EP4CE15F17C8 - 15,408-Logic-Cell FPGA | Altera
Teilenummer: EP4CE15F17C8 ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
EP4CE15F17C8 Übersicht
A field-programmable gate array is a reconfigurable digital semiconductor. An FPGA belongs to the programmable-logic hierarchy: FPGA → programmable logic device → digital integrated circuit → semiconductor. Combinational logic, registers, block RAM, and programmable I/O are assembled into digital systems that can be reconfigured after manufacture. An FPGA therefore differs from a fixed-function ASIC or microcontroller: the FPGA emphasizes parallel hardware, flexible logic, and programmable interconnect, while a microcontroller executes software through a fixed processor core.
The verified device data identifies 15,408 logic elements, 165 I/O, 516,096 embedded RAM bits, a 1.15 V to 1.25 V supply range, and a 256-LBGA package. The EP4CE15 portion of the ordering code identifies the Cyclone IV E device density, F17 identifies the package configuration, and C8 identifies the speed or ordering variant. Exact memory organization, I/O standards, clock resources, programmable-logic type, maximum frequencies, power consumption, and AC electrical characteristics were not included in the supplied verified data and therefore are not inferred here.
The 165-I/O device can be evaluated for control-plane logic, parallel data acquisition, industrial automation, communications, embedded vision, and test systems. The 256-ball package exposes substantially more physical connections than a small leaded FPGA package, helping support high pin counts while requiring careful ball-grid PCB layout. Actual design suitability depends on the complete pin assignment, supported I/O standards, board power architecture, and timing closure achieved with the selected Altera design tools.
A principal design constraint is that an LBGA package does not accept a through-hole footprint and must be assembled with the correct ball pattern, pad geometry, solder mask, paste stencil, and board-surface finish. Designers must also connect all required power and ground balls, observe the documented sequencing and decoupling requirements, and complete timing analysis rather than relying only on nominal logic-cell count. These package and configuration checks must be verified against the manufacturer datasheet before schematic or PCB release.
This page consolidates the verified EP4CE15F17C8 ordering data, package facts, sourcing links, application fit, and replacement limitations. Unlike a distributor listing that mainly provides availability and price, it distinguishes known engineering facts from unavailable details and avoids presenting unverified timing, memory, power, and pinout data as guaranteed specifications.
Drop-in-Alternativen für EP4CE15F17C8 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP4CE15F17C8 (gleiche Bauform und Footprint) – abweichend in Embedded Memory, Operating Temperature, Package, Process Technology, Core Voltage (VCCINT).
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP4CE15F17C8N
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP4CE15F17C6
✅ Drop-In✓ Auf Lager
$13.4432 / Stück
Datenblatt ansehen →EP4CE15F17I8L
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
EP4CE10F17C8N
✅ Drop-In✓ Auf Lager
$17.95 / Stück
Datenblatt ansehen →EP4CE6F17C9LN
✅ Drop-In✓ Auf Lager
$10.95 / Stück
Datenblatt ansehen →EP4CE15F17C8 Grenzwerte & elektrische Eigenschaften
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Cyclone IV E |
| Logic Elements | 15,408 |
| Embedded Memory | 516,096 bits |
| I/O Count | 165 I/O |
| Versorgungsspannung | 1.15 V to 1.25 V |
| Betriebstemperatur | 0°C to 85°C junction temperature |
| Package Type | 256-LBGA |
| Total Terminals | 256 balls |
| Package Shape | Square |
| Terminal Form | Ball |
| Montageart | Surface mount |
| Packaging | Tray |
| Part Status | Active |
EP4CE15F17C8 square Pinbelegungsleitfaden
Pinbelegung für EP4CE15F17C8 (square-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP4CE15F17C8.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP4CE15F17C8 ist geeignet für 6 Anwendungs: Industrial Automation and Control, Data Acquisition and Signal Processing, Communications and Network Interface, Embedded Vision and Image Prefiltering, Test and Measurement Instrumentation, Aerospace Ground-Support Equipment.
Industrial Automation and Control
The EP4CE15F17C8 fits parallel industrial-control logic where 15,408 logic elements, 165 I/O, and 516,096 bits of embedded memory provide useful capacity for state machines, sequencing, counters, and local protocol coordination. It is placed directly between field-level inputs and actuator-control outputs, with timing and I/O standards selected after checking the board architecture. Its verified 0°C to 85°C junction-temperature range provides a useful initial boundary, but enclosure temperature and self-heating must remain inside that range. The 256-LBGA footprint also demands a multilayer PCB with careful power, ground, and escape-routing planning.
Empfohlen
Data Acquisition and Signal Processing
The EP4CE15F17C8 is suitable for parallel acquisition systems that need deterministic digital logic beside external converters. Its 15,408 logic elements can implement acquisition control, channel sequencing, digital filtering, and data packing, while 516,096 embedded memory bits provide on-chip buffering subject to the verified memory architecture. A practical design interfaces converter data buses to FPGA I/O, captures them under clock control, and transfers blocks to external memory or a communications processor. The supplied evidence does not establish maximum I/O rates, so interface timing must be proved with the actual converters and Quartus timing analysis rather than inferred from the logic-element count.
Empfohlen
Communications and Network Interface
The EP4CE15F17C8 can be evaluated for communications preprocessing, custom protocol engines, test-pattern generation, and link-control functions. Its 165 I/O provide a substantial board interface, while the programmable fabric supports parallel-to-serial transformations, framing logic, buffers, and interface adapters. A practical architecture may use the FPGA alongside an Ethernet controller or transceiver, but actual line rate and I/O-standard compliance must be verified against the complete Cyclone IV specifications. Pin placement also matters: high-speed or noisy interfaces should be separated as far as practical from clock-sensitive fabric and switching supplies to improve timing and signal integrity.
Empfohlen
Embedded Vision and Image Prefiltering
The EP4CE15F17C8 suits vision prefiltering tasks such as line detection, thresholding, pixel buffering, and interface timing where fixed-function processors would be less flexible. The 516,096 bits of embedded memory and 15,408 logic elements allow parallel pipeline stages, while 165 I/O support camera and memory interfaces. A practical system would receive decoded image data, apply registered processing stages, and pass results to a processor or external frame store. Capacity must be checked against frame geometry and pipeline depth, and the supplied information does not establish supported memory widths or maximum image throughput. Timing closure and resource mapping are therefore essential before architecture approval.
Empfohlen
Test and Measurement Instrumentation
The EP4CE15F17C8 can implement deterministic sequencing, pattern generation, status capture, and programmable timing in modular test equipment. Its 15,408 logic elements and 165 I/O can coordinate instruments and route signals, while embedded memory can hold test vectors or results within capacity limits. A practical implementation places the FPGA between a host interface and DUT control logic, then applies stimulus while capturing responses and error flags. The verified data does not include pin standards or maximum pin-toggle performance, so high-speed fixture connections require a separate I/O and timing review. The 256-LBGA assembly must also be supported by inspection and rework processes.
Empfohlen
Aerospace Ground-Support Equipment
The EP4CE15F17C8 may be considered for programmable aerospace ground-support equipment rather than an airborne safety-critical path. Ground equipment can use programmable logic to coordinate telemetry decoding, I/O expansion, fault logging, and maintenance sequences while retaining software update flexibility. The verified operating range is 0°C to 85°C junction temperature, so rugged environmental testing, enclosure design, and supply regulation must maintain that limit. No AEC-Q100 qualification was supplied, and that qualification is not normally required for ground equipment. Functional safety, radiation, long-term supply, and exact I/O requirements must be independently assessed before deployment.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP4CE15F17C8 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP4CE15F17C8N | EP4CE15F17C6 | EP4CE15F17I8L | EP4CE10F17C8 | EP4CE6F17C9LN |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| FPGA Family | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E |
| Ordering Suffix | C8 | C8N | C6 | I8L | C8 on EP4CE10 | C9LN on EP4CE6 |
Wichtigste Unterscheidungsmerkmale
- Verified 15,408-logic-element configuration (vs. EP4CE10F17C8)
- High I/O availability for parallel interfaces (vs. EP4CE6F17C9LN)
- Exact commercial ordering configuration (vs. EP4CE15F17C6)
- Same visible resource envelope in a trailing-N listing (vs. EP4CE15F17C8N)
Designhinweise
The 256-LBGA footprint requires a board layout explicitly matched to Altera's package drawing and pin definitions. Confirm land pattern, pad size, solder-mask opening, stencil apertures, paste volume, and assembly process with the fabricator; do not copy a generic BGA footprint. Escape routing and power distribution should be planned before the first schematic-to-PCB transfer, with multilayer construction generally considered to reduce routing congestion. X-ray inspection capability is important because hidden solder joints cannot be visually checked after reflow.
Use every required core and I/O power ball specified by the official package data, connect grounds through the documented plane or via pattern, and follow the manufacturer's decoupling and power-sequencing requirements. The verified broad core supply range is 1.15 V to 1.25 V, but that range does not define rail tolerances, I/O voltages, current limits, or sequencing. Validate the regulator loop, startup behavior, and simultaneous switching current in the final board. Do not infer decoupling values from this search snippet; obtain them from the Cyclone IV device datasheet.
Map clocks, high-speed interfaces, and sensitive analog-adjacent digital paths before fixing pin locations. Keep clocks on continuous reference planes, use short return paths, avoid unnecessary stubs, and separate noisy switching or external clock circuitry from timing-critical fabric. The verified material confirms 165 I/O but not supported I/O standards or toggle limits, so every external interface must be checked against voltage, slew, drive-strength, and timing constraints in the official datasheet. Post-layout simulation is appropriate for any high-speed bus.
Do not approve a substitution solely because an MPN contains EP4CE15 or F17C8. The supplied snippets do not fully decode C6, C8, I8L, C9LN, or the trailing N field. A valid replacement review must compare device density, memory, I/O map, ball assignments, speed grade, temperature grade, supply voltages, power-up behavior, package drawings, software device support, and lifecycle commitments. If any of those values are absent, use the part only after engineering sign-off against the official documentation.
Compliance-Informationen
The supplied verified snippets do not explicitly establish RoHS, REACH, lead-free, halogen-free, conflict-minerals, or AEC-Q100 status for the exact ordering part number. Obtain a current manufacturer or supplier declaration before procurement.
