |
| Core Voltage - Supply | 1.15 V to 1.25 V |
| Process Technology | 90 nm |
| Betriebstemperatur | 0C to 85C (Commercial) |
| Speed Grade | 7 |
| Gehäuse | 256-LBGA (FineLine BGA) |
| Montageart | Surface Mount |
| Maximum User I/O Frequency | 402.58 MHz |
| RoHS-Status | Compliant |
EP2C5F256C7 256-lbga (fineline bga) Pinbelegungsleitfaden
Pinbelegung für EP2C5F256C7 (256-lbga (fineline bga)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP2C5F256C7.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP2C5F256C7 ist geeignet für 6 Anwendungs: Industrial Motor Control and PLC Interface, Video Processing and Display Bridging, Automotive Infotainment Prototyping, Software-Defined Radio Front-End Pre-Processing, Education and DSP Development Kits, Legacy Industrial Bus Bridge and Protocol Converter.
Industrial Motor Control and PLC Interface
The EP2C5F256C7 fits industrial motor control because its 13 embedded 18x18 multipliers and 158 user I/O comfortably handle PWM generation, quadrature encoder decoding, and Fieldbus glue logic in a single chip. The 1.2 V core and 0C to 85C commercial temperature are sufficient for cabinet-mounted drives, while 119,808 RAM bits provide buffering for sensor fusion or look-up tables. A typical implementation uses EP2C5F256C7 at the center with external op-amps for current sensing and an EP4CE6 backup for newer variants.
Empfohlen
Video Processing and Display Bridging
With 4,608 logic elements and parallel multipliers capable of approximately 35 GMACs at 250 MHz, the EP2C5F256C7 is well suited to mid-resolution video pipelines, color-space conversion, and LVDS-to-RGB bridging. The 158 I/O pins can drive parallel RGB panels or capture raw camera data, and 119 Kb of internal RAM buffers one or two full HD scan lines. Designers typically instantiate dual-clock FIFOs and run the FPGA between an HDMI receiver and a TFT controller.
Empfohlen
Automotive Infotainment Prototyping
The EP2C5F256C7 is used for prototyping automotive infotainment HMI, CAN-LIN bridging, and audio routing before committing to a Cyclone V SoC production part. Its 90 nm process and 1.2 V core give predictable power, and the 256-FBGA provides enough I/O for touch controllers, displays, and audio CODECs. For final automotive builds, designers migrate to the AEC-Q100-qualified Cyclone V 5CGXFC7, but Cyclone II remains a productive development platform.
Empfohlen
Software-Defined Radio Front-End Pre-Processing
SDR designs benefit from the EP2C5F256C7's 13 hardware multipliers and dual PLLs that can implement digital down-conversion, FIR filtering, and timing recovery at intermediate frequencies below 100 MHz. The 256-FBGA exposes LVDS pairs useful for high-speed ADC interfaces, and the 119 Kb internal memory holds NCO tables and decimation buffers. Typical boards pair the EP2C5F256C7 with an AD9238 ADC and an LTC2208 front end.
Empfohlen
Education and DSP Development Kits
Universities and training labs use the EP2C5F256C7 on DE2 and Altera starter boards because the Quartus II Web Edition supports the Cyclone II family free of charge and the silicon provides enough logic for processor cores (NIOS II) and DSP exercises. The 158 user I/O expose ample breadboard connectivity, and 119 Kb of RAM runs small RTOS images. Kits typically include the EP2C5F256C7 alongside SRAM, LEDs, and switches for hands-on teaching.
Empfohlen
Legacy Industrial Bus Bridge and Protocol Converter
The EP2C5F256C7 excels at bridging legacy parallel buses (PCI, ISA, VME) to modern serial links (SPI, I2C, UART, Ethernet MAC), replacing obsolete glue logic in long-life industrial equipment. With 158 user I/O the FPGA emulates bus transceivers and timing precisely, while 4,608 LEs hold protocol stacks. The device is widely used in test fixtures and instrumentation where pin-compatible retrofits of obsolete ASICs are required.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP2C5F256C7 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP2C5F256C8N | EP2C5F256I8 | EP2C5F256C7N | EP2C5F256C8 | EP2C5F256C6 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-LBGA | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same | 256-LBGA - same |
| Logic Elements | 4,608 | 4,608 | 4,608 | 4,608 | 4,608 | 4,608 |
| Speed Grade | 7 | 8 (faster) | 8 (faster) | 7 (same) | 8 (faster) | 6 (slower) |
| Temperature Grade | Commercial (0C to 85C) | Commercial | Industrial (-40C to 100C) | Commercial | Commercial | Commercial |
| Total RAM Bits | 119,808 | 119,808 | 119,808 | 119,808 | 119,808 | 119,808 |
| Number of I/O | 158 | 158 | 158 | 158 | 158 | 158 |
| Core Voltage | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V |
| Embedded Multipliers | 13 (18x18) | 13 | 13 | 13 | 13 | 13 |
| RoHS Lead-Free | Varies by lot | Yes (N suffix) | Varies by lot | Yes (N suffix) | Varies by lot | Varies by lot |
Wichtigste Unterscheidungsmerkmale
- Same silicon, higher speed grade for tighter timing (vs. EP2C5F256C8N)
- Extended industrial temperature range (vs. EP2C5F256I8)
- RoHS lead-free terminal finish (vs. EP2C5F256C7N)
Designhinweise
The 256-FBGA uses 1.0 mm ball pitch on a 17 mm x 17 mm body, which mandates at least a 4-layer PCB with 8-mil vias and microvia stack-ups for fan-out. Route signals on the top layer using escape vias-in-pad or dog-bone fan-out, keep core power planes contiguous under the BGA, and follow Intel's recommended decoupling scheme: 100 nF X7R on every VCCINT pin and one 10 uF bulk per VCCIO bank placed within 100 mils of the supply pins.
Typical static current is approximately 35 mA at 1.2 V, giving a baseline dissipation near 42 mW, but dynamic power scales with toggle rate. Estimated: at 25% logic utilization toggling at 100 MHz, total dissipation rises to roughly 0.6 W, so a small copper pour under the exposed die pad is sufficient and an external heatsink is not required for commercial-temperature operation. For industrial-grade EP2C5F256I8 in sealed enclosures, derate by 50C/W theta-JA and ensure airflow above 100 LFM.
Do not assume all 256 balls are user I/O - configuration, JTAG, VCCINT, VCCIO, and GND pins reduce the maximum user I/O to 158. Verify the Quartus II Pin Planner assignment before tape-out and never leave VCCIO banks floating. Configuration mode (AS, PS, JTAG) must match the EPCS configuration flash selected (EPCS4 or EPCS16); mismatched mode prevents bitstream loading. Finally, ensure the CONF_DONE pin has a 10 kohm pull-up to VCCIO of the configuration bank.
Compliance-Informationen
RoHS compliance confirmed via Intel product page; lead-free terminal finish ('N' suffix) available for new builds. Not AEC-Q100 qualified - use Cyclone V 5CGXFC7 for automotive.
