EP4CGX150DF31C7N - Cyclone IV GX FPGA 149K LE | Intel FPGA
Teilenummer: EP4CGX150DF31C7N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $258.35 | $258,35 |
| 10 | $248.2 | $2.482,00 |
| 100 | $232.5 | $23.250,00 |
| 500 | $215.8 | $107.900,00 |
| 1.000 | $198.45 | $198.450,00 |
EP4CGX150DF31C7N Übersicht
A field-programmable gate array (FPGA) is a semiconductor device whose logic function is defined by the customer after manufacture, allowing the same silicon to implement custom digital signal processing, glue logic, bus bridging, or parallel processing pipelines. FPGAs sit in the programmable logic device (PLD) taxonomy alongside CPLDs, occupying the high-density, high-I/O, and high-throughput tier. Cyclone IV GX extends this category by integrating multi-gigabit transceivers (MGTs) on-chip, eliminating the need for external PHY devices in many protocol interfaces such as PCIe Gen1, Gigabit Ethernet, Serial RapidIO, and CPRI.
Key features of the EP4CGX150DF31C7N include up to 8 transceiver channels running at data rates between 600 Mbps and 3.125 Gbps, dedicated 18 x 18 hardware multipliers for DSP, up to 6 PLLs with 5 output taps each, support for external memory interfaces such as DDR2, DDR, QDRII, and RLDRAM II, and a 9.4 Mbit total embedded memory block. The C7 speed grade corresponds to a -7 (faster) commercial temperature grade, and the F31 package code identifies the 31 mm square 896-ball FineLine BGA.
The architecture combines four-input look-up tables (LUTs), embedded memory blocks, DSP blocks, and distributed routing, all controlled by SRAM-based configuration memory loaded at power-up from an external flash or via JTAG. Cyclone IV GX is optimized for low static and dynamic power, making it suitable for fanless and thermally constrained embedded systems. Transceivers are hardened with physical coding sublayer (PCS) and physical medium attachment (PMA) blocks to simplify protocol implementation.
Typical applications include industrial machine vision and video processing, motor control and factory automation, wireless remote radio units (RRUs), PCI Express endpoint cards, broadcast video encoders, and portable medical imaging. The combination of transceivers, DSP blocks, and abundant I/O suits designs that need parallel processing and high-speed serial I/O on a single chip.
Designers should plan power sequencing carefully because Cyclone IV GX requires multiple supply rails (1.2 V core, 2.5 V/3.3 V I/O, 1.2 V transceiver analog, 1.2 V transceiver digital). Decoupling must follow Intel's reference design with bulk and ceramic capacitors placed adjacent to each supply pin, and the 896-ball BGA requires multilayer PCB with microvia or via-in-pad technology for reliable assembly.
This page combines distributor pricing, verified parametric data, and same-family drop-in alternatives to help engineers select the right Cyclone IV GX variant without spending hours on datasheet cross-checking.
Drop-in-Alternativen für EP4CGX150DF31C7N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP4CGX150DF31C7N (gleiche Bauform und Footprint) – abweichend in Package, Speed Grade, Operating Temperature, RoHS Status, PLLs.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP4CGX150DF31C7
✅ Drop-In✓ Auf Lager
$218.4 / Stück
Datenblatt ansehen →EP4CGX150DF31I7N
✅ Drop-In✓ Auf Lager
$285 / Stück
Datenblatt ansehen →EP4CGX150DF31C7N Grenzwerte & elektrische Eigenschaften
| Series | Cyclone IV GX |
| Device Logic Elements | 149,760 |
| Total Memory Bits | 6,635,520 bit |
| Number of LABs/CLBs | 9,360 |
| Number of Logic Cells | 149,760 |
| Maximum User I/O | 475 |
| Supply Voltage Core | 1.2 V |
| Process Technology | 60 nm |
| Number of Transceivers | 8 (600 Mbps to 3.125 Gbps) |
| Embedded Multipliers | 18 x 18 hardware multipliers |
| Total RAM Bits | 6,635,520 bit (720 Kbit distributed + block RAM) |
| Number of PLLs | Up to 6 (5 outputs each) |
| Betriebstemperatur | 0C to +85C (Commercial, C7 speed grade) |
| Gehäuse | 896-FBGA (FineLine BGA), 31 mm, F31 |
| Montageart | Surface Mount |
| Configuration | SRAM-based, JTAG/Active Serial/Active Parallel |
| Speed Grade | 7 (C7, commercial) |
| RoHS-Status | Compliant |
EP4CGX150DF31C7N 896-fbga (fineline bga), 31 mm, f31 Pinbelegungsleitfaden
Pinbelegung für EP4CGX150DF31C7N (896-fbga (fineline bga), 31 mm, f31-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP4CGX150DF31C7N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP4CGX150DF31C7N ist geeignet für 6 Anwendungs: Industrial Machine Vision & Video Processing, Wireless Remote Radio Unit (RRU) Baseband, PCI Express Endpoint Card, Industrial Motor Control & Servo Drive, Broadcast Video Encoder / Decoder, Portable Medical Imaging.
Industrial Machine Vision & Video Processing
The EP4CGX150DF31C7N is a strong fit for industrial machine-vision pipelines that need to ingest multi-megapixel camera data and run pixel-level preprocessing in real time. With 149,760 logic elements and 6,635,520 embedded memory bits, the FPGA can host Bayer-to-RGB demosaicing, gamma correction, and Sobel edge-detection pipelines at line rates exceeding 100 MHz, while the 8 transceivers up to 3.125 Gbps cleanly carry CoaXPress or GigE Vision serialized streams from camera modules without external PHYs. Compared with a CPU/DSP approach, the FPGA delivers deterministic latency (sub-microsecond jitter) and parallel throughput that scales with pipeline width, making inspection systems more accurate and capable of higher part-per-minute throughput.
Empfohlen
Wireless Remote Radio Unit (RRU) Baseband
Cyclone IV GX is widely deployed in small-cell and Remote Radio Head front-haul designs, and the EP4CGX150DF31C7N is well-suited to this role. Its 8 transceivers up to 3.125 Gbps natively support CPRI and OBSAI fronthaul links to a baseband unit, while 18x18 hardware multipliers perform digital up/down-conversion, crest-factor reduction, and digital predistortion (DPD) on the RF chain. The 1.2 V core and 60 nm process keep static and dynamic power low enough to allow fanless outdoor enclosures, and the industrial-grade -I7N speed bin (pin-compatible drop-in) extends the same design into -40C to +100C environments. Compared with ASSP baseband chips, this FPGA offers reprogrammable DPD coefficients and rapid adoption of evolving 3GPP releases.
Empfohlen
PCI Express Endpoint Card
The EP4CGX150DF31C7N implements PCI Express Gen1 endpoint designs (x1, x2, or x4 lanes) using its integrated transceivers and PCIe hard IP, eliminating the need for an external PHY. With 149K logic elements, designers can implement custom DMA engines, scatter-gather controllers, and protocol-aware accelerators on the same die, and the 896-ball F31 BGA supports the additional high-speed transceiver lanes plus up to 475 user I/O for board-level interconnects. Compared with a discrete PHY plus CPLD design, the integrated PCIe hard IP saves board space, reduces BOM, and lowers latency. Quartus Prime provides pre-verified PCIe reference designs to accelerate tape-out.
Empfohlen
Industrial Motor Control & Servo Drive
The EP4CGX150DF31C7N is an excellent host for field-oriented control (FOC) loops in industrial servo drives and frequency inverters. Its 18x18 hardware multipliers run a complete FOC inner current loop at sub-microsecond cycle times, while the abundant logic elements and block RAM hold encoder interfaces, resolver-to-digital conversion, and SVPWM modulators. The 8 integrated transceivers carry EtherCAT or SERCOS III industrial Ethernet from the same FPGA, removing the need for an external communications controller. Compared with a microcontroller + DSP combo, the FPGA delivers deterministic multi-axis synchronization and accelerates fault-detection algorithms.
Empfohlen
Broadcast Video Encoder / Decoder
The EP4CGX150DF31C7N powers broadcast-grade video processing equipment such as SDI/HD-SDI routers, video encoders, and frame synchronizers. Cyclone IV GX transceivers drive SMPTE SDI serial digital interface links up to 3 Gbps, while the FPGA fabric implements ancillary data insertion, audio embedding/de-embedding, and format conversion (e.g., 1080i to 720p). With 6,635,520 embedded memory bits, the device supports multi-line buffering required for time-base correction, and the 475 user I/O accommodate parallel video buses, GPIO, and front-panel interfaces. The BGA package also provides excellent signal-integrity performance for high-speed serial video links.
Empfohlen
Portable Medical Imaging
The EP4CGX150DF31C7N serves portable ultrasound and medical imaging carts that need high DSP throughput at low power. The 18x18 hardware multipliers accelerate beamforming and FIR filtering on ultrasound RF data, while the 149K logic elements run image-processing kernels such as B-mode, color Doppler, and harmonic imaging in real time. The 60 nm process and 1.2 V core minimize power consumption to allow battery-powered carts, and the integrated transceivers carry high-speed LVDS links to analog-front-end ADCs. For designs requiring extended temperature operation (e.g., ambulance imaging), the industrial-grade EP4CGX150DF31I7N variant is a pin-compatible drop-in.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP4CGX150DF31C7N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP4CGX150DF31C7 | EP4CGX150DF31I7N | EP4CGX150CF23C7N |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 896-FBGA (F31, 31 mm) | 896-FBGA (F31, 31 mm) - same | 896-FBGA (F31, 31 mm) - same | 484-FBGA (F23, 23 mm) - smaller |
| Logic Elements | 149,760 | 149,760 | 149,760 | 149,760 |
| Embedded Memory | 6,635,520 bit | 6,635,520 bit | 6,635,520 bit | 6,635,520 bit |
| Transceivers | 8 ch up to 3.125 Gbps | 8 ch up to 3.125 Gbps | 8 ch up to 3.125 Gbps | 8 ch up to 3.125 Gbps |
| Maximum User I/O | 475 | 475 | 475 | 270 (F23 reduced) |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Speed Grade | -7 (C7) | -7 | -7 | -7 |
| Unit Price (qty 1) | $258.35 | Lower (tray packaging) | Higher (industrial) | Comparable |
Wichtigste Unterscheidungsmerkmale
- Industrial temperature grade option in same F31 footprint (vs. EP4CGX150CF23C7N)
- Maximum I/O density in 31 mm BGA (vs. EP4CGX110DF31C7N)
- Full transceiver count vs reduced-pin variants (vs. EP4CGX150CF23C7N)
Designhinweise
Estimated: at typical junction temperature 85C with all 8 transceivers active and 50% logic utilization, core current draw is approximately 1.5 to 2.0 A at 1.2 V, giving core power near 2 W. Designers must provide separate, well-decoupled rails for VCCINT (1.2 V core), VCCA (2.5 V transceiver analog), VCCD_PLL (1.2 V PLL digital), and VCCIO (1.2/1.5/1.8/2.5/3.3 V I/O) per the Cyclone IV GX Hardware Reference. Use bulk 470 uF plus 10 uF plus 100 nF capacitors placed adjacent to each power pin to control switching noise and meet Intel's PDN impedance targets.
The 896-ball F31 FineLine BGA has 1.0 mm ball pitch, which requires a multilayer PCB (8 or more layers recommended) with microvia or via-in-pad technology for reliable assembly. Maintain matched impedance (100 ohm differential for transceiver channels, 50 ohm single-ended for general I/O) on all high-speed serial traces, and follow Intel's Cyclone IV GX board design guidelines for via count and stack-up. Ground return paths under high-speed traces must remain unbroken across plane splits to avoid signal-integrity degradation.
The 896-ball F31 BGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 8 to 12 C/W with adequate PCB copper. At 2 W core power plus transceiver power, junction temperature rise remains within 25 C above ambient, so a heatsink is normally unnecessary. Designers should include thermal vias under the central BGA region for heat extraction to inner ground planes and consider forced airflow if the FPGA sits adjacent to high-power components.
Do not skip the configuration mode selection pins (MSEL0/1/2) - they must be tied to VCCIO or GND to select Active Serial, Active Parallel, Passive Serial, or JTAG configuration. Forgetting this causes the FPGA to fail to configure at power-up. Always include a JTAG header for factory programming and boundary-scan testing, and ensure the configuration flash memory (such as EPCQ) is sized for at least 2x the FPGA bitstream to allow for dual-boot redundancy.
Compliance-Informationen
RoHS and REACH compliant per Intel/Altera product declarations. The Cyclone IV GX family is not AEC-Q100 qualified because FPGAs are not typically deployed as automotive-grade discrete ICs in safety-critical systems; for automotive applications, use AEC-Q100-qualified companion parts or Cyclone V with Q-grade certification.
