EP4CGX22BF14C8N - Cyclone IV GX FPGA, 22K LE, 169-LBGA | Intel
Teilenummer: EP4CGX22BF14C8N ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.9 | $2.890,00 |
| 500 | $24.1 | $12.050,00 |
| 1.000 | $19.75 | $19.750,00 |
EP4CGX22BF14C8N Übersicht
A Field-Programmable Gate Array (FPGA) is a semiconductor device containing programmable logic blocks, interconnect, and I/O that designers can reconfigure after manufacture, used for glue logic, prototyping, and low-volume ASIC replacement. Cyclone IV GX sits in the FPGA family hierarchy: Cyclone IV GX -> Cyclone IV -> Cyclone family -> low-power FPGA -> programmable logic device -> semiconductor. The 'GX' suffix denotes integrated multi-gigabit transceivers, distinguishing it from the logic-only Cyclone IV E and positioning it for protocol bridging and chip-to-chip serial links.
Key features include 21,280 logic elements, 594 Kbits of embedded RAM (M9K blocks), 72 18x18 multipliers supporting DSP up to 260 MHz, two PLLs, and up to 83 user I/O pins. The integrated transceiver block supports PCIe Gen1 hard IP plus 3.125 Gbps serial links, enabling protocol bridging, I/O expansion, and chip-to-chip interfacing without external PHY ICs. The LBGA-169 footprint provides compact board integration for high-volume products.
The architecture is built on a 60 nm process node with a 1.2 V core supply. Its low-power positioning makes it attractive for high-volume, cost-sensitive products that still require programmable logic and serial connectivity. The device supports commercial temperature grades per the 'C' speed-grade suffix, with industrial variants distinguished by an 'I' suffix in the OPN.
Typical applications include industrial control, broadcast video bridging, low-cost PCIe endpoint cards, USB 3.0 / SATA sideband logic, motor control, and automotive infotainment pre-processing. The combination of integrated transceivers, embedded memory, and DSP blocks makes the EP4CGX22 a versatile glue-logic and protocol-conversion engine.
A critical design consideration is power-rail sequencing: the Cyclone IV GX requires well-regulated 1.2 V core, 2.5 V analog PLL, and 3.3 V I/O supplies with specific ramp-order requirements. Designers must follow Intel's reference schematics and the Quartus Prime pin-planner to avoid configuration failures. JTAG configuration via USB-Blauether-B is the typical debug path.
This page synthesizes distributor pricing, same-package Cyclone IV GX variants, and practical design notes not found in the manufacturer datasheet alone, helping engineers shorten the selection cycle for volume FPGAs in the Cyclone IV family.
Drop-in-Alternativen für EP4CGX22BF14C8N – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP4CGX22BF14C8N (gleiche Bauform und Footprint) – abweichend in Package, Operating Temperature, Speed Grade, Transceivers, Embedded Memory.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP4CGX22BF14C7N
✅ Drop-In✓ Auf Lager
$39.48 / Stück
Datenblatt ansehen →EP4CGX22BF14I7N
✅ Drop-In✓ Auf Lager
$45.9 / Stück
Datenblatt ansehen →EP4CGX22BF14C6N
✅ Drop-In✓ Auf Lager
$42.14 / Stück
Datenblatt ansehen →EP4CGX22BF14I8N
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$25.1 / Stück
Datenblatt ansehen →EP4CGX15BF14C8N
✅ Drop-In✓ Auf Lager
$18.5 / Stück
Datenblatt ansehen →EP4CGX15BF14C7N
✅ Drop-In✓ Auf Lager
$20.85 / Stück
Datenblatt ansehen →EP4CGX22BF14C8N Grenzwerte & elektrische Eigenschaften
| Family | Cyclone IV GX |
| Device Logic Elements | 21,280 |
| Logic Array Blocks (LABs) | 1330 |
| Embedded Memory | 774144 bit (594 Kbit M9K) |
| Embedded 18x18 Multipliers | 72 |
| User I/O Pins (Maximum) | 83 |
| Transceiver Count | 2 (3.125 Gbps) |
| Process Node | 60 nm |
| Core Supply Voltage | 1.2 V |
| PLL Count | 2 |
| Gehäuse | 169-ball LBGA (FBGA-169, F14, 14x14 mm) |
| Montageart | Surface Mount |
| Speed Grade | C8 (commercial, 8) |
| Betriebstemperatur | 0C to +85C |
| RoHS-Status | Compliant |
| MSL-Level | 3 (168 hours) |
| Configuration Interface | JTAG / AS / PS |
EP4CGX22BF14C8N 169-ball lbga (fbga-169, f14, 14x14 mm) Pinbelegungsleitfaden
Pinbelegung für EP4CGX22BF14C8N (169-ball lbga (fbga-169, f14, 14x14 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP4CGX22BF14C8N.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP4CGX22BF14C8N ist geeignet für 7 Anwendungs: Low-Cost PCIe Gen1 Endpoint Card, Industrial Control and Motor Drive, Broadcast Video Bridging and Conversion, USB 3.0 / SATA Sideband Logic, Automotive Infotainment Pre-Processing, Software-Defined Radio Front-End, Networking Switch Glue Logic.
Low-Cost PCIe Gen1 Endpoint Card
The EP4CGX22BF14C8N's integrated PCIe Gen1 hard block and 3.125 Gbps transceivers make it ideal for low-cost PCIe x1 endpoint cards used in industrial I/O expansion, data acquisition, and protocol bridging. With 21,280 logic elements and 72 18x18 multipliers, the device can implement endpoint state machines plus custom logic for register-level access. Compared to a discrete FPGA + external PHY approach, the integrated PCIe hard IP reduces BOM cost by approximately USD 5-10 per board and eliminates PHY/FPGQA bring-up risk.
Empfohlen
Industrial Control and Motor Drive
The EP4CGX22BF14C8N's 72 DSP blocks supporting 18x18 multipliers at up to 260 MHz make it suitable for industrial motor-control loops, PID controllers, and field-oriented control (FOC) algorithms. The 774 Kbit embedded RAM buffers sensor data and control-loop state. Operating from 0C to +85C with industrial-grade EMI tolerance, the device handles factory-floor environments. For harsher -40C to +100C environments, choose the EP4CGX22BF14I8N (industrial-temp variant) on the same footprint.
Empfohlen
Broadcast Video Bridging and Conversion
The EP4CGX22BF14C8N's combination of 21,280 logic elements, 774 Kbit embedded RAM, and 3.125 Gbps transceivers makes it well-suited for broadcast video bridging - converting SDI, HDMI, DisplayPort, or MIPI signals between formats and resolutions. The 2 transceivers enable 3G-SDI input/output without external PHYs, and the embedded M9K memory blocks buffer active video lines. Designers can implement color-space conversion, scaling, and frame-rate conversion entirely in FPGA fabric.
Empfohlen
USB 3.0 / SATA Sideband Logic
The EP4CGX22BF14C8N serves as cost-effective sideband logic for USB 3.0 and SATA implementations, handling PHY control, link-state management, and protocol multiplexing alongside a discrete USB/SATA controller. Its 3.125 Gbps transceivers can implement low-overhead serializer/deserializer functions, while the 21,280 logic elements handle state machines and DMA engines. Compared to ASIC solutions, the FPGA offers reprogrammability to fix bugs late in the design cycle.
Empfohlen
Automotive Infotainment Pre-Processing
The EP4CGX22BF14C8N's 60 nm low-power process and 1.2 V core supply make it appropriate for automotive head-unit pre-processing, including LVDS-to-MIPI bridging, touch-panel multiplexing, and camera aggregation. With 21,280 logic elements, designers can implement multiple display pipelines plus camera serializers. For AEC-Q100 automotive qualification, contact Intel about Cyclone IV GX auto-grade SKUs which share the same F14 LBGA-169 footprint for direct migration.
Empfohlen
Software-Defined Radio Front-End
The EP4CGX22BF14C8N's 72 DSP blocks and 774 Kbit embedded RAM support narrowband software-defined radio front-ends up to ~70 MHz bandwidth, implementing digital down-conversion, filtering, and demodulation in FPGA fabric. Its 3.125 Gbps transceivers enable digital IF sampling, while the 60 nm low-power design suits portable SDR platforms. For wider bandwidths, migrate to Cyclone V GT, but the EP4CGX22 remains a strong value choice for narrowband commercial SDR.
Empfohlen
Networking Switch Glue Logic
The EP4CGX22BF14C8N functions as flexible glue logic between networking switch ASICs, PHYs, and CPUs in small business / industrial routers. With 2 transceivers, it can serialize/deserialize up to 3.125 Gbps links (SGMII, QSGMII) while the 21,280 logic elements implement management-plane functions, packet buffering, and LED control. The LBGA-169 footprint allows compact designs that integrate easily alongside switch ASICs on the same PCB.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP4CGX22BF14C8N – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP4CGX22BF14C7N | EP4CGX22BF14I7N | EP4CGX22BF14C6N | EP4CGX15BF14C8N | EP4CGX15BF14C7N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 169-LBGA (F14) | 169-LBGA (F14) - same | 169-LBGA (F14) - same | 169-LBGA (F14) - same | 169-LBGA (F14) - same | 169-LBGA (F14) - same |
| Logic Elements | 21,280 | 21,280 (same) | 21,280 (same) | 21,280 (same) | 14,400 (-32%) | 14,400 (-32%) |
| Speed Grade | C8 | C7 (slower) | I7 (industrial) | C6 (slower) | C8 (same) | C7 (slower) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Embedded Memory | 774 Kbit | 774 Kbit (same) | 774 Kbit (same) | 774 Kbit (same) | 540 Kbit (-30%) | 540 Kbit (-30%) |
| 18x18 Multipliers | 72 | 72 (same) | 72 (same) | 72 (same) | 45 (-37%) | 45 (-37%) |
| Transceivers | 2 x 3.125 Gbps | 2 x 3.125 Gbps (same) | 2 x 3.125 Gbps (same) | 2 x 3.125 Gbps (same) | 2 x 3.125 Gbps (same) | 2 x 3.125 Gbps (same) |
Wichtigste Unterscheidungsmerkmale
- C8 speed grade is fastest in F14 LBGA-169 footprint (vs. EP4CGX22BF14C7N)
- Commercial temperature grade with full logic resources (vs. EP4CGX15BF14C8N)
- 21,280 logic elements vs 14,400 in EP4CGX15 (vs. EP4CGX15BF14C8N)
Designhinweise
The Cyclone IV GX EP4CGX22 requires four separate power rails: 1.2 V core (VCCINT), 2.5 V analog PLL (VCCA), 3.3 V I/O (VCCIO), and a separate VCC_PLL power pin per PLL block. Per Intel's reference schematics, ramp all rails within 100 ms of each other to avoid configuration failures. Estimated: at 50% toggle probability and 100 MHz, the 1.2 V core draws approximately 300-500 mA typical. Add at least 22 uF decoupling per rail at the device pin plus 0.1 uF/0.01 uF high-frequency bypass caps.
The F14 LBGA-169 package uses 1.0 mm ball pitch on a 14x14 mm body, requiring 4-6 layer PCB with microvia HDI technology for breakout. Per Intel layout guidelines, route all 169 signals on the top layer with via-in-pad for inner balls; provide a continuous ground plane on layer 2 and a 1.2 V power plane on layer 3. Differential transceiver pairs (3.125 Gbps) require 100 ohm controlled impedance with matched length tuning within 5 mil. Estimated: total via-in-pad cost adds approximately USD 0.50 per board vs through-hole.
Do not power up Cyclone IV GX without first ensuring MSEL[3:0] pins are set correctly for the desired configuration mode (AS/PS/JTAG). Floating MSEL pins cause configuration failures. Also verify CONF_DONE and nSTATUS signals are pulled up to 3.3 V via 10 kohm resistors - missing pull-ups cause Quartus Prime programmer to fail detection. When using transceivers, terminate REFCLK inputs with proper 50 ohm impedance matching to the clock source.
Estimated: at full DSP utilization (72 multipliers at 260 MHz) with 1.2 V/3.3 V rails, the EP4CGX22BF14C8N dissipates approximately 1.5-2.0 W typical. The LBGA-169 package has theta_JA of approximately 20-25 C/W with proper PCB thermal vias, meaning a 30 C junction rise above 25 C ambient is typical. For enclosed chassis above 60 C ambient, add thermal vias under the central die and consider forced airflow. Industrial variants have higher temp range but identical thermal envelope.
Place the configuration flash (EPCS16 or EPCS64) within 100 mil of the FPGA's nCSO/DATA/ASDO pins to minimize routing parasitics on the Active Serial (AS) configuration interface. JTAG chain ordering: TMS, TDI, TDO must form a single daisy chain - use a 10 kohm pull-up on TCK and TDI to 3.3 V. Per Intel layout guidelines, separate analog PLL power (VCCA_PLL) from digital supplies with a ferrite bead to reduce jitter; expect 3-5 ps RMS jitter improvement with proper isolation.
Compliance-Informationen
RoHS and REACH compliant per Intel/Altera product page. Not AEC-Q100 qualified; contact Intel about automotive-grade variants. Halogen-free status not specified in the provided data.
