EP3C25F256C8 - 24,624-Cell FPGA | Intel | Industrial
N.º da peça: EP3C25F256C8 ✓ AtivoEP3C25F256C8 Visão geral
A field-programmable gate array is a semiconductor in the programmable-logic and semiconductor hierarchy. Unlike an application-specific integrated circuit, an FPGA combines configurable logic, memory, and I/O resources on one device. The programmer can configure these resources after manufacture, allowing design revisions, field updates, and implementation of multiple digital functions without changing the PCB.
The EP3C25F256C8 combines 24,624 logic cells with up to 156 I/Os in a compact 256-pin package. Its maximum stated operating frequency is 402 MHz, while its 1.2 V core voltage supports low-power digital implementations. The 65 nm fabrication process and 608,256 embedded-memory bits provide additional capacity for state machines, data buffers, control logic, and parallel processing pipelines.
The Cyclone III architecture is intended to balance programmable functionality, device count, and cost. Because an FPGA combines fixed silicon with user-programmed configuration, design performance depends on the selected clocking, memory, I/O, and logic implementation. Engineers must also account for configuration setup, signal-integrity requirements, and the finite resources of the 24,624-cell device when partitioning larger system functions.
Typical uses include industrial automation, networking equipment, embedded control, video and image processing, communications infrastructure, and test equipment. The device is appropriate when field programmability, short design cycles, or parallel hardware logic are more valuable than implementing the design with a fixed microcontroller or ASIC.
When planning a PCB, engineers should follow the exact package drawing, ball map, power-supply requirements, and decoupling recommendations in the manufacturer datasheet. Designers should also verify the speed grade, temperature grade, configuration interface, clock topology, and I/O standards before releasing a production layout.
This page consolidates verified device specifications, current distributor information, same-family drop-in alternatives, and application-focused engineering guidance. It adds practical package and sourcing context beyond a basic distributor listing while clearly separating verified facts from information that still requires manufacturer documentation.
Alternativas drop-in para EP3C25F256C8 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3C25F256C8 (mesmo formato e footprint) — diferindo em Operating Temperature, Device Type, Mounting Type, Logic Blocks, Logic Elements.
EP3C25F256C8N
✅ Drop-InConsulte o preço
Ver ficha técnica →EP3C25F256C7
✅ Drop-In ⚠️ Especificações não verificadasConsulte o preço
Ver ficha técnica →EP3C25F256C7N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP3C25F256I7N
✅ Drop-In ⚠️ Especificações não verificadasConsulte o preço
Ver ficha técnica →EP3C25F256I7N
✅ Drop-In ⚠️ Especificações não verificadasConsulte o preço
Ver ficha técnica →EP3C25F256I8
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP3C25F256I8N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP3C25F256C8 Classificações máximas e características elétricas
| Device Type | Cyclone III FPGA |
| Logic Cells | 24,624 cells |
| Maximum Frequency | 402 MHz |
| Fabrication Technology | 65 nm |
| Core Supply Voltage | 1.2 V |
| Embedded Memory | 608,256 bits |
| User I/O Count | 156 I/Os |
| Logic Blocks | 1,539 LABs |
| Package Type | 256-pin FBGA |
| Package Pin Count | 256 pins |
| Package Standard | MS-034 FBGA-256 |
| Tipo de montagem | Surface mount |
| Temperatura de operação | -40 °C to +125 °C |
| Lead-Free Status | Lead-free package |
| Programmable Logic Type | SRAM-configured FPGA |
| FPGA Family | Cyclone III |
| Product Category | Field programmable gate arrays |
Guia de Configuração de Pinos do EP3C25F256C8 ms-034 fbga-256
Configuração de pinos para EP3C25F256C8 (pacote ms-034 fbga-256). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP3C25F256C8.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP3C25F256C8 é adequado para 6 aplicaçãos: Industrial Automation and Control, Communication and Network Interface, Video and Image Processing, Test and Measurement Equipment, Embedded Instrumentation and Data Acquisition, Programmable Logic Consolidation.
Industrial Automation and Control
The EP3C25F256C8 fits factory-control modules that combine parallel logic, state-machine processing, and multiple peripheral interfaces. Its 24,624 logic cells and 608,256 embedded-memory bits provide space for motion sequencing, interlocks, data acquisition, and communication-protocol handling, while the 156 user I/Os support external sensors and actuators. According to the verified specifications, the device operates from a 1.2 V core supply and is listed up to 402 MHz. A practical implementation should partition deterministic control logic into registered pipelines, reserve I/O resources for external standards, and use Quartus Prime timing reports to confirm that the selected clock and I/O paths close at system operating conditions.
Recomendado
Communication and Network Interface
The EP3C25F256C8 is appropriate for fixed-function protocol handling, packet filtering, test patterns, and parallel data-plane logic. Its 24,624 logic cells can support parallel lanes, while 608,256 embedded-memory bits can hold packet buffers, lookup tables, or counters; the 156 I/Os permit direct parallel interfaces to transceivers or supporting processors. According to the verified data, the core voltage is 1.2 V and the maximum stated frequency is 402 MHz. The key implementation consideration is timing: clock-domain crossings, transceiver latency, and packet-rate requirements must be evaluated together rather than inferring system throughput from the device's maximum frequency. A final design should also verify supported I/O standards against the selected external interface.
Recomendado
Video and Image Processing
The EP3C25F256C8 can implement parallel pixel pipelines, color conversion, thresholding, and test-pattern generation because its programmable logic resources can execute multiple operations concurrently. The verified device data identifies 24,624 logic cells, 608,256 embedded-memory bits, and 156 user I/Os, which makes the device suitable for moderate-resolution parallel video functions. According to the same specification summary, the maximum frequency is 402 MHz and the core supply is 1.2 V. Designers should implement line buffers in block RAM, register pipeline stages to constrain timing paths, and use separate clocking for external video interfaces. Pixel-rate calculation remains essential because a 402 MHz device maximum does not automatically guarantee the required throughput after routing, I/O, and memory-access overhead are included.
Recomendado
Test and Measurement Equipment
The EP3C25F256C8 is well suited to configurable test logic, timing generators, pattern sequencing, and instrument-control interfaces. Its 24,624 logic cells allow several independent channels or a reusable timing engine, and the 608,256-bit memory capacity can support pattern tables and acquisition buffers. According to the verified datasheet indexes, the device is a 65 nm Cyclone III FPGA with a stated 402 MHz maximum frequency and 156 user I/Os. For laboratory equipment, engineers should reserve pins for trigger and reference signals, keep analog functions outside the FPGA, and document configuration handling so the instrument can recover predictably after power cycling. Final channel timing must be validated against the required instrument accuracy and jitter budget.
Recomendado
Embedded Instrumentation and Data Acquisition
The EP3C25F256C8 can collect parallel sensor outputs, perform real-time filtering, and format results for a host processor. Its 24,624 logic cells support concurrent acquisition channels, while 608,336 embedded-memory bits provide storage for samples and intermediate results. According to the verified Cyclone III specification, the device includes 156 I/Os and uses a 1.2 V core supply, allowing several sensor or digital-interface blocks to share one programmable device. The practical benefit is deterministic parallel processing: sensor outputs can enter registered pipelines, calculations can execute in parallel, and only summarized data needs to be transferred externally. Designers must define acquisition latency, sample accuracy, anti-aliasing, and clock domains before committing the implementation, because FPGA logic does not remove analog input limitations.
Recomendado
Programmable Logic Consolidation
The EP3C25F256C8 is useful when several fixed functions must be consolidated into one configurable device, including protocol conversion, timing, arbitration, and interface adaptation. The verified 24,624-cell resource count and 608,256 embedded-memory bits provide more parallelism than a small programmable logic device, while the 256-pin FBGA supports up to 156 user I/Os for board-level connectivity. According to the verified family summary, the device is fabricated on a 65 nm process with a 1.2 V core supply. Consolidation can reduce component count, but it also concentrates failure impact and makes timing closure more demanding. Engineers should use a verified pin plan, maintain power-domain isolation, run static timing analysis after each place-and-route iteration, and confirm that the final design remains serviceable if the FPGA configuration is corrupted.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3C25F256C8 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3C25F256C8N | EP3C25F256C7 | EP3C25F256I7 | EP3C25F256I8 | EP3C25F256C8 |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | FBGA-256 | FBGA-256 - same package | FBGA-256 - same package | FBGA-256 - same package | FBGA-256 - same package | FBGA-256 - same package |
| FPGA Family | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III | Cyclone III |
| Logic Cells | 24,624 cells | 24,624 cells | 24,624 cells | 24,624 cells | 24,624 cells | 24,624 cells |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| User I/O Count | 156 I/Os | 156 I/Os | 156 I/Os | 156 I/Os | 156 I/Os | 156 I/Os |
| Fabrication Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
| Embedded Memory | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits |
Principais diferenciais
- Large programmable resource count for a compact Cyclone III design (vs EP3C25F256C8N)
- Same-package migration with no PCB modification (vs EP3C25F256C8N)
- Substantial I/O availability for parallel interfaces (vs EP3C25F256C7)
- Verified 402 MHz headline performance (vs EP3C25F256I8)
Notas de projeto
Treat the 256-pin FBGA as a fine-pitch BGA design rather than a conventional leaded package. According to the verified package description, the device uses an MS-034 FBGA-256 outline and provides 156 user I/Os, so the remaining balls serve power, ground, configuration, clock, and other fixed functions. Use the manufacturer ball map and land pattern without relabeling signals from another Cyclone III package. Check escape-routing capacity, via geometry, solder-mask definition, and component placement before releasing artwork.
Separate the documented 1.2 V core requirement from auxiliary I/O and configuration rails. According to the verified specification summary, the EP3C25F256C8 uses a 1.2 V core, but the power architecture and allowable rail combinations are not included in the supplied excerpts. Follow the manufacturer regulator-selection and decoupling sections for sequencing, current limits, and capacitor requirements. Confirm steady-state and transient current against Quartus Prime power estimates before selecting the supply components.
Plan configuration, clock, and high-speed interface routing before assigning the general-purpose user I/Os. The device includes configuration resources, and a damaged or poorly terminated configuration path can prevent operation even when the logic design is correct. Preserve the manufacturer's recommended configuration interface topology, provide stable clocking, avoid routing sensitive signals beneath noisy supplies, and isolate configuration resources from general I/O where the pin constraints permit. Review the final pin assignment against the package drawing rather than relying on an inherited schematic.
Do not treat a 402 MHz maximum device frequency as guaranteed logic throughput. According to the verified specifications, 402 MHz is a device-level headline value; actual timing depends on selected speed grade, clocking scheme, logic depth, routing, memory access, and I/O timing. Build the design in Quartus Prime, inspect timing reports at the actual board clock, and reserve margin for temperature and supply variation. Also verify that every selected EP3C25F256C8 suffix is allowed by the schematic, BOM, and qualification plan.
Informações de conformidade
The verified package listing identifies the EP3C25F256C8 as lead-free, but the supplied excerpts do not explicitly establish RoHS, REACH, halogen-free, AEC-Q100, or conflict-minerals status.
