EP3C25F256C8 - 24,624-Cell FPGA | Intel | Industrial
Teilenummer: EP3C25F256C8 ✓ AktivEP3C25F256C8 Übersicht
A field-programmable gate array is a semiconductor in the programmable-logic and semiconductor hierarchy. Unlike an application-specific integrated circuit, an FPGA combines configurable logic, memory, and I/O resources on one device. The programmer can configure these resources after manufacture, allowing design revisions, field updates, and implementation of multiple digital functions without changing the PCB.
The EP3C25F256C8 combines 24,624 logic cells with up to 156 I/Os in a compact 256-pin package. Its maximum stated operating frequency is 402 MHz, while its 1.2 V core voltage supports low-power digital implementations. The 65 nm fabrication process and 608,256 embedded-memory bits provide additional capacity for state machines, data buffers, control logic, and parallel processing pipelines.
The Cyclone III architecture is intended to balance programmable functionality, device count, and cost. Because an FPGA combines fixed silicon with user-programmed configuration, design performance depends on the selected clocking, memory, I/O, and logic implementation. Engineers must also account for configuration setup, signal-integrity requirements, and the finite resources of the 24,624-cell device when partitioning larger system functions.
Typical uses include industrial automation, networking equipment, embedded control, video and image processing, communications infrastructure, and test equipment. The device is appropriate when field programmability, short design cycles, or parallel hardware logic are more valuable than implementing the design with a fixed microcontroller or ASIC.
When planning a PCB, engineers should follow the exact package drawing, ball map, power-supply requirements, and decoupling recommendations in the manufacturer datasheet. Designers should also verify the speed grade, temperature grade, configuration interface, clock topology, and I/O standards before releasing a production layout.
This page consolidates verified device specifications, current distributor information, same-family drop-in alternatives, and application-focused engineering guidance. It adds practical package and sourcing context beyond a basic distributor listing while clearly separating verified facts from information that still requires manufacturer documentation.
Drop-in-Alternativen für EP3C25F256C8 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP3C25F256C8 (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Device Type, Mounting Type, Logic Blocks, Logic Elements.
EP3C25F256C8N
✅ Drop-InPreis auf Anfrage
Datenblatt ansehen →EP3C25F256C7
✅ Drop-In ⚠️ Spezifikationen ungeprüftPreis auf Anfrage
Datenblatt ansehen →EP3C25F256C7N
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
EP3C25F256I7N
✅ Drop-In ⚠️ Spezifikationen ungeprüftPreis auf Anfrage
Datenblatt ansehen →EP3C25F256I7N
✅ Drop-In ⚠️ Spezifikationen ungeprüftPreis auf Anfrage
Datenblatt ansehen →EP3C25F256I8
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
EP3C25F256I8N
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
EP3C25F256C8 Grenzwerte & elektrische Eigenschaften
| Device Type | Cyclone III FPGA |
| Logic Cells | 24,624 cells |
| Maximum Frequency | 402 MHz |
| Fabrication Technology | 65 nm |
| Core Supply Voltage | 1.2 V |
| Embedded Memory | 608,256 bits |
| User I/O Count | 156 I/Os |
| Logic Blocks | 1,539 LABs |
| Package Type | 256-pin FBGA |
| Package Pin Count | 256 pins |
| Package Standard | MS-034 FBGA-256 |
| Montageart | Surface mount |
| Betriebstemperatur | -40 °C to +125 °C |
| Lead-Free Status | Lead-free package |
| Programmable Logic Type | SRAM-configured FPGA |
| FPGA Family | Cyclone III |
| Product Category | Field programmable gate arrays |
EP3C25F256C8 ms-034 fbga-256 Pinbelegungsleitfaden
Pinbelegung für EP3C25F256C8 (ms-034 fbga-256-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP3C25F256C8.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP3C25F256C8 ist geeignet für 6 Anwendungs: Industrial Automation and Control, Communication and Network Interface, Video and Image Processing, Test and Measurement Equipment, Embedded Instrumentation and Data Acquisition, Programmable Logic Consolidation.
Industrial Automation and Control
The EP3C25F256C8 fits factory-control modules that combine parallel logic, state-machine processing, and multiple peripheral interfaces. Its 24,624 logic cells and 608,256 embedded-memory bits provide space for motion sequencing, interlocks, data acquisition, and communication-protocol handling, while the 156 user I/Os support external sensors and actuators. According to the verified specifications, the device operates from a 1.2 V core supply and is listed up to 402 MHz. A practical implementation should partition deterministic control logic into registered pipelines, reserve I/O resources for external standards, and use Quartus Prime timing reports to confirm that the selected clock and I/O paths close at system operating conditions.
Empfohlen
Communication and Network Interface
The EP3C25F256C8 is appropriate for fixed-function protocol handling, packet filtering, test patterns, and parallel data-plane logic. Its 24,624 logic cells can support parallel lanes, while 608,256 embedded-memory bits can hold packet buffers, lookup tables, or counters; the 156 I/Os permit direct parallel interfaces to transceivers or supporting processors. According to the verified data, the core voltage is 1.2 V and the maximum stated frequency is 402 MHz. The key implementation consideration is timing: clock-domain crossings, transceiver latency, and packet-rate requirements must be evaluated together rather than inferring system throughput from the device's maximum frequency. A final design should also verify supported I/O standards against the selected external interface.
Empfohlen
Video and Image Processing
The EP3C25F256C8 can implement parallel pixel pipelines, color conversion, thresholding, and test-pattern generation because its programmable logic resources can execute multiple operations concurrently. The verified device data identifies 24,624 logic cells, 608,256 embedded-memory bits, and 156 user I/Os, which makes the device suitable for moderate-resolution parallel video functions. According to the same specification summary, the maximum frequency is 402 MHz and the core supply is 1.2 V. Designers should implement line buffers in block RAM, register pipeline stages to constrain timing paths, and use separate clocking for external video interfaces. Pixel-rate calculation remains essential because a 402 MHz device maximum does not automatically guarantee the required throughput after routing, I/O, and memory-access overhead are included.
Empfohlen
Test and Measurement Equipment
The EP3C25F256C8 is well suited to configurable test logic, timing generators, pattern sequencing, and instrument-control interfaces. Its 24,624 logic cells allow several independent channels or a reusable timing engine, and the 608,256-bit memory capacity can support pattern tables and acquisition buffers. According to the verified datasheet indexes, the device is a 65 nm Cyclone III FPGA with a stated 402 MHz maximum frequency and 156 user I/Os. For laboratory equipment, engineers should reserve pins for trigger and reference signals, keep analog functions outside the FPGA, and document configuration handling so the instrument can recover predictably after power cycling. Final channel timing must be validated against the required instrument accuracy and jitter budget.
Empfohlen
Embedded Instrumentation and Data Acquisition
The EP3C25F256C8 can collect parallel sensor outputs, perform real-time filtering, and format results for a host processor. Its 24,624 logic cells support concurrent acquisition channels, while 608,336 embedded-memory bits provide storage for samples and intermediate results. According to the verified Cyclone III specification, the device includes 156 I/Os and uses a 1.2 V core supply, allowing several sensor or digital-interface blocks to share one programmable device. The practical benefit is deterministic parallel processing: sensor outputs can enter registered pipelines, calculations can execute in parallel, and only summarized data needs to be transferred externally. Designers must define acquisition latency, sample accuracy, anti-aliasing, and clock domains before committing the implementation, because FPGA logic does not remove analog input limitations.
Empfohlen
Programmable Logic Consolidation
The EP3C25F256C8 is useful when several fixed functions must be consolidated into one configurable device, including protocol conversion, timing, arbitration, and interface adaptation. The verified 24,624-cell resource count and 608,256 embedded-memory bits provide more parallelism than a small programmable logic device, while the 256-pin FBGA supports up to 156 user I/Os for board-level connectivity. According to the verified family summary, the device is fabricated on a 65 nm process with a 1.2 V core supply. Consolidation can reduce component count, but it also concentrates failure impact and makes timing closure more demanding. Engineers should use a verified pin plan, maintain power-domain isolation, run static timing analysis after each place-and-route iteration, and confirm that the final design remains serviceable if the FPGA configuration is corrupted.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP3C25F256C8 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP3C25F256C8N | EP3C25F256C7 | EP3C25F256I7 | EP3C25F256I8 | EP3C25F256C8 |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | FBGA-256 | FBGA-256 - same package | FBGA-256 - same package | FBGA-256 - same package | FBGA-256 - same package | FBGA-256 - same package |
| FPGA Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
| Logic Cells | 24,624 cells | 24,624 cells | 24,624 cells | 24,624 cells | 24,624 cells | 24,624 cells |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| User I/O Count | 156 I/Os | 156 I/Os | 156 I/Os | 156 I/Os | 156 I/Os | 156 I/Os |
| Fabrication Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Embedded Memory | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits |
Wichtigste Unterscheidungsmerkmale
- Large programmable resource count for a compact Cyclone III design (vs. EP3C25F256C8N)
- Same-package migration with no PCB modification (vs. EP3C25F256C8N)
- Substantial I/O availability for parallel interfaces (vs. EP3C25F256C7)
- Verified 402 MHz headline performance (vs. EP3C25F256I8)
Designhinweise
Treat the 256-pin FBGA as a fine-pitch BGA design rather than a conventional leaded package. According to the verified package description, the device uses an MS-034 FBGA-256 outline and provides 156 user I/Os, so the remaining balls serve power, ground, configuration, clock, and other fixed functions. Use the manufacturer ball map and land pattern without relabeling signals from another Cyclone III package. Check escape-routing capacity, via geometry, solder-mask definition, and component placement before releasing artwork.
Separate the documented 1.2 V core requirement from auxiliary I/O and configuration rails. According to the verified specification summary, the EP3C25F256C8 uses a 1.2 V core, but the power architecture and allowable rail combinations are not included in the supplied excerpts. Follow the manufacturer regulator-selection and decoupling sections for sequencing, current limits, and capacitor requirements. Confirm steady-state and transient current against Quartus Prime power estimates before selecting the supply components.
Plan configuration, clock, and high-speed interface routing before assigning the general-purpose user I/Os. The device includes configuration resources, and a damaged or poorly terminated configuration path can prevent operation even when the logic design is correct. Preserve the manufacturer's recommended configuration interface topology, provide stable clocking, avoid routing sensitive signals beneath noisy supplies, and isolate configuration resources from general I/O where the pin constraints permit. Review the final pin assignment against the package drawing rather than relying on an inherited schematic.
Do not treat a 402 MHz maximum device frequency as guaranteed logic throughput. According to the verified specifications, 402 MHz is a device-level headline value; actual timing depends on selected speed grade, clocking scheme, logic depth, routing, memory access, and I/O timing. Build the design in Quartus Prime, inspect timing reports at the actual board clock, and reserve margin for temperature and supply variation. Also verify that every selected EP3C25F256C8 suffix is allowed by the schematic, BOM, and qualification plan.
Compliance-Informationen
The verified package listing identifies the EP3C25F256C8 as lead-free, but the supplied excerpts do not explicitly establish RoHS, REACH, halogen-free, AEC-Q100, or conflict-minerals status.
