EP2SGX90FF1508I3N - 90k LE Stratix II GX FPGA, 1.2V, FC-FBGA-1508 | Intel
Teilenummer: EP2SGX90FF1508I3N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $1850 | $1.850,00 |
| 5 | $1765 | $8.825,00 |
| 10 | $1680 | $16.800,00 |
| 25 | $1595 | $39.875,00 |
| 50 | $1525 | $76.250,00 |
| 100 | $1460 | $146.000,00 |
EP2SGX90FF1508I3N Übersicht
A Field-Programmable Gate Array (FPGA) is a programmable semiconductor whose logic fabric, interconnect, and I/O blocks are configured by an end-user after manufacture, allowing hardware-level customization without a photomask cycle. Within the programmable-logic taxonomy, FPGAs sit between standard microcontrollers (software-configured, fixed architecture) and full custom ASICs (hardware-configured, fixed function), combining high parallelism with low non-recurring engineering cost. The Stratix II GX family further extends the FPGA hypernym with up to 20 embedded transceivers, embedded multipliers, and TriMatrix memory blocks, positioning the device family as a heterogeneous compute platform.
Key features of the EP2SGX90FF1508I3N include 4,520,448 bits of embedded memory, embedded 18x18 multipliers for DSP operations, and dedicated multi-gigabit transceiver (MGT) channels supporting common serial standards such as PCIe, Serial RapidIO, and Gigabit Ethernet. The device supports several I/O standards including LVDS, LVTTL, LVCMOS, and SSTL for direct interface to DDR/DDR2 memory, while configuration is performed through the EPC family enhanced configuration devices or JTAG. Internal pull-ups, on-chip termination, and dynamic phase alignment simplify board-level design.
The Stratix II GX architecture introduces an adaptive logic module (ALM) that combines look-up tables, adders, and registers in an 8-input structure, achieving higher effective logic density per LE than the prior Stratix generation. On the silicon side, the 90nm process enables transistor-level scaling that drives down dynamic power per MHz while preserving routing flexibility; designers using the Altera/Intel Quartus II design suite can target the device with industry-standard HDL flows and IP libraries.
Typical applications include high-performance DSP for radar, baseband processing in software-defined radio, multi-gigabit serial backplane bridging, ASIC prototyping and emulation, and high-speed data-acquisition front-ends. The device is also used in industrial imaging and medical-imaging pipelines that require parallel pixel processing at line rate. The combination of transceivers, embedded multipliers, and a large logic budget makes the EP2SGX90FF1508I3N a frequent choice for communications infrastructure and defense electronics where a second-source FPGA must remain pin-compatible with the broader Stratix II GX family.
A key design consideration is signal integrity on the FC-FBGA-1508 land pattern: microvia and via-in-pad PCB processes are typically required for reliable assembly, and at least six PCB layers with continuous power planes are recommended for the 1.2V core and 3.3V/2.5V auxiliary rails. Designers should use the Quartus II PowerPlay early-power estimator and pin planner before final layout, and follow Altera's recommended decoupling network to keep core-rail ripple within the device's specification.
This page synthesizes distributor pricing, drop-in same-package alternatives within the Stratix II GX family, and practical design notes not consolidated in the manufacturer datasheet alone.
Drop-in-Alternativen für EP2SGX90FF1508I3N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP2SGX90FF1508I3N (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, RoHS Status, Operating Temperature, Configuration Method.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP2SGX90FF1508I3
✅ Drop-In✓ Auf Lager
$1195 / Stück
Datenblatt ansehen →EP2SGX90FF1508C3N
✅ Drop-In✓ Auf Lager
$1295 / Stück
Datenblatt ansehen →EP2SGX90FF1508C4N
✅ Drop-In✓ Auf Lager
$1500 / Stück
Datenblatt ansehen →EP2SGX90FF1508
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →EP2SGX90FF1508C5N
✅ Drop-In✓ Auf Lager
$1380 / Stück
Datenblatt ansehen →EP2SGX130GF1508I5N
✅ Drop-In✓ Auf Lager
$372 / Stück
Datenblatt ansehen →EP2SGX90FF1508I3N Grenzwerte & elektrische Eigenschaften
| Family | Stratix II GX |
| Logic Elements (LE) | 90960 |
| Configurable Logic Blocks (CLBs) | 90960 |
| Embedded Memory (bits) | 4520448 |
| Memory Blocks | TriMatrix (M512/M4K/M-RAM) |
| Embedded Multipliers | 18x18-bit |
| Process Technology | 90 nm |
| Core Voltage | 1.2 V |
| Maximum Internal Clock Frequency | 816.9 MHz |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Gehäuse | 1508-ball FC-FBGA (flip-chip) |
| Terminal Form | Ball (BGA) |
| Number of Terminals | 1508 |
| Package Shape | Square |
| Configuration Method | EPC enhanced configuration device / JTAG |
| Multi-Gigabit Transceivers | Embedded (PCIe / RapidIO / GBE capable) |
| Speed Grade | I3N (industrial, fast) |
EP2SGX90FF1508I3N square Pinbelegungsleitfaden
Pinbelegung für EP2SGX90FF1508I3N (square-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP2SGX90FF1508I3N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP2SGX90FF1508I3N ist geeignet für 6 Anwendungs: Multi-Gigabit Serial Backplane Bridging, High-Throughput DSP for Radar and SDR, ASIC Prototyping and Emulation, High-Speed Data Acquisition Front-Ends, Industrial Imaging and Machine Vision, Defense and Avionics Communications.
Multi-Gigabit Serial Backplane Bridging
The EP2SGX90FF1508I3N's embedded multi-gigabit transceivers (PCIe, Serial RapidIO, and Gigabit Ethernet-capable PCS) and 90,960 logic elements allow it to bridge between backplanes, line cards, and switch fabrics in telecom and datacom systems. Placed on a mid-plane card with the device's 1508-ball FC-FBGA package, the FPGA converts between SAS, SATA, Aurora, or proprietary serial links at line rate while offloading framing and CRC tasks from an adjacent ASIC. At the I3N speed grade the transceiver channels achieve full-rate operation under industrial thermal conditions, which is critical for outdoor equipment enclosures. Designers should follow Altera's Stratix II GX PCB layout guidelines for differential-pair routing and AC-coupling capacitors to maintain link BER at 10 Gbps.
Empfohlen
High-Throughput DSP for Radar and SDR
With 90,960 logic elements plus embedded 18x18 multipliers and 4.5 Mbit of TriMatrix memory, the EP2SGX90FF1508I3N is well matched to radar processing pipelines and software-defined radio baseband designs. The device can host FIR filters, FFT cores, and pulse-compression blocks at the I3N speed grade while the embedded memory buffers large FFT windows in real time. The industrial -40C to +100C temperature grade also makes the part viable for outdoor and avionics installations where commercial-grade parts are unsuitable. Typical Quartus II IP cores for FFT and digital down-conversion close timing comfortably within the 816.9 MHz internal clock ceiling.
Empfohlen
ASIC Prototyping and Emulation
The EP2SGX90FF1508I3N integrates 90,960 LEs, embedded multipliers, and abundant user I/O across the 1508-ball FC-FBGA package, making it a strong platform for ASIC prototyping and in-circuit emulation of large SoCs. Multi-FPGA partitioning is straightforward because the Stratix II GX family shares configuration methodology and I/O standards with other densities in the family, allowing designers to scale a single prototype image across larger or smaller parts. The industrial temperature grade also supports emulating realistic operating conditions. Designers should budget LUT utilization carefully because Quartus II routing overhead grows non-linearly above 75% logic density utilization.
Empfohlen
High-Speed Data Acquisition Front-Ends
In data-acquisition and instrumentation front-ends, the EP2SGX90FF1508I3N buffers multi-channel ADC samples and performs real-time decimation, windowing, and triggering in fabric. The 4,520,448 bits of embedded memory store sample bursts without external SRAM, while LVDS I/O allows direct connection to high-channel-count ADC banks. The I3N speed grade keeps internal pipelining fast enough to keep pace with multi-hundred-MHz ADC sample clocks. Combined with the industrial temperature range, the device is also viable in test-and-measurement chassis that are deployed outside climate-controlled labs.
Empfohlen
Industrial Imaging and Machine Vision
The EP2SGX90FF1508I3N's parallel fabric and LVDS I/O enable real-time image processing for machine vision, line-scan inspection, and high-frame-rate medical imaging. The device can host Bayer-to-RGB conversion, histogram equalization, and Sobel/Canny edge-detection kernels, while external DDR2 memory interfaces stream processed frames to downstream processors. The -40C to +100C industrial grade ensures reliable operation on factory floors with elevated ambient temperatures. Designers should leverage Altera's VIP (Video and Image Processing) IP suite in Quartus II for production-ready pipelines.
Empfohlen
Defense and Avionics Communications
Defense communications systems leverage the EP2SGX90FF1508I3N for secure, high-throughput signal processing and protocol bridging, where the industrial temperature grade and embedded transceivers are essential for ruggedized equipment. The device can host crypto accelerators, link-layer FEC, and protocol-stack logic in one fabric while the 1508-ball FC-FBGA package handles the high pin-count needed for parallel backplane interfaces. Multi-gigabit transceivers enable encrypted backbone links at line rate. Design teams should plan for long-term support by ensuring firmware (Quartus II bitstreams) is reproducible from a controlled source-management system.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP2SGX90FF1508I3N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP2SGX90FF1508I3 | EP2SGX90FF1508C3N | EP2SGX90FF1508C4N | EP2SGX90FF1508 | EP2SGX90FF1508C5N | EP2SGX130GF1508I5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1508-ball FC-FBGA | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same |
| Logic Elements | 90960 | 90960 | 90960 | 90960 | 90960 | 90960 | 132540 |
| Embedded Memory (bits) | 4520448 | 4520448 | 4520448 | 4520448 | 4520448 | 4520448 | 6747840 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
Wichtigste Unterscheidungsmerkmale
- Highest same-density speed grade with industrial thermal envelope (vs. EP2SGX90FF1508C3N)
- Higher density available at the same FC-FBGA-1508 footprint (vs. EP2SGX130GF1508I5N)
- Smaller BGA footprint option at lower density for cost-sensitive designs (vs. EP2SGX60FF1152)
Designhinweise
The 1508-ball FC-FBGA package has a fine ball pitch that requires microvia and via-in-pad PCB fabrication for reliable assembly. Use at least six PCB layers with continuous 1.2V core and 3.3V/2.5V auxiliary power planes, and follow the Stratix II GX device handbook decoupling network: bulk caps on every plane, plus 0402/0201 ceramic decaps placed as close as possible to each BGA quadrant for high-frequency noise suppression.
Multi-gigabit transceiver channels demand controlled-impedance differential routing (typically 100 ohm differential) with maximum length-matched to within 150 mil across a pair. Place AC-coupling capacitors close to the receiver pins per the Stratix II GX PCB layout guidelines, and avoid routing signals across plane splits to maintain BER at 10 Gbps line rate.
Estimated: at typical utilization (75% LEs, 50% transceivers active, 50% memory toggling), the device consumes roughly 8 to 12 W dynamic power and may require airflow of 200 LFM or more to stay within the industrial junction-temperature envelope. Use the Quartus II PowerPlay early-power estimator for accurate budgeting, and consider a heat-spreader or thermal interface material if the chassis is sealed.
Do not assume the same Quartus II bitstream works across I3N, I3, C3N, C4N, and C5N speed bins: each speed grade has a distinct device support file with different timing models, recompile targets. Verify pinout compatibility explicitly using the per-density pinout files; pinouts may differ between densities in the same package family even when the BGA ball map looks identical.
Compliance-Informationen
RoHS, REACH, lead-free, halogen-free, and conflict-minerals status were not present in the Verified Web Data for this mature Altera/Intel FPGA part; refer to the original manufacturer documentation or lot-specific declaration for definitive compliance information.
