EP2S130F780C5N - Stratix II 132K LEs FPGA, 780-FBGA | Intel
Teilenummer: EP2S130F780C5N ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $2584.72 | $2.584,72 |
| 10 | $2510.5 | $25.105,00 |
| 100 | $2415 | $241.500,00 |
| 500 | $2280 | $1.140.000,00 |
| 1.000 | $2150 | $2.150.000,00 |
EP2S130F780C5N Übersicht
Background: An FPGA (Field-Programmable Gate Array) is a class of programmable logic IC that lets engineers implement arbitrary digital circuits by configuring an array of logic blocks, embedded memory, DSP blocks, and high-speed transceivers via a hardware description language (HDL) bitstream. FPGAs sit between fixed-function ASICs (lower NRE, higher unit cost) and microcontrollers (lower performance, software-driven) and dominate prototyping, low-volume production, and applications needing hardware-level parallelism such as DSP, packet processing, and high-speed I/O bridging.
Key features include up to 12 embedded DSP blocks delivering high-throughput multiply-accumulate operations, dedicated high-speed I/O standards support including LVDS, SSTL, and DDR memory interfaces, eight clock networks with up to 16 global clocks, and on-chip PLL resources for frequency synthesis. The device integrates 4 PLLs and supports configuration via passive serial, fast passive parallel, and JTAG modes.
Architecture: The Stratix II family uses an adaptive logic module (ALM) architecture that combines 8 inputs into a single lookup-table-equivalent resource, providing roughly 25% higher logic utilization versus traditional 4-input LUT families. The TriMatrix memory subsystem provides three block RAM sizes (M512, M4K, M-RAM) for flexible buffering, and the embedded DSP blocks deliver 36 x 36 bit multiplication natively, supporting signal-processing pipelines at hundreds of MHz.
Typical applications include high-performance digital signal processing in telecommunications base stations, ASIC prototyping, industrial vision and image processing pipelines, broadband network switches, and test and measurement equipment. The 780-FBGA package and 534 I/Os make it well suited for designs requiring wide external memory buses (DDR/DDR2) and many parallel interfaces.
Design considerations: Stratix II devices require two supply rails (1.15-1.25 V core, 3.3 V I/O) and careful decoupling with 0.1 µF and 0.01 µF ceramic capacitors near every power pin. The 780-FBGA 29 x 29 mm package uses a 1 mm ball pitch and demands a 4-to-6-layer PCB with microvia or via-in-pad technology for reliable manufacturing; signal integrity analysis is mandatory for DDR interfaces.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für EP2S130F780C5N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP2S130F780C5N (gleiche Bauform und Footprint) – abweichend in Package, RoHS Status, Speed Grade, Logic Array Blocks (LABs), PLLs.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP2S130F780C5
✅ Drop-In✓ Auf Lager
$2295 / Stück
Datenblatt ansehen →EP2S130F780C4N
✅ Drop-In✓ Auf Lager
$1095 / Stück
Datenblatt ansehen →EP2S130F780C4
✅ Drop-In✓ Auf Lager
$6500 / Stück
Datenblatt ansehen →EP2S130F780C5N Grenzwerte & elektrische Eigenschaften
| Family | Stratix II |
| Logic Elements | 132,540 |
| Logic Array Blocks (LABs) | 6,627 |
| Total RAM Bits | 6,747,840 |
| User I/Os | 534 |
| Supply Voltage (Core) | 1.15 V to 1.25 V |
| Internal Frequency (typ.) | 609.76 MHz |
| Betriebstemperatur | 0 °C to 85 °C (Commercial) |
| Speed Grade | C5 |
| Gehäuse | 780-FBGA (29 x 29 mm), 1.0 mm pitch |
| Process Technology | 90 nm CMOS |
| PLLs | 4 |
| DSP Blocks | 12 (36 x 36 bit multipliers) |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG |
| Montageart | Surface Mount |
| RoHS-Status | Compliant (lead-free FBGA) |
EP2S130F780C5N 780-fbga (29 x 29 mm), 1.0 mm pitch Pinbelegungsleitfaden
Pinbelegung für EP2S130F780C5N (780-fbga (29 x 29 mm), 1.0 mm pitch-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP2S130F780C5N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP2S130F780C5N ist geeignet für 6 Anwendungs: Telecommunications Base Station DSP, ASIC Prototyping and Emulation, Industrial Machine Vision and Image Processing, Broadband Network Switches and Routers, Test and Measurement Instrumentation, Software Defined Radio (SDR) Platforms.
Telecommunications Base Station DSP
The EP2S130F780C5N fits base-station DSP and baseband processing because its 12 dedicated 36 x 36 bit DSP blocks deliver hundreds of GMACs of multiply-accumulate throughput, while 4,488 Kbit of TriMatrix block RAM stages filter taps and symbol buffers locally. The 534 user I/Os interface to analog front-ends via LVDS and to external DDR2/DDR memory through SSTL-class I/Os. With a 609.76 MHz internal frequency and C5 speed grade, complex PHY-layer algorithms such as FFT/iFFT and channel estimation fit in fewer clock cycles than in the slower C4 grade. The 780-FBGA package supports the dense BGA footprint typical of ATCA/AdvancedTCA baseband cards.
Empfohlen
ASIC Prototyping and Emulation
The EP2S130F780C5N is widely used as a building block in multi-FPGA ASIC prototyping because its 132,540 logic elements partition large SoC designs across multiple devices while the 780-FBGA 29 x 29 mm package allows dense board placement. The 534 I/Os carry high-pin-count chip-to-chip buses between partitioned FPGAs, and the dedicated configuration logic (Passive Serial, Fast Passive Parallel, JTAG) supports fast in-system reprogramming during bring-up. Using C5 speed grade, designers target ASIC timing closure at 50-100 MHz, well within the 609.76 MHz internal Fmax.
Empfohlen
Industrial Machine Vision and Image Processing
Stratix II devices such as EP2S130F780C5N excel in industrial image processing pipelines where raw Camera Link / CoaXPress data streams need real-time pre-processing. The 534 I/Os accept parallel sensor data, while the embedded DSP blocks execute 2D convolution, color-space conversion, and edge detection at line rate. On-chip block RAM (6,747,840 bits) holds multiple image lines for pipelined algorithms without external memory stalls. The commercial 0-85 °C operating range matches factory-floor conditions, and the C5 speed grade sustains 250 MHz pixel clocks comfortably.
Empfohlen
Broadband Network Switches and Routers
The EP2S130F780C5N is used in core and aggregation switches because its 132K logic elements, 4 PLLs, and DDR2 memory controllers move packet headers and lookup tables with deterministic latency. The 534 I/Os provide sufficient lanes for 10 Gigabit Ethernet MACs, SPI-4.2 interfaces, and fabric backplanes. The 780-FBGA footprint supports the thermal envelope required for fanless line-card designs. The C5 speed grade allows 156.25 MHz reference clocking for 10G Ethernet, well within the 609.76 MHz Fmax budget.
Empfohlen
Test and Measurement Instrumentation
Test equipment vendors use the EP2S130F780C5N in arbitrary waveform generators, logic analyzers, and protocol analyzers because its logic density, fast I/O, and reconfigurability let one board serve many product SKUs. The 534 I/Os interface to high-speed ADCs and DACs, while 6,747,840 RAM bits buffer deep acquisition memory. Engineers reconfigure the device via JTAG in seconds to emulate different protocol analyzers. The commercial 0-85 °C range fits laboratory environments, and 1.15-1.25 V core operation keeps total board power budget within instrumentation envelopes.
Empfohlen
Software Defined Radio (SDR) Platforms
SDR platforms leverage EP2S130F780C5N's 12 DSP blocks for FFT-based channelization, modulation, and demodulation in cognitive-radio and tactical-radio systems. The 132,540 logic elements implement complete PHY-layer stacks including turbo/LDPC decoders in firmware-reconfigurable logic, while 4,488 Kbit of block RAM stages samples between ADC and DSP pipeline. The 534 I/Os accept ADC data streams up to 1 Gsps and drive DAC outputs directly. The 609.76 MHz internal Fmax sustains real-time processing at IF sample rates of 100-200 MHz in C5 speed grade.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP2S130F780C5N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP2S130F780C5 | EP2S130F780C4N | EP2S130F780C4 |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 780-FBGA (29x29) | 780-FBGA (29x29) - same | 780-FBGA (29x29) - same | 780-FBGA (29x29) - same |
| Speed Grade | C5 | C5 | C4 | C4 |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 |
| Total RAM Bits | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 |
| User I/Os | 534 | 534 | 534 | 534 |
| Pb-free N Suffix | Yes (N suffix) | No | Yes | No |
| Operating Temperature | 0 to 85 C (Commercial) | 0 to 85 C | 0 to 85 C | 0 to 85 C |
| Internal Frequency (typ.) | 609.76 MHz | 609.76 MHz | ~550 MHz | ~550 MHz |
Wichtigste Unterscheidungsmerkmale
- Fastest speed grade in the Stratix II EP2S130 family (vs. EP2S130F780C4N)
- Pb-free / RoHS-compliant FBGA package (vs. EP2S130F780C5)
- Maximum I/O count for the EP2S130 die in the 780-FBGA footprint (vs. EP2S130F1020C5N)
Designhinweise
The Stratix II EP2S130F780C5N requires at least three supply rails: VCCINT (1.15-1.25 V core), VCCIO (per-bank 3.3/2.5/1.8/1.5 V), and VCCPD (3.3 V pre-driver). Use a 4-6 layer PCB with dedicated power planes and place 0.1 µF + 0.01 µF decoupling capacitors within 100 mils of every power pin. Estimated: total core current at 609.76 MHz can exceed 5 A; verify with the Quartus II PowerPlay early estimator before finalizing the regulator.
The 780-FBGA package uses a 1.0 mm ball pitch, which requires 4-6 layer PCBs with 0.8-1.0 mm laser-drilled microvias or via-in-pad technology for reliable assembly. Maintain 0.5 mm trace/space on outer layers and use length-matched routing (within ±25 mil) for any DDR2/DDR memory interface to preserve signal integrity.
Estimated: at full utilization (132K LEs, 12 DSP blocks, 609.76 MHz), the EP2S130F780C5N can dissipate 10-15 W. The 780-FBGA 29 x 29 mm package offers roughly 18 °C/W theta_JA with a 4-layer PCB; design thermal vias beneath the die and consider a heat spreader for >8 W steady-state loads to keep junction below 100 °C.
Common pitfalls include: (1) configuring unused I/O pins as inputs without pull-ups (causes in-rush current), (2) ignoring the VCCPD requirement when changing I/O standards, (3) routing DDR clocks without length matching, and (4) using JTAG chain configuration without series resistors - always add 33 ohm series termination on TCK/TMS/TDO to prevent ringing.
Compliance-Informationen
N suffix denotes lead-free / RoHS-compliant FBGA per DigiKey and Mouser listings. Halogen-free and conflict-minerals status not stated in verified web data - set to unknown.
