EP4CE6U14I7N - 6,272-LUT Cyclone IV E FPGA, 256-LFBGA | Intel
Teilenummer: EP4CE6U14I7N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $7.84 | $7,84 |
| 10 | $7.06 | $70,60 |
| 100 | $6.27 | $627,00 |
| 500 | $5.49 | $2.745,00 |
| 1.000 | $4.7 | $4.700,00 |
EP4CE6U14I7N Übersicht
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic function is defined by a user-supplied configuration bitstream rather than fixed mask-level fabrication. In the system hierarchy, an FPGA sits under programmable logic, which itself is a branch of digital integrated circuits. Unlike an ASIC, an FPGA is fully reprogrammable in the field, allowing iterative development, in-system upgrades, and last-minute design changes. Configurable logic blocks, embedded memory blocks, multiplier blocks, PLLs, and programmable I/O together let one hardware platform implement glue logic, state machines, DSP pipelines, custom peripheral bridges, and even soft processor cores. FPGAs are most useful when interface requirements change frequently, when parallel processing throughput is required, when time-to-market is critical, or when production volume does not yet justify a custom ASIC.
Key features of the EP4CE6U14I7N include 6,272 logic elements for combinational and sequential logic, 276,480 bits of embedded RAM for FIFOs and packet buffers, 179 maximum user I/O pins for parallel external interfacing, a 1.2 V core supply with on-chip voltage regulation, multi-standard I/O support (LVTTL, LVCMOS, SSTL, LVDS, and other common single-ended and differential standards), JTAG-based configuration via the standard IEEE 1149.1 boundary-scan interface, and industrial-grade operating temperature. The 256-LFBGA package enables dense board layouts but requires microvia-compatible PCB stack-ups for fan-out escape routing.
The Cyclone IV E architecture is built on a 60 nm low-power process. Logic elements are organized into logic array blocks with embedded memory bits distributed across M9K memory blocks. The exact number of PLLs, 18x18 multipliers, configuration modes, and supported I/O standards are not provided in the supplied data excerpts and must be confirmed against the manufacturer datasheet before schematic release.
Typical applications include industrial control and factory automation, communications infrastructure, test and measurement equipment, video and image processing pipelines, motor-control interfaces, parallel sensor aggregation, and general-purpose digital prototyping. The 179 I/O count makes the device well suited to custom peripheral bridges and control-logic consolidation that would otherwise require multiple discrete ICs.
When designing with this device, verify the complete power, I/O, configuration, and timing requirements from the manufacturer datasheet. A 256-LFBGA package requires controlled PCB stack-up, microvia or via-in-pad escape design, and thermal analysis; do not infer unsupported architectural details from the short product excerpts.
This page combines verified ordering, package, resource, and distributor information with practical selection guidance, separating confirmed facts from datasheet items that require further documentation.
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Datenblatt ansehen →EP4CE6U14I7N Grenzwerte & elektrische Eigenschaften
| Series | Cyclone IV E |
| Logic Elements | 6,272 |
| Embedded Memory Bits | 276,480 bits |
| Maximum User I/O Pins | 179 |
| Process Technology | 60 nm |
| Core Supply Voltage | 1.2 V |
| Gehäuse | 256-LFBGA (U14 / UBGA-256) |
| Montageart | Surface Mount |
| Speed Grade | I7 |
| Temperature Grade | Industrial (N suffix) |
| Betriebstemperatur | -40C to +100C |
| Lead Free | Yes |
| RoHS-Status | Compliant |
| Configuration Interface | JTAG (IEEE 1149.1) and serial/parallel modes |
| I/O Standards | LVTTL, LVCMOS, SSTL, LVDS (and others per datasheet) |
| Total Memory Bits | 276,480 bits |
| Ordering Code | EP4CE6U14I7N |
EP4CE6U14I7N 256-lfbga (u14 / ubga-256) Pinbelegungsleitfaden
Pinbelegung für EP4CE6U14I7N (256-lfbga (u14 / ubga-256)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP4CE6U14I7N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP4CE6U14I7N ist geeignet für 7 Anwendungs: Industrial Control and Factory Automation, Communications Infrastructure and Protocol Bridging, Test and Measurement Equipment, Video and Image Processing Pipelines, Motor Control Interfaces, Parallel Sensor Aggregation Hubs, General-Purpose Digital Prototyping.
Industrial Control and Factory Automation
The EP4CE6U14I7N fits industrial control applications because of its 6,272 logic elements, 179 user I/O pins, and industrial -40C to +100C temperature rating. The Cyclone IV E fabric can implement deterministic state machines for PLC scan loops, motor-control PWM generators, and multi-axis servo interfaces within a single device. The 276,480 bits of embedded memory hold commutation tables, PID setpoint profiles, and diagnostic logs without external SRAM. The 1.2 V core supply and low-power 60 nm process keep board thermal budgets manageable inside sealed industrial enclosures. Designers typically pair the FPGA with discrete gate drivers, isolated I/O, and an industrial Ethernet PHY for full machine-control integration.
Empfohlen
Communications Infrastructure and Protocol Bridging
The EP4CE6U14I7N is well suited to protocol-bridging and front-panel aggregation in communications equipment. With 179 user I/O and 6,272 LE, the FPGA can simultaneously bridge SPI to I2C, UART to I2S, or parallel bus to LVDS lanes while performing simple packet framing. The 276 Kbits of embedded memory serve as FIFO buffers across clock domains. Multi-standard I/O support (LVTTL, LVCMOS, SSTL, LVDS) lets one device interface directly to legacy TTL logic, modern DDR memory, and high-speed differential links. Industrial temperature rating suits outdoor base-station and remote-terminal installations. For higher-throughput designs, migrating to EP4CE10 or EP4CE15 in the same toolchain preserves the IP investment.
Empfohlen
Test and Measurement Equipment
The EP4CE6U14I7N is a strong fit for test and measurement instruments where reconfigurability and parallelism matter more than raw sequential throughput. The FPGA fabric implements custom timing generators, pattern generators, digital signal processing for FFT-style post-processing, and front-panel display controllers within a single chip. The 276 Kbits of embedded RAM buffer acquired samples before offloading to a host processor, while the 179 user I/O pins support parallel digital acquisition channels. The 1.2 V core simplifies analog/digital power-rail design, and the 60 nm process keeps switching noise low enough not to disturb sensitive analog front-ends. JTAG-based configuration allows field firmware updates without removing the instrument from service.
Empfohlen
Video and Image Processing Pipelines
The EP4CE6U14I7N can serve as the central processing element in low-to-mid-resolution video and image pipelines. The 6,272 logic elements plus on-chip multipliers implement Sobel-edge filters, color-space converters, scaling engines, and simple histogram equalizers at standard-definition or low-HD frame rates. The 179 user I/O accommodates parallel digital video buses such as BT.656, BT.1120, or RGB888 alongside camera control I2C and GPIO. The 276 Kbits of embedded memory store line buffers and lookup tables needed for spatial-domain filters. The industrial temperature range supports machine-vision installations on factory floors, and the low-power 60 nm process enables fanless embedded designs.
Empfohlen
Motor Control Interfaces
The EP4CE6U14I7N is well matched to multi-axis motor-control boards where deterministic PWM generation, encoder decoding, and field-oriented control loops are required. The 6,272 logic elements can host SVPWM modulators for three-phase inverters, quadrature-decoder channels for several encoders, and SPI/UART management for driver ICs. The 179 user I/O allow simultaneous connection to gate-driver fault lines, brake control, current-sense ADCs, and Hall/encoder inputs. Industrial -40C to +100C operation suits under-hood or cabinet-mounted drives. The 1.2 V core plus 60 nm low-power process help meet stringent industrial EMC and thermal budgets alongside the power stage.
Empfohlen
Parallel Sensor Aggregation Hubs
The EP4CE6U14I7N can aggregate multiple parallel sensor streams into a single high-speed uplink in industrial sensing hubs. Its 179 user I/O accommodate dozens of digital sensors, encoders, or button/keypad matrices without external muxing. The 276 Kbits of embedded memory debounce, deburst, and buffer sensor events before they cross to the host processor. Multi-standard I/O (LVTTL, LVCMOS, LVDS) means one device interfaces both 3.3 V CMOS sensor banks and 5 V tolerant legacy signals. The industrial temperature grade supports outdoor or factory-floor sensor nodes. A Quartus reference design can implement a custom I2C/SPI-to-USB bridge in the same fabric.
Empfohlen
General-Purpose Digital Prototyping
The EP4CE6U14I7N is a popular prototyping target for digital design teams. With 6,272 logic elements, 276 Kbits of memory, 179 user I/O, and a mature Quartus toolchain, designers can implement everything from soft-core CPUs (Nios II) to custom peripheral IP and verify it on hardware before ASIC respin. The 256-LFBGA package exposes nearly every Cyclone IV E I/O standard for breadboard-friendly evaluation boards. The 1.2 V core and low-power process simplify regulator design on the dev board. Industrial temperature rating means the same prototype can move from lab to pilot production without redesign. Multiple same-footprint speed/temperature variants simplify last-minute part substitution during prototyping.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP4CE6U14I7N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP4CE6U14C7N | EP4CE6U14A7N |
|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-LFBGA (U14) | 256-LFBGA (U14) - same | 256-LFBGA (U14) - same |
| Logic Elements | 6,272 | 6,272 (same) | 6,272 (same) |
| Embedded Memory (bits) | 276,480 | 276,480 (same) | 276,480 (same) |
| Maximum User I/O | 179 | 179 (same) | 179 (same) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | I7 (industrial) | C7 (commercial) | A7 (automotive) |
| Temperature Grade | -40C to +100C (industrial) | 0C to +85C (commercial) | -40C to +125C (automotive) |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature grade in the same U14 ball-out (vs. EP4CE6U14C7N)
- Mid-tier speed grade (I7) for balanced timing margin (vs. EP4CE6U14A7N)
- Mature Quartus toolchain with broad IP ecosystem (vs. Cross-brand SRAM FPGAs (e.g. Xilinx Spartan-6))
Designhinweise
The 256-LFBGA package uses a 1.0 mm ball pitch and requires laser-drilled microvias or via-in-pad escape technology. Use at least a 6-layer PCB stack-up with dedicated ground and power planes directly beneath the BGA. Fan-out escape routing on the top layer plus buried microvias keeps signal lengths short; a 4-layer stack-up is generally insufficient for 256-BGA fan-out. Match trace impedance to 50 ohm single-ended / 100 ohm differential for high-speed I/O such as LVDS. Estimated: for a 16x16 BGA with 1.0 mm pitch, the first-row fan-out typically requires 0.10-0.15 mm trace/space on the top microvia layer.
The Cyclone IV E core runs at 1.2 V and requires a low-noise LDO or DC-DC regulator with at least 500 mA peak capability. Decouple VCCINT (core) with one 100 uF bulk + four 4.7 uF ceramic per supply pin group; place 0.1 uF and 1 nF decoupling within 2 mm of each power pin. Provide separate analog supply (VCCA) and digital supply (VCCD_PLL) rails for the PLLs; a ferrite bead or filter between VCCA and VCCD_PLL reduces PLL jitter. Use the Intel PowerPlay early power estimator in Quartus before layout to size the regulators correctly.
Route all global clock inputs through dedicated CLK pins with impedance-controlled differential pairs (LVDS) or matched-length single-ended nets. Keep the JTAG chain (TCK/TMS/TDO/TDI) free of stubs and series resistors within 25 mm of the FPGA. Group related I/O standards in adjacent banks; the VCCIO of each bank must match the I/O standard voltage of all signals in that bank. Leave at least one full bank free for future I/O expansion. Tie unused I/O pins to a defined logic level (High or Low) per datasheet recommendations; do not leave them floating.
Do not connect the 1.2 V core to a 1.8 V supply - this will permanently damage the device. Verify that all VCCIO bank voltages are enabled in the correct sequence during power-up (typically 3.3 V before 1.2 V, then 2.5 V); out-of-order sequencing can latch-up the device. Always include external resistors on JTAG TCK, TMS, and TDI to limit in-rush current and protect against ESD during board bring-up. Estimated: at 256 balls with 1.0 mm pitch, hand-rework and BGA reballing are impractical; design for factory-only rework.
Compliance-Informationen
RoHS and lead-free confirmed by Altera/Intel product page and distributor listings. AEC-Q100 qualification is NOT present on the I7 industrial OPN - use EP4CE6U14A7N for automotive applications.
