Altera

EP3C5F256C7 - Cyclone III FPGA, 5,136 LE | Altera

Teilenummer: EP3C5F256C7 ✓ Aktiv
Auf Lager Versand in 1–3 Werktagen
1.2 V Vdss 256-LBGA Package 437.5 MHz Speed
Ab $15.53 USD / Stück
MOQ: 1 |
Preis aktualisiert: 2026-09-09
Mengenpreise
Menge Stückpreis Gesamt
1 $25.02 $25,02
10 $21.27 $212,70
100 $18.96 $1.896,00
500 $16.88 $8.440,00
1.000 $15.53 $15.530,00
ℹ️ Alle Preise sind in USD

EP3C5F256C7 Übersicht

The Altera EP3C5F256C7 is a Cyclone III FPGA that integrates 5,136 logic elements, 423,936 RAM bits and 182 user I/O pins in a 256-ball LBGA package. Built on a 65 nm process with a 1.2 V core supply, it is rated for a listed 437.5 MHz internal clock frequency and is intended for low-cost, high-volume logic integration in commercial equipment.

An FPGA, or field-programmable gate array, is a reconfigurable integrated circuit whose logic fabric, routing and I/O behavior are defined after manufacturing by a configuration bitstream. Inside an FPGA hierarchy, the EP3C5F256C7 belongs to FPGA -> programmable logic -> integrated circuit, sitting above CPLDs in density but below high-end transceiver-rich FPGAs. Designers use FPGAs when requirements change after production or when parallel, low-latency custom datapaths are more efficient than a microcontroller or ASIC. The Cyclone III family specifically targets low-power, cost-sensitive applications.

Key features include 5,136 logic elements for implementing state machines, counters and datapath logic; 423,936 RAM bits for FIFO and line buffers; 182 user I/O configured to various voltage levels and I/O standards; and a 256-ball BGA enabling compact routing. The 1.2 V core and 65 nm process reduce static and dynamic power relative to older 90 nm FPGAs. The commercial C7 ordering grade balances speed and temperature for standard equipment.

At the architecture level, the 65 nm fabric uses logic array blocks connected by programmable routing; embedded memory and I/O elements are fixed resources surrounding the core. Designers compile HDL with Intel/Altera Quartus II or Quartus Prime, which maps logic, performs placement and routing, and generates bitstreams stored in EPCS or EPCQ serial configuration devices. The 437.5 MHz figure from distributor data indicates the internal clock performance achievable for speed grade 7 in favorable designs; final Fmax depends on placement, fanout and I/O standard. The 256-ball LBGA package is square with ball terminals, allowing four-layer board integration.

Typical applications include motor-control platforms requiring flexible I/O mapping, low-cost video processing where parallel pixel data is manipulated, industrial communication bridges, and test instruments. Its 5,136 logic elements fit compact soft processors, custom serial interfaces and real-time control.

Design with adequate decoupling on VCC, VCCIO and PLL supplies, and store the configuration bitstream in a dedicated serial configuration memory. Because this density offers only 182 I/O, verify pin assignments before layout and review power integrity at the 1.2 V core.

This page compounds distributor pricing and availability, same-family drop-in alternatives, and practical integration notes beyond the raw datasheet. Facts here were checked against DigiKey, Mouser, Heisener, Octopart and datasheet-aggregator records in September 2026.

Drop-in-Alternativen für EP3C5F256C7 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit EP3C5F256C7 (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, RoHS Status, PLLs, Process Technology.

Intel
Operating Temperature: 0 C to +85 C (commercial "C6" speed grade)
Package: 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch
PLLs: 2
Vergleichen mit EP3C5F256C7 →
Intel
Operating Temperature: 0C to +85C (commercial, per 'C' speed bin)
Package: 256-LBGA (FineLine BGA, 17x17 mm)
RoHS Status: Compliant (lead-free FBGA)
Vergleichen mit EP3C5F256C7 →
Intel
Operating Temperature: -40°C to +125°C
RoHS Status: Lead Free, MS-034
PLLs: Yes (general-purpose PLLs)
Vergleichen mit EP3C5F256C7 →
Intel
Operating Temperature: 0C to 85C (Commercial)
Package: 256-ball FBGA (FineLine BGA)
RoHS Status: Lead Free (per Altera/Intel product page)
Vergleichen mit EP3C5F256C7 →
Intel
Operating Temperature: -40C to +125C (Industrial)
Package: 256-FBGA (FineLine BGA)
RoHS Status: Compliant
Vergleichen mit EP3C5F256C7 →

Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:

EP3C5F256C8N

✅ Drop-In
Intel
📦 256-LBGA (FBGA-256)
Cyclone III · Cyclone III (EP3C5) · 5,136 · 423,936 · 414 Kbits · 23 · 4 · 182

✓ Auf Lager

$10.95 / Stück

Datenblatt ansehen →

EP3C5F256I7

✅ Drop-In
Intel
📦 256-LBGA (FBGA-256)
Cyclone III · FPGA (Field Programmable Gate Array) · 5136 · 423936 bits · 182 · 256-LBGA (FBGA-256) · Square · 256

✓ Auf Lager

$22.36 / Stück

Datenblatt ansehen →

EP3C5F256C6N

✅ Drop-In ⚠️ Spezifikationen ungeprüft
Intel
📦 256-LBGA (FBGA-256)
Cyclone III · EP3C5 · 5136 · 182 (per DigiKey listing) · 423936 · 23 · 2 · 182

✓ Auf Lager

$18.85 / Stück

Datenblatt ansehen →

EP3C5F256I7N

✅ Drop-In ⚠️ Spezifikationen ungeprüft
Intel
📦 256-LBGA (FBGA-256)
Cyclone III · 5,136 · 423,936 bits · 26 · 2 · 182 · 256-FBGA (FineLine BGA) · -40C to +125C (Industrial)

✓ Auf Lager

$24 / Stück

Datenblatt ansehen →

EP3C5F256C7N

✅ Drop-In ⚠️ Spezifikationen ungeprüft
Intel
📦 256-LBGA (FBGA-256)
Cyclone III · FPGA - Field Programmable Gate Array · 5,136 · 182 · 423,936 bits (414 Kbit) · 23 · 46 · 182

✓ Auf Lager

$14.2 / Stück

Datenblatt ansehen →

EP3C5F256C7 Grenzwerte & elektrische Eigenschaften

Product Type FPGA - Field Programmable Gate Array
Series Cyclone III
Number of Logic Elements / Cells 5136
Total RAM Bits 423936 bits
Number of User I/O 182
Maximum Internal Clock Frequency 437.5 MHz
Core Supply Voltage 1.2 V
Process Technology 65 nm
Gehäuse / Bauform 256-LBGA
Alternate Package Description LEAD FREE, MS-034, FBGA-256
Number of Pins / Balls 256
Package Form Square, ball terminals
Montageart Surface Mount
JEDEC Package Code MS-034
Lead-Free Process Yes

EP3C5F256C7 ms-034 Pinbelegungsleitfaden

Pinbelegung für EP3C5F256C7 (ms-034-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.

Pinbelegungsdiagramm für EP3C5F256C7 im ms-034-Gehäuse

Keine detaillierten Pinbelegungsdaten verfügbar für EP3C5F256C7.

Siehe die Datenblatt für die vollständige Pin-Konfiguration.

Typische Anwendungen

EP3C5F256C7 ist geeignet für 6 Anwendungs: Industrial Motor Control, Video and Pixel Processing, Industrial Communication Bridge, Medical Sensor Front End, Software-Defined Radio and Instrumentation, IoT Edge Aggregation Gateway.

🏭

Industrial Motor Control

Motor control is an immediate fit for the EP3C5F256C7 because 5,136 logic elements can implement encoder interfaces, PWM timing and current-loop state machines without loading a host MCU. The 182 user I/O allow multi-axis feedback signals, gate-driver enables and isolated digital I/O to be mapped across banks. With 423,936 RAM bits, designers can hold commutation tables or circular buffers for resolver and encoder data. In an industrial drive, the FPGA sits between an MCU and power stage: it conditions hall/encoder inputs, generates complementary PWM with dead-time insertion and latches fault flags. Unlike a fixed MCU peripheral set, the logic fabric can be reconfigured when motor type or control algorithm changes, reducing board re-spins. The 1.2 V core in 65 nm dissipates less dynamic power than older FPGAs, simplifying thermal design in IP20 enclosures. Resource use for a single PMSM FOC with encoder is roughly 1,500-2,500 LEs, leaving headroom for safety functions, Modbus or Ethernet packet assist.

📺

Video and Pixel Processing

In video systems, the EP3C5F256C7 provides a compact parallel datapath for pixel timing, line buffering and overlay generation. 5,136 logic elements can implement a video timing generator, simple scaler and color-space converter, while 423,936 RAM bits are enough for several full line buffers. The 182 user I/O support TTL/CMOS and LVDS inputs to connect image sensors or deserializers. Because video processing is inherently clock-driven, the listed 437.5 MHz internal clock capability gives timing margin for pixel clocks in high-definition applications. The FPGA can synchronize video standards, insert test patterns, detect loss-of-sync and transfer frame data to an external framebuffer. It is especially useful in machine-vision cameras where custom sensor timing is required. Using Intel/Altera Quartus libraries, designers can create a deterministic pipeline with gated output clocks. Configuration is typically launched at power-up from an EPCS serial flash to avoid host loading delay.

🌐

Industrial Communication Bridge

Because this FPGA has parallel I/O and reconfigurable logic, it can adapt legacy or proprietary bus signals to standard host interfaces. Use UART, SPI, I2C and parallel masters inside 5,136 LEs, with FIFOs in 423,936 RAM bits to cross clock domains. 182 user I/O gives enough pins for optocoupler arrays, RS-485 transceivers and backplane buses. For example, an equipment bridge in a factory can capture an 8-bit parallel machine interface, frame the data to UART or SPI, and expose status over a host port. The 65 nm 1.2 V core suits 24 V to 48 V industrial boards with linear regulators; total dynamic power remains moderate at typical 100-200 MHz class clocks. The absence of hard transceivers means an Ethernet MAC can be implemented in fabric but needs an external PHY with MII or RMII. Reconfiguration enables protocol changes after deployment, lowering inventory cost in multi-customer equipment.

💊

Medical Sensor Front End

In medical monitoring and diagnostic instruments, the EP3C5F256C7 can aggregate disparate sensor streams and implement deterministic sequencing for AFE control, averaging and alarm logic. 5,136 logic elements are enough to implement digital demodulation for a photoplethysmography front end and simple digital filters; 423,936 bits provide window buffers. The 182 user I/O let the FPGA connect to analog front ends, memory and display controllers without a complex SoC. A low core voltage and 65 nm process help reduce power so the board remains cool in patient-facing housings. Engineers often pair the FPGA with an MCU for user interface and wireless connectivity; the FPGA offloads real-time sample handling and precise timing. Because certification expects deterministic and auditable behavior, VHDL or Verilog designs can be simulated and locked to a known bitstream. Use an EPCQ configuration device to support controlled field upgrades while preserving boot integrity.

✈️

Software-Defined Radio and Instrumentation

With 5,136 logic elements and 423,936 RAM bits, the EP3C5F256C7 is suitable for low-to-mid complexity SDR baseband processing that does not require high-rate hardened transceivers. It can implement FIR filters, numerically controlled oscillators, symbol synchronizers and framing logic, while external high-speed ADCs and DACs connect through parallel CMOS or LVDS I/O. 182 user I/O provide the bus width to move complex I/Q samples at moderate sample rates. A commercial C7 version is intended for indoor instrumentation; for deployed defense or outdoor radio equipment choose the I7 industrial variant if ambient temperatures exceed commercial limits. The FPGA gives deterministic latency for protocol processing and can be reconfigured for different modulation formats. Combine it with a precision ADC and an MCU for control-plane functions. This suits spectrum analyzers, signal generators, and custom data-acquisition instruments where flexible triggering and buffering are important.

🧩

IoT Edge Aggregation Gateway

In smart buildings and industrial IoT gateways, the EP3C5F256C7 can concentrate multiple low-speed buses, perform preprocessing and present data to a host processor. Its 182 I/O count is useful for DMX, DALI, 1-Wire, RS-485 or sensor arrays; the logic fabric implements each protocol as a lightweight state machine. 5,136 logic elements allow a soft CPU core or protocol translators, while 423,936 RAM bits buffer telemetry before forwarding over Ethernet or UART. Because the FPGA is not a microcontroller, it requires external configuration memory and power supplies, but it offers deterministic, parallel operation without software jitter. For IoT edge nodes with tight power budgets, the 65 nm Cyclone III core power is moderate and clock gating can reduce consumption. Use this part when you outgrow MCU peripheral sets but cannot justify an ASIC. It also suits gateways where one FPGA supports multiple protocol versions in the field.

Zusammenfassung der empfohlenen Produkte

EPCS4SI8N Serial configuration device for Cyclone III Verwendet in: Industrial Motor Control, IoT Edge Aggregation Gateway AD7606 Analog Devices Verwendet in: Industrial Motor Control EPCS16SI16N Larger serial configuration device for video bitstream Verwendet in: Video and Pixel Processing, Industrial Communication Bridge TVP7002 Video decoder for analog or component video input Verwendet in: Video and Pixel Processing KSZ9031RNX 10/100/1000 Ethernet PHY for MII/RMII MAC interface Verwendet in: Industrial Communication Bridge EPCQ16SI8N Configuration device for secure / reliable boot in medical equipment Verwendet in: Medical Sensor Front End ADS1298 Biopotential AFE for ECG/EEG front-end data acquisition Verwendet in: Medical Sensor Front End AD9643 14-bit dual ADC for wideband I/Q sampling Verwendet in: Software-Defined Radio and Instrumentation EPCQ32SI8N Configuration memory for multi-mode radio bitstreams Verwendet in: Software-Defined Radio and Instrumentation W5500 WIZnet Verwendet in: IoT Edge Aggregation Gateway
What is EP3C5F256C7?
The EP3C5F256C7 is an Altera Cyclone III FPGA containing 5,136 logic elements, 423,936 bits of embedded RAM and 182 user I/O pins in a 256-ball LBGA package. It is manufactured in 65 nm technology with a 1.2 V core supply and has a listed 437.5 MHz internal clock capability. It suits glue logic, motor control, video preprocessing and low-cost applications.
How much does EP3C5F256C7 cost?
As of September 9, 2026, Heisener lists a unit reference price of $25.0221 for EP3C5F256C7 with 7,616 pieces reported in stock. DigiKey, Mouser and Octopart also show the part. Volume pricing should be requested from distributors because FPGA prices vary with quantity, lead time and authorized stocking agreements.
Where can I buy EP3C5F256C7 online?
You can buy EP3C5F256C7 from DigiKey, Mouser, Heisener and other distributors that carry Intel/Altera Cyclone III FPGAs. DigiKey's product page states order today and ships today, and Heisener quotes a lead time to be confirmed. Always confirm stock, lifecycle and country-of-origin before ordering production quantities.
Is EP3C5F256C7 in stock at DigiKey or Mouser?
DigiKey shows EP3C5F256C7 as orderable and shipping today, while Mouser lists inventory and pricing. Heisener reports 7,616 pieces available. Stock status changes frequently, so check the distributor page at the time of purchase; Octopart can also be used to compare live inventory across multiple distributors.
What are the key specifications of EP3C5F256C7 that engineers should know?
Engineers should note that EP3C5F256C7 has 5,136 logic elements, 423,936 total RAM bits and 182 user I/O pins. It comes in a 256-LBGA / FBGA-256 package, uses a 1.2 V core supply, is built on 65 nm technology, and is specified for a 437.5 MHz internal clock in distributor data. DigChip also lists it as lead-free and JEDEC package MS-034.
EP3C5F256C7 vs EP3C5F256C8N - what is the difference?
The primary difference is speed grade: EP3C5F256C7 is the speed grade 7 commercial part, while EP3C5F256C8N is a speed grade 8 lead-free variant. Both share the same 256-pin FBGA package, same 5,136 logic-element Cyclone III core and same 182-I/O count, but maximum achievable clock frequencies will typically differ because of the speed grade.
EP3C5F256C7 vs EP3C5F256I7 - which is better?
EP3C5F256C7 has a commercial temperature grade, while EP3C5F256I7 has an industrial temperature grade. The logic capacity, RAM bits and I/O count are the same in both FPGA variants, and both use the 256-ball FBGA package. Choose I7 for industrial or outdoor equipment, but expect that industrial-grade parts may carry higher price or longer lead time.
When should I choose EP3C5F256C7 over EP3C5F256I7N?
Choose EP3C5F256C7 when your application operates in a commercial indoor environment and does not require extended temperature qualification. EP3C5F256C7 is the commercial speed grade 7 version, while EP3C5F256I7N is the lead-free industrial grade variant with an N suffix. Using the commercial part can reduce cost and improve availability if the full industrial temperature range is unnecessary.
Is EP3C5F256C7 suitable for motor-control applications?
Yes, EP3C5F256C7 is suitable for motor control because 5,136 logic elements can implement encoder interfaces, PWM generation, dead-time insertion and current-loop state machines. The 182 user I/O allow encoder inputs, gate-driver enables and isolated digital I/O to be mapped flexibly. Its 423,936 RAM bits can hold commutation tables, and the 1.2 V low-power core helps simplify thermal design in industrial enclosures.
Is EP3C5F256C7 the same as EP3C5F256C6N?
No, EP3C5F256C7 and EP3C5F256C6N are not identical, but they are closely related Cyclone III variants. EP3C5F256C7 is the commercial speed grade 7 part, while EP3C5F256C6N is a lead-free N-suffix part with speed grade 6. Both share the same 256-FBGA package, 5,136 logic elements, 423,936 RAM bits and 182 I/O, so layout compatibility is retained.
What is the best drop-in replacement for EP3C5F256C7?
EP3C5F256C7N is the closest drop-in replacement because it is the lead-free N-suffix version of the same commercial speed grade 7 Cyclone III FPGA. If a speed-grade change is acceptable, EP3C5F256C8N is another same-package 256-LBGA replacement. For industrial temperature, EP3C5F256I7 or EP3C5F256I7N provides the same logic core and pinout with an extended temperature option.
Where can I download the EP3C5F256C7 datasheet PDF?
Download the EP3C5F256C7 datasheet from the Intel/Altera Cyclone III product page or from datasheet aggregator sites such as datasheets.com and DigChip. The Cyclone III device datasheet and handbook contain electrical, switching and I/O timing specifications for EP3C5F256C7. The direct manufacturer PDF was not present in the verified web data, so use Intel's official Cyclone III page as the authoritative starting point.
What is the best cross-brand equivalent for EP3C5F256C7?
No verified cross-brand pin-compatible FPGA equivalent for EP3C5F256C7 is listed in the available web data. FPGA pinouts are proprietary, and a Xilinx, Lattice or Microchip FPGA in the same physical BGA package would not be ball-to-ball compatible without PCB redesign. For a drop-in replacement, stay within the Altera/Intel Cyclone III F256 family; for supply diversification, evaluate competing FPGAs at the board level.
How many logic elements and I/O pins does EP3C5F256C7 have?
EP3C5F256C7 has 5,136 logic elements and 182 user I/O pins, according to DigiKey and Mouser listings. It also contains 423,936 RAM bits. The 256-ball LBGA package is often described as 256-LBGA or FBGA-256 in distributor and datasheet data.

Technische Referenzdaten für EP3C5F256C7 – Vergleich, Designhinweise und Compliance-Informationen.

Auswahlhilfe

Choose EP3C5F256C7 when you need a commercial-temperature Cyclone III FPGA with 5,136 logic elements, 423,936 RAM bits and 182 I/O in the 256-pin FBGA package. It is a solid baseline for motor control, video preprocessing, industrial bridging and low-complexity SDR. Select EP3C5F256C8N if a slightly lower speed grade is acceptable and lead-free N-suffix supply is preferred. Select EP3C5F256C6N if you need a faster speed-grade commercial part and can accept the alternate ordering code. Choose EP3C5F256I7 or EP3C5F256I7N for industrial temperature environments requiring the same logic density. If you need the exact commercial speed grade 7 part with lead-free suffix, EP3C5F256C7N is the closest drop-in. No verified cross-brand drop-in FPGA exists, so stay inside the Cyclone III F256 family for board and bitstream reuse.

Vergleich mit Alternativen

Parameter Dieses Produkt EP3C5F256C8N EP3C5F256I7 EP3C5F256C6N EP3C5F256I7N EP3C5F256C7N
Package 256-LBGA (FBGA-256) 256-LBGA (FBGA-256) - same 256-LBGA (FBGA-256) - same 256-LBGA (FBGA-256) - same 256-LBGA (FBGA-256) - same 256-LBGA (FBGA-256) - same
Brand Altera Altera Altera Altera Altera Altera
Logic Elements 5136 5136 5136 5136 5136 5136
Total RAM Bits 423936 423936 423936 423936 423936 423936
User I/O 182 182 182 182 182 182
Temperature Grade Commercial (C suffix) Commercial (C suffix) Industrial (I suffix) Commercial (C suffix) Industrial (I suffix) Commercial (C suffix)
Speed Grade Suffix 7 8 7 6 7 7
Lead-Free Process Yes per DigChip listing Yes (N suffix) Confirm - no N suffix Yes (N suffix) Yes (N suffix) Yes (N suffix)

Wichtigste Unterscheidungsmerkmale

  • Commercial speed-grade 7 balance of logic density and clock performance (vs. EP3C5F256C8N)
  • Lower-cost commercial temperature option than industrial variants (vs. EP3C5F256I7 / EP3C5F256I7N)
  • Broad distributor availability and established Cyclone III ecosystem (vs. EP3C5F256C6N)

Designhinweise

FPGA configuration is volatile: EP3C5F256C7 must be configured at every power-up from an EPCS, EPCQ or host download cable. If configuration is incomplete, I/O pins may be tri-stated or weakly pulled and can drive downstream logic unpredictably. Verify CONF_DONE and nSTATUS signals, and choose a serial configuration device with enough capacity for the compiled bitstream.

The 1.2 V core supply is the most current-sensitive rail on Cyclone III. Place low-ESR bulk capacitors as well as 0.1 uF ceramic capacitors close to each core VCC ball, and use a power plane with multiple vias to the BGA lands. If VCCIO rails use different voltages, decouple each I/O bank independently and confirm that all rails reach their final value before releasing FPGA I/O during configuration.

A 256-ball LBGA requires at least four layers for reliable fanout and power integrity. Use dogbone or via-in-pad strategies only when the assembly process allows it; otherwise place microvias around power balls. Route critical LVDS or clock pairs with controlled impedance and matched length. Keep external configuration pins, nCONFIG and DCLK free of excessive capacitance to avoid configuration timing failures.

Compliance-Informationen

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Bleifrei
Yes
Halogenfrei
Unknown
Konfliktmineralien
Unknown

DigChip lists EP3C5F256C7 as LEAD FREE, MS-034, FBGA-256. The C7 part number does not carry an N suffix in the verified distributor listing, so the exact RoHS certificate should be confirmed with the supplier.

Daten verifiziert am: 2026-09-09 – Daten geprüft und kuratiert vom Bauteil-Engineering-Team von XAIPART

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Verwandte Bauteile & Begriffe

Altera Intel / Altera EP3C5F256C7 EP3C5F256C8N EP3C5F256C6N EP3C5F256I7 EP3C5F256I7N EP3C5F256C7N Cyclone III FPGA Field Programmable Gate Array Logic Elements Total RAM Bits User I/O FBGA-256 LBGA MS-034 JEDEC 65 nm 1.2 V Core Supply Quartus Prime EPCS Configuration Device Motor Control
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